Ethylene

Ethylene

SCHEMBL933388

C=C.CCCCCCCCCCCCCCCCC(O)(O)C(N)=O

nearest known ligand 0.50

Full drug profile on Sugi Atlas →

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
FDPS P14324 9/20 0.44
GGPS1 O95749 5/20 0.44
SMPD1 P17405 2/20 0.42
CES2 O00748 1/20 0.42
SCN5A Q14524 2/20 0.42
SCN9A Q15858 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5575257 0.96 FDPS (0.47) FDPSGGPS1SMPD1CES2SCN5A
SCHEMBL5575514 0.96 FDPS (0.47) FDPSGGPS1SMPD1CES2SCN5A
SCHEMBL2810471 0.96 FDPS (0.47) FDPSGGPS1SMPD1CES2SCN5A
SCHEMBL8016903 0.96 FDPS (0.47) FDPSGGPS1SMPD1CES2SCN5A
SCHEMBL7880146 0.94 FDPS (0.45) FDPSGGPS1SMPD1CES2
Octadecanoic Acid Amide SCHEMBL28078346 0.93 SOAT1 (0.50) FDPSGGPS1SMPD1CES2
Cyclohexane SCHEMBL1967354 0.90 FDPS (0.42) FDPSGGPS1SMPD1CES2SCN5A
SCHEMBL9860581 0.88 DNM1 (0.50) FDPSSMPD1
SCHEMBL9282122 0.87 FDPS (0.41) FDPSGGPS1CES2SCN5ASCN9A
SCHEMBL7190941 0.85 FAAH (0.59)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 558 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114378476-B solder paste 千住金属工业株式会社 2023-08-29 CN claimed
CN-114378476-A Solder paste 千住金属工业株式会社 2022-04-22 CN claimed
US-11299622-B2 Polylactic acid resin composition and polylactic acid resin molded article BIOWORKS CORPORATION (JP) 2022-04-12 US claimed
CN-108463583-B Polylactic acid resin fiber, polylactic acid long fiber, polylactic acid short fiber, and polylactic acid fiber 生物工程公司 2020-10-23 CN claimed
EP-3388475-A1 POLYLACTIC ACID RESIN COMPOSITION AND POLYLACTIC ACID RESIN MOLDED ARTICLE Bioworks Corporation (JP) 2018-10-17 EP claimed
US-20180291196-A1 POLYLACTIC ACID RESIN COMPOSITION AND POLYLACTIC ACID RESIN MOLDED ARTICLE BIOWORKS CORPORATION (JP) 2018-10-11 US claimed
US-9914565-B2 Synthetic closure VINVENTIONS USA, LLC (US) 2018-03-13 US claimed
EP-2396238-B1 SYNTHETIC CLOSURE NOMACORC LLC (US) 2015-04-01 EP claimed
EP-2840040-A1 Synthetic closure Nomacorc LLC (US) 2015-02-25 EP claimed
WO-2010092046-A1 SYNTHETIC CLOSURE NOMACORC LLC (US) 2010-08-19 WO claimed
US-20100200606-A1 Synthetic closure VINVENTIONS SA (BE) 2010-08-12 US claimed
US-6846864-B2 Composition and article for reduced food adhesion GENERAL ELECTRIC COMPANY (US) 2005-01-25 US claimed
US-20020177639-A1 Composition and article for reduced food adhesion SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2002-11-28 US claimed
US-6437031-B1 Compositions for reduced food adhesion GENERAL ELECTRIC COMPANY 2002-08-20 US claimed
US-6228915-B1 COMPOSITION CONTAINING POLYETHERIMIDE AND FATTY AMIDE GENERAL ELECTRIC COMPANY 2001-05-08 US claimed
US-5607501-A Hot melt ink utilizable for ink jet printer BROTHER KOGYO KABUSHIKI KAISHA (JP) 1997-03-04 US claimed
US-20240238915-A1 LEAD-FREE SOLDER PASTE NIHON SUPERIOR CO., LTD. (JP) 2024-07-18 US disclosed
WO-2024150713-A1 MULTILAYER FILM FOR BIPOLAR LITHIUM ION BATTERIES 大日本印刷株式会社 2024-07-18 WO disclosed
US-5965484-A Reversible heat-sensitive recording medium HITACHI MAXELL, LTD. (JP) 1999-10-12 US disclosed
US-5607501-A Hot melt ink utilizable for ink jet printer BROTHER KOGYO KABUSHIKI KAISHA (JP) 1997-03-04 US disclosed