⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL49131 | 1.00 | — | — | |
| SCHEMBL537202 | 1.00 | — | — | |
| SCHEMBL2978721 | 1.00 | — | — | |
| SCHEMBL6734791 | 1.00 | — | — | |
| SCHEMBL4881454 | 0.82 | — | — | |
| Potassium SCHEMBL2450054 | 0.82 | — | — | |
| SCHEMBL717964 | 0.82 | — | — | |
| SCHEMBL716950 | 0.82 | — | — | |
| SCHEMBL895890 | 0.82 | — | — | |
| SCHEMBL10890316 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 376 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118165319-A | Silicon-containing heterocyclic aramid film with high-temperature energy storage and electric etching resistance and preparation method thereof | 四川大学 | 2024-06-11 | — | — | CN | claimed |
| CN-118063390-A | Diamine with naphthyridone structure, thermosetting polyimide resin and preparation method thereof | 西北工业大学 | 2024-05-24 | — | — | CN | claimed |
| CN-116082682-B | Polyimide/fluorinated nano Al 2 O 3 Composite film and preparation method thereof | 四川大学 | 2024-04-05 | — | — | CN | claimed |
| CN-117586544-A | Glue-free composite film and preparation method thereof | 昆山雅森电子材料科技有限公司 | 2024-02-23 | — | — | CN | claimed |
| CN-115322371-B | Silicon-containing polyester imide and preparation method and application thereof | 华南理工大学 | 2023-09-19 | — | — | CN | claimed |
| CN-116751392-A | High-temperature-resistant covering film and preparation method thereof | 昆山雅森电子材料科技有限公司 | 2023-09-15 | — | — | CN | claimed |
| CN-116693911-A | Composite film and method for producing same | 昆山雅森电子材料科技有限公司 | 2023-09-05 | — | — | CN | claimed |
| CN-114891211-B | Ultrathin polyimide aerogel and preparation method thereof | 黑龙江省科学院石油化学研究院 | 2023-08-18 | — | — | CN | claimed |
| CN-115558436-B | High-performance polyimide shielding film and preparation method thereof | 昆山雅森电子材料科技有限公司 | 2023-08-01 | — | — | CN | claimed |
| CN-116410444-A | Organosilicon and organofluorine high-performance epoxy curing agent and preparation method thereof | 亨思特(苏州)材料科技有限公司 | 2023-07-11 | — | — | CN | claimed |
| US-9624412-B2 | Robust interface bonding with B-staged thermoplastic polyimide adhesive | FRAIVILLIG TECHNOLOGIES COMPANY (US) | 2017-04-18 | — | — | US | claimed |
| CN-102439521-B | Photosensitive resin composition and dry film comprising the same | LG CHEMICAL LTD | 2013-07-24 | — | — | CN | claimed |
| US-8354219-B2 | Photosensitive resin composition and dry film comprising the same | LG CHEM, LTD. (KR) | 2013-01-15 | — | — | US | claimed |
| CN-102439521-A | Photosensitive resin composition and dry film comprising the same | LG CHEMICAL LTD | 2012-05-02 | — | — | CN | claimed |
| US-20110278049-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND DRY FILM COMPRISING THE SAME | LG CHEM, LTD. (KR) | 2011-11-17 | — | — | US | claimed |
| US-6294639-B1 | ADHESIVE PROPERTIES AND THE PRINTING PROPERTIES TO A SUBSTRATE, WHICH IS FREE FROM SEPARATION FROM SUBSTRATE DURING RUBBING AND PROVIDES VOLTAGE HOLDING PROPERTY | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2001-09-25 | — | — | US | claimed |
| US-5143948-A | Soluble polyimide, encapsulation with low temperature heat treatment | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1992-09-01 | — | — | US | claimed |
| US-5041513-A | Polyimide resin compositions | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1991-08-20 | — | — | US | claimed |
| US-5037862-A | Excellent mechanical stability in printing | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1991-08-06 | — | — | US | claimed |
| US-4604442-A | Organopolysiloxane-polyamide block polymers and method for making | GENERAL ELECTRIC COMPANY (US) | 1986-08-05 | — | — | US | claimed |