Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.35 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.35 |
| ▸ | CYP19A1 | P11511 | 2/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9327410 | 0.81 | OPRM1 (0.32) | — | |
| SCHEMBL2048189 | 0.68 | OPRM1 (0.33) | — | |
| SCHEMBL954071 | 0.66 | ALDH1A1 (0.37) | ALDH1A1L3MBTL1CYP19A1LMNA | |
| SCHEMBL6573456 | 0.66 | TSHR (0.35) | ALDH1A1L3MBTL1LMNA | |
| SCHEMBL2232620 | 0.66 | OPRM1 (0.34) | — | |
| SCHEMBL8018743 | 0.64 | OPRL1 (0.33) | — | |
| SCHEMBL9107623 | 0.64 | ALDH1A1 (0.52) | ALDH1A1L3MBTL1CYP19A1LMNA | |
| SCHEMBL10342095 | 0.64 | ALDH1A1 (0.58) | ALDH1A1L3MBTL1CYP19A1LMNA | |
| SCHEMBL1637561 | 0.63 | DDB1 (0.32) | CYP19A1 | |
| SCHEMBL242068 | 0.63 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| US-20200409263-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-12-31 | — | — | US | disclosed |
| US-10831101-B2 | Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-11-10 | — | — | US | disclosed |
| US-20200103752-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND ELECTRONIC DEVICE USING THE SAME | SAMSUNG SDI CO., LTD. (KR) | 2020-04-02 | — | — | US | disclosed |
| US-20190278176-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING THE SAME AND ELECTRONIC DEVICE | SAMSUNG SDI CO., LTD. (KR) | 2019-09-12 | — | — | US | disclosed |
| US-20190113845-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-04-18 | — | — | US | disclosed |
| US-9709710-B2 | Device including light blocking layer and method of patterning the light blocking layer | SAMSUNG SDI CO., LTD. (KR) | 2017-07-18 | — | — | US | disclosed |
| US-9482943-B2 | Positive photosensitive resin composition, and photosensitive resin film and display device prepared by using the same | CHEIL INDUSTRIES INC. (KR) | 2016-11-01 | — | — | US | disclosed |
| US-20160259095-A1 | Device Including Light Blocking Layer and Method of Patterning the Light Blocking Layer | SAMSUNG SDI CO., LTD. (KR) | 2016-09-08 | — | — | US | disclosed |
| US-9429842-B2 | Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device | SAMSUNG SDI CO., LTD. (KR) | 2016-08-30 | — | — | US | disclosed |
| US-20090202794-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | ASAHI KASEI EMD CORPORATION (JP) | 2009-08-13 | — | — | US | disclosed |
| EP-2056163-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2009-05-06 | — | — | EP | disclosed |
| US-20090035693-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR CURED RELIEF PATTERN USING IT, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2009-02-05 | — | — | US | disclosed |
| US-7416822-B2 | Resin and resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2008-08-26 | — | — | US | disclosed |
| US-20080081294-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD OF CURED RELIEF PATTERN USING THE SAME AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2008-04-03 | — | — | US | disclosed |
| EP-1906246-A2 | Photosensitive resin composition, production method of cured relief pattern using the same and semiconductor device | FUJIFILM Corporation (JP) | 2008-04-02 | — | — | EP | disclosed |
| US-20070154843-A1 | Resin and resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2007-07-05 | — | — | US | disclosed |
| EP-1707588-A1 | RESIN AND RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2006-10-04 | — | — | EP | disclosed |
| US-5518864-A | PHOTOSENSITIVE, QUINONE DIAZIDE | KABUSHIKI KAISHA TOSHIBA (JP) | 1996-05-21 | — | — | US | disclosed |
| US-5025088-A | Photosensitive poly(amide)imide heat-resistant polymer | CHISSO CORPORATION (JP) | 1991-06-18 | — | — | US | disclosed |