SCHEMBL9550314

SCHEMBL9550314

COC(=O)c1ccc(Oc2ccc(C(=O)OC)c(C(=O)OC)c2)cc1C(=O)OC

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 4/20 0.51
CYP1A2 P05177 1/20 0.51
CYP2D6 P10635 1/20 0.51
CYP2C9 P11712 1/20 0.51
CYP2C19 P33261 1/20 0.51
CA1 P00915 3/20 0.50
CA2 P00918 3/20 0.50
CA12 O43570 2/20 0.50
CA7 P43166 2/20 0.50
CA9 Q16790 2/20 0.50
CA14 Q9ULX7 2/20 0.50
PDK2 Q15119 1/20 0.50
PDK4 Q16654 1/20 0.50
GAA P10253 3/20 0.47
GLA P06280 2/20 0.47
ALDH1A1 P00352 2/20 0.47
HSD17B10 Q99714 2/20 0.47
MAPT P10636 2/20 0.47
ATM Q13315 2/20 0.47
HPGD P15428 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7765927 0.93 KDM4E (0.58) KDM4ECYP1A2CYP2D6CYP2C9CYP2C19
SCHEMBL8008958 0.91 POLB (0.55) KDM4ECYP1A2CYP2D6CYP2C9CYP2C19
SCHEMBL7765911 0.91 XDH (0.55) KDM4ECYP1A2CYP2C9CYP2C19GAA
SCHEMBL11574967 0.91 POLB (0.55) KDM4ECYP1A2CYP2D6CYP2C9CYP2C19
SCHEMBL7765105 0.91 MMP13 (0.49) KDM4ECYP1A2CYP2D6CYP2C9CYP2C19
SCHEMBL11576384 0.90 POLB (0.54) KDM4ECYP1A2CYP2D6CYP2C9CYP2C19
SCHEMBL8008956 0.90 POLB (0.54) KDM4ECYP1A2CYP2D6CYP2C9CYP2C19
SCHEMBL7122639 0.89 GAA (0.56) KDM4ECYP1A2CYP2D6CYP2C9CYP2C19
SCHEMBL8541373 0.89 POLB (0.57) KDM4ECYP1A2CYP2D6CYP2C9CYP2C19
SCHEMBL382822 0.88 KDM4E (0.66) KDM4ECYP1A2CYP2D6CYP2C9CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2019143042-A1 POLYAMIC ACID ESTER POLYMER, INSULATING FILM FORMED THEREFROM, AND INSULATING FILM FORMING METHOD USING SAME 동우화인켐 주식회사 2019-07-25 WO disclosed
US-5216173-A Curing agents for epoxy resins; polyimides HENKEL RESEARCH CORPORATION (US) 1993-06-01 US disclosed
EP-0484381-A1 N-CYANOIMIDES AND PROCESS FOR THEIR PREPARATION AND USES THEREOF HENKEL RESEARCH CORPORATION (US) 1992-05-13 EP disclosed
WO-1991001307-A2 N-CYANOIMIDES AND PROCESS FOR THEIR PREPARATION AND USES THEREOF HENKEL RESEARCH CORPORATION (US) 1991-02-07 WO disclosed