SCHEMBL9502575

SCHEMBL9502575

O=C(O)CC=Cc1ccc(O)cc1

nearest known ligand 0.70

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PAM P19021 1/20 0.70
AKR1B10 O60218 3/20 0.55
AKR1B1 P15121 3/20 0.55
CA12 O43570 3/20 0.55
CA7 P43166 3/20 0.55
CA9 Q16790 3/20 0.55
CA14 Q9ULX7 3/20 0.55
TYR P14679 2/20 0.55
PKM P14618 2/20 0.55
CA4 P22748 2/20 0.55
CA6 P23280 2/20 0.55
CA5A P35218 2/20 0.55
CA5B Q9Y2D0 2/20 0.55
CA1 P00915 2/20 0.55
CA2 P00918 2/20 0.55
ESR1 P03372 1/20 0.55
CA3 P07451 1/20 0.55
DPP4 P27487 1/20 0.55
HCAR2 Q8TDS4 1/20 0.55
ESR2 Q92731 1/20 0.55

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1616362 1.00 PAM (0.70) PAMAKR1B10AKR1B1CA12CA7
SCHEMBL11042697 0.85 AKR1B10 (0.55) PAMAKR1B10AKR1B1CA12CA7
SCHEMBL2148302 0.83 PAM (1.00) PAMHCAR2MAOBF3CYP2D6
SCHEMBL156767 0.83 PAM (1.00) PAMHCAR2MAOBF3CYP2D6
SCHEMBL582727 0.83 PAM (1.00) PAMHCAR2MAOBF3CYP2D6
SCHEMBL25241811 0.82 PAM (0.68) PAMESR1ESR2MAOBCYP2D6
SCHEMBL9044093 0.82 PAM (0.68) PAMCA1MAOBCYP3A4RAB9A
SCHEMBL9161835 0.82 PAM (0.68) PAMMAOBCYP2D6CYP3A4NFKB1
SCHEMBL9046738 0.82 PAM (0.68) PAMMAOBALDH1A1MAPT
SCHEMBL9161849 0.82 PAM (0.68) PAMMAOBCYP2D6CYP3A4NFKB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109799680-A Chemical amplification positive photosensitive resin composition and its application 奇美实业股份有限公司 2019-05-24 CN disclosed
CN-109557764-A Chemically amplified positive photosensitive resin composition, resist pattern and method for forming the same, and electronic device 奇美实业股份有限公司 2019-04-02 CN disclosed
CN-109116681-A Chemically amplified positive photosensitive resin composition, photoresist pattern and method for forming the same, and electronic device 奇美实业股份有限公司 2019-01-01 CN disclosed
CN-108241257-A Chemically amplified positive photosensitive resin composition, method for producing substrate with mold, and method for producing molded article by plating 奇美实业股份有限公司 2018-07-03 CN disclosed
CN-108241256-A Chemically amplified positive photosensitive resin composition, method for producing substrate with mold, and method for producing molded article by plating 奇美实业股份有限公司 2018-07-03 CN disclosed
EP-0350892-B1 HEAT-CURABLE COATING COMPOSITIONS AND THEIR USE Herberts Gesellschaft mit beschränkter Haftung (DE) 1993-05-19 EP disclosed
EP-0350892-A2 Heat-curable coating compositions and their use Herberts Gesellschaft mit beschränkter Haftung (DE) 1990-01-17 EP disclosed