Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.37 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.37 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | CYP19A1 | P11511 | 4/20 | 0.31 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.30 |
| ▸ | CYP17A1 | P05093 | 1/20 | 0.30 |
| ▸ | CYP11A1 | P05108 | 1/20 | 0.30 |
| ▸ | TBXAS1 | P24557 | 1/20 | 0.30 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.30 |
| ▸ | PDE4D | Q08499 | 1/20 | 0.30 |
| ▸ | PDE3A | Q14432 | 1/20 | 0.30 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1552116 | 0.81 | OPRM1 (0.36) | — | |
| SCHEMBL6853213 | 0.78 | ALDH1A1 (0.36) | ALDH1A1LMNA | |
| SCHEMBL6853464 | 0.78 | CYP3A4 (0.34) | CYP3A4 | |
| SCHEMBL8846147 | 0.72 | — | — | |
| SCHEMBL11141358 | 0.69 | ALDH1A1 (0.33) | ALDH1A1L3MBTL1LMNA | |
| SCHEMBL10664539 | 0.69 | OPRD1 (0.32) | — | |
| SCHEMBL8783202 | 0.67 | CA12 (0.30) | — | |
| SCHEMBL952881 | 0.66 | ALDH1A1 (0.35) | ALDH1A1L3MBTL1LMNACYP19A1 | |
| SCHEMBL1538677 | 0.64 | OPRM1 (0.31) | ALDH1A1 | |
| SCHEMBL11700256 | 0.64 | OPRM1 (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 122 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0330456-B1 | Preparation of silicon-containing polyimide precursor and cured polyimides obtained therefrom | CHISSO CORP (JP) | 1994-09-07 | — | — | EP | claimed |
| JP-10087822-A | — | — | None | — | — | JP | disclosed |
| US-20250291248-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME | SAMSUNG SDI CO., LTD. (KR) | 2025-09-18 | — | — | US | disclosed |
| US-20240329525-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-10-03 | — | — | US | disclosed |
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| EP-3674346-B1 | RESIN COMPOSITION, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL CO (JP) | 2023-01-11 | — | — | EP | disclosed |
| US-11118012-B2 | Resin composition, prepreg, metal-foil-clad laminate, resin sheet, and printed wiring board | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-09-14 | — | — | US | disclosed |
| US-20200409263-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-12-31 | — | — | US | disclosed |
| US-10831101-B2 | Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-11-10 | — | — | US | disclosed |
| US-20200247954-A1 | RESIN COMPOSITION, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-08-06 | — | — | US | disclosed |
| US-5055549-A | Using isoimide intermediate | CHISSO CORPORATION (JP) | 1991-10-08 | — | — | US | disclosed |
| EP-0431971-A2 | Photosensitive composition and resin-encapsulated semiconductor device | KABUSHIKI KAISHA TOSHIBA (JP) | 1991-06-12 | — | — | EP | disclosed |
| EP-0410702-A2 | Printing ink composition | Chisso Corporation (JP) | 1991-01-30 | — | — | EP | disclosed |
| US-4963635-A | REACTING A FLUORINE-CONTAINING DIANHYDRIDE OR DIANHYDRIDE, A FLUORINE-CONTAINING DIAMINE OR A DEIAMINE AND AN AMINO-CONTAINING OXYSILANE COMPOUND | CHISSO CORPORATION (JP) | 1990-10-16 | — | — | US | disclosed |
| US-4963649-A | LOW GLASS TRANSITION TEMPERATURES; FOR HOT MELT ADHESIVES, PREPREGS | ETHYL CORPORATION (US) | 1990-10-16 | — | — | US | disclosed |
| EP-0341028-A2 | Process for the preparation of photosensitive polymers | Chisso Corporation (JP) | 1989-11-08 | — | — | EP | disclosed |
| EP-0330456-A1 | Preparation of silicon-containing polyimide precursor and cured polyimides obtained therefrom | CHISSO CORPORATION (JP) | 1989-08-30 | — | — | EP | disclosed |
| US-4124651-A | Process for the production of polyamide-polyamide-acid copolymers | CIBA-GEIGY CORPORATION (US) | 1978-11-07 | — | — | US | disclosed |
| US-3950308-A | POLYAMIDES, POLYIMIDES, POLYAMIDE-IMIDES | CIBA-GEIGY CORPORATION (US) | 1976-04-13 | — | — | US | disclosed |
| US-3948835-A | POLYAMIDE, POLYAMIDE-ACID OR POLYAMIDE-AMIDE-ACIDS | CIBA-GEIGY CORPORATION (US) | 1976-04-06 | — | — | US | disclosed |