SCHEMBL9550347

SCHEMBL9550347

N#CN1C(=O)c2ccc(F)cc2C1=O

nearest known ligand 0.43

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
AR P10275 7/20 0.43
USP8 P40818 1/20 0.42
USP7 Q93009 1/20 0.42
USP47 Q96K76 1/20 0.42
DDB1 Q16531 1/20 0.41
CRBN Q96SW2 1/20 0.41
CA1 P00915 1/20 0.40
CA2 P00918 1/20 0.40
CA7 P43166 1/20 0.40
CA9 Q16790 1/20 0.40
PARK7 Q99497 1/20 0.38
GRM1 Q13255 2/20 0.36
GRM4 Q14833 1/20 0.35
ESR1 P03372 1/20 0.34
ESR2 Q92731 1/20 0.34
KDM4E B2RXH2 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9550316 0.78 ESR1 (0.51) DDB1CRBNCA1CA2CA7
SCHEMBL9550328 0.77 APP (0.46) USP8USP7CA1CA2CA7
SCHEMBL9550432 0.77 S100A4 (0.47) USP8USP7USP47GRM1GRM4
SCHEMBL9550303 0.75 ESR1 (0.33) CA1CA2CA9ESR1ESR2
SCHEMBL9143697 0.74 CA12 (0.43) CA9
SCHEMBL9550323 0.74 CA12 (0.43) CA9
SCHEMBL8417452 0.74 ALDH1A1 (0.55) ARDDB1CRBNCA1CA2
SCHEMBL22166573 0.73 AR (0.43) ARUSP8USP7USP47DDB1
SCHEMBL1734116 0.72 ESR1 (0.58) ARCA1CA2CA9GRM1
SCHEMBL9550352 0.72 PTPRC (0.53) CA1CA2CA7CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5216173-A Curing agents for epoxy resins; polyimides HENKEL RESEARCH CORPORATION (US) 1993-06-01 US disclosed
EP-0484381-A1 N-CYANOIMIDES AND PROCESS FOR THEIR PREPARATION AND USES THEREOF HENKEL RESEARCH CORPORATION (US) 1992-05-13 EP disclosed
WO-1991001307-A2 N-CYANOIMIDES AND PROCESS FOR THEIR PREPARATION AND USES THEREOF HENKEL RESEARCH CORPORATION (US) 1991-02-07 WO disclosed