SCHEMBL9495495

SCHEMBL9495495

O=C(C1=Cc2ccccc21)c1cccc(C(=O)C2=Cc3ccccc32)c1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ATM Q13315 1/20 0.52
TDP1 Q9NUW8 1/20 0.52
L3MBTL1 Q9Y468 1/20 0.52
PBRM1 Q86U86 1/20 0.40
ALDH1A1 P00352 2/20 0.38
PTPRC P08575 1/20 0.36
HSD17B1 P14061 1/20 0.36
HSD17B2 P37059 1/20 0.36
MAPT P10636 2/20 0.35
PTGS1 P23219 2/20 0.35
CXCR1 P25024 2/20 0.35
CXCR2 P25025 2/20 0.35
PTGS2 P35354 2/20 0.35
SMN1; SMN2 Q16637 2/20 0.35
RECQL P46063 1/20 0.35
POLB P06746 1/20 0.35
KDM4E B2RXH2 1/20 0.35
LMNA P02545 1/20 0.35
CYP3A4 P08684 1/20 0.35
HPGD P15428 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9320128 0.83 MAOA (0.38) TDP1L3MBTL1ALDH1A1PTPRCMAPT
SCHEMBL503745 0.73 MAOA (0.50) TDP1L3MBTL1ALDH1A1PTPRCPOLB
SCHEMBL30895284 0.73 MAOA (0.50) TDP1L3MBTL1ALDH1A1PTPRCPOLB
SCHEMBL9460233 0.71 CDC25A (0.38) L3MBTL1ALDH1A1MAPTSMN1; SMN2RECQL
SCHEMBL6907491 0.71 MAOA (0.36) ALDH1A1PTPRCMAPTRECQLPOLB
SCHEMBL10747127 0.70 KMT2A (0.45) L3MBTL1ALDH1A1POLBHPGDKMT2A
SCHEMBL6706620 0.69 LMNA (0.43) TDP1ALDH1A1PTPRCMAPTSMN1; SMN2
SCHEMBL135162 0.69 ATM (1.00) ATMTDP1L3MBTL1PBRM1ALDH1A1
SCHEMBL9324919 0.69 ATM (1.00) ATMTDP1L3MBTL1PBRM1ALDH1A1
SCHEMBL31277072 0.69 L3MBTL1 (0.40) ATMTDP1L3MBTL1ALDH1A1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5232970-A High strength, heat and moisture resistance, flexibility, dielectric for encapsulation of circuits THE DOW CHEMICAL COMPANY (US) 1993-08-03 US claimed
US-5232970-A High strength, heat and moisture resistance, flexibility, dielectric for encapsulation of circuits THE DOW CHEMICAL COMPANY (US) 1993-08-03 US disclosed