SCHEMBL95012

SCHEMBL95012

CCCCC(C(=O)O)C(C)(OOC(C)C)C1CCCCC1

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PPARG P37231 5/20 0.36
CA2 P00918 1/20 0.34
MAPK1 P28482 1/20 0.34
ALOX5 P09917 3/20 0.34
PTGES O14684 1/20 0.34
PTGS2 P35354 1/20 0.34
PSEN1 P49768 1/20 0.34
CTSK P43235 2/20 0.33
CTSS P25774 1/20 0.33
CTSL P07711 1/20 0.33
CTSB P07858 1/20 0.33
MEN1 O00255 1/20 0.33
HPGD P15428 1/20 0.33
RECQL P46063 1/20 0.33
KMT2A Q03164 1/20 0.33
HSD17B10 Q99714 1/20 0.33
HSPD1 P10809 1/20 0.33
BLM P54132 1/20 0.33
HSPE1 P61604 1/20 0.33
MAPT P10636 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9618419 0.78 PPARG (0.36) PPARGCA2MAPK1ALOX5PTGES
SCHEMBL5980305 0.72 PPARG (0.36) PPARGCA2MAPK1ALOX5PTGES
SCHEMBL8425253 0.72 MMP1 (0.32) PPARGALOX5PTGESPTGS2PSEN1
2-Ethylhexanoic Acid SCHEMBL27535370 0.70 CA2 (0.57) PPARGCA2MAPK1ALOX5PTGES
SCHEMBL8425250 0.70 MMP1 (0.33) CTSKCTSLCTSBMMP1MMP7
SCHEMBL27482948 0.69 SMN1; SMN2 (0.40) PPARGCA2MAPK1HSPD1BLM
SCHEMBL7873512 0.68 NAAA (0.38) PPARGCA2CTSKKMT2AMAPT
SCHEMBL27526942 0.66 CA2 (0.50) PPARGCA2MAPK1MMP1MMP7
SCHEMBL3151677 0.65 SMN1; SMN2 (0.41) CA2MAPK1CTSKCTSLCTSB
SCHEMBL6713611 0.65 ALDH1A1 (0.37) MAPK1HSPD1BLMHSPE1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 83 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117651730-A Resin composition and adhesive 纳美仕有限公司 2024-03-05 CN disclosed
US-11254774-B2 Styrene resin and method for producing styrene resin JSP CORPORATION (JP) 2022-02-22 US disclosed
US-20200207897-A1 STYRENE RESIN AND METHOD FOR PRODUCING STYRENE RESIN JSP CORPORATION (JP) 2020-07-02 US disclosed
US-20200165447-A1 RESIN COMPOSITION, METHOD OF PRODUCING RESIN COMPOSITION, AND MOLDED ARTICLE ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-05-28 US disclosed
EP-2626374-B1 DIENE-BASED CARBOXYLATE ANION AND SALT THEREOF, AND POLYMERIZABLE OR CURABLE COMPOSITION THEREOF NIPPON CATALYTIC CHEM IND (JP) 2019-05-15 EP disclosed
US-9499466-B2 Diene-based carboxylate anion and salt thereof, and polymerizable or curable composition thereof NIPPON SHOKUBAI CO., LTD. (JP) 2016-11-22 US disclosed
EP-2033942-B1 COMPOSITION FOR FORMING INTERLAYER FOR LAMINATED GLASS, INTERLAYER FOR LAMINATED GLASS, AND LAMINATED GLASS BRIDGESTONE CORP (JP) 2016-10-12 EP disclosed
EP-2770541-B1 SOLAR CELL SEALING FILM AND SOLAR CELL USING SAME BRIDGESTONE CORP (JP) 2016-09-07 EP disclosed
EP-2439783-B1 SEALING FILM FOR SOLAR CELL, AND SOLAR CELL UTILIZING SAME BRIDGESTONE CORP (JP) 2016-08-24 EP disclosed
EP-2685508-B1 SEALING FILM FOR SOLAR CELLS AND SOLAR CELL USING SAME BRIDGESTONE CORP (JP) 2016-06-22 EP disclosed
US-20080099733-A1 Anisotropic conductive film composition CHEIL INDUSTRIES, INC. 2008-05-01 US disclosed
EP-1860170-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE HITACHI CHEMICAL COMPANY, LTD. (JP) 2007-11-28 EP disclosed
EP-1239332-B1 PHOTOSENSITIVE POLYSILAZANE COMPOSITION, METHOD OF FORMING PATTERN THEREFROM, AND METHOD OF BURNING COATING FILM THEREOF AZ ELECTRONIC MATERIALS USA (US) 2007-02-21 EP disclosed
US-20050192373-A1 Curable composition for optical parts NIPPON SHOKUBAI CO., LTD. 2005-09-01 US disclosed
EP-1569013-A2 Curable composition for optical parts NIPPON SHOKUBAI CO., LTD. (JP) 2005-08-31 EP disclosed
US-6902875-B2 Photosensitive polysilazane composition, method of forming pattern therefrom, and method of burning coating film thereof CLARIANT FINANCE (BVI) LIMITED (VG) 2005-06-07 US disclosed
US-20040024152-A1 Gas hydrate formation inhibitor and method for inhibiting gas hydrate formation with the same MITSUBISHI RAYON CO., LTD. (JP) 2004-02-05 US disclosed
US-20030113657-A1 Photosensitive ploysilazane composition, method of forming pattern therefrom, and method of burning coating film thereof MERCK PATENT GMBH (DE) 2003-06-19 US disclosed
US-6562513-B1 Thermopolymerizable composition for battery use SHOWA DENKI KABUSHIKI KAISHA (JP) 2003-05-13 US disclosed
EP-1239332-A1 PHOTOSENSITIVE POLYSILAZANE COMPOSITION, METHOD OF FORMING PATTERN THEREFROM, AND METHOD OF BURNING COATING FILM THEREOF CLARIANT INTERNATIONAL LTD. (CH) 2002-09-11 EP disclosed