SCHEMBL9562580

SCHEMBL9562580

O=C1C=CC(=O)N1CC(c1ccccc1)N1C(=O)C=CC1=O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 9/20 0.46
GSK3A P49840 4/20 0.46
GSK3B P49841 4/20 0.46
FAAH O00519 5/20 0.41
PTGS1 P23219 1/20 0.37
PTGS2 P35354 1/20 0.37
MEN1 O00255 2/20 0.36
KMT2A Q03164 2/20 0.36
ALDH1A1 P00352 3/20 0.34
LMNA P02545 2/20 0.34
MAPT P10636 2/20 0.34
NPSR1 Q6W5P4 2/20 0.34
GMNN O75496 1/20 0.34
THPO P40225 1/20 0.34
BLM P54132 1/20 0.34
PMP22 Q01453 1/20 0.34
HSP90AA1 P07900 2/20 0.33
TLR9 Q9NR96 2/20 0.33
HPGD P15428 2/20 0.33
XBP1 P17861 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28286235 0.79 LMNA (0.41) MGLLGSK3AGSK3BMEN1KMT2A
SCHEMBL10973243 0.76 KMT2A (0.47) MEN1KMT2AALDH1A1MAPTHPGD
SCHEMBL28786000 0.76 MGLL (0.38) MGLLGSK3AGSK3BFAAHMEN1
SCHEMBL3749040 0.76 DAO (0.49) MGLLGSK3AGSK3BFAAHPTGS1
SCHEMBL3749034 0.76 DAO (0.49) MGLLGSK3AGSK3BFAAHPTGS1
SCHEMBL1608836 0.74 ALDH1A1 (0.46) MGLLGSK3AGSK3BPTGS1PTGS2
SCHEMBL384411 0.71 MGLL (0.44) MGLLGSK3AGSK3BFAAHALDH1A1
SCHEMBL2175411 0.71 MGLL (0.44) MGLLGSK3AGSK3BFAAHMEN1
SCHEMBL8871478 0.70 ALDH1A1 (0.41) KMT2AALDH1A1LMNANPSR1PKM
SCHEMBL8871482 0.70 ALDH1A1 (0.41) KMT2AALDH1A1LMNANPSR1PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-1993025386-A1 THERMALLY RESISTANT GLASS ARTICLE ENSIGN-BICKFORD COATINGS COMPANY (US) 1993-12-23 WO claimed
WO-1993025386-A1 THERMALLY RESISTANT GLASS ARTICLE ENSIGN-BICKFORD COATINGS COMPANY (US) 1993-12-23 WO disclosed
EP-0035760-B1 THERMOSETTING RESIN COMPOSITION, PROCESS FOR PREPARATION THEREOF AND CURED PRODUCT THEREOF Hitachi, Ltd. (JP) 1985-07-03 EP disclosed
US-4393177-A POLY (PHENYLMETHYLENE) POLYMALEIMIDE AND TRIALLYL ISOCYANURATE HITACHI, LTD. (JP) 1983-07-12 US disclosed
EP-0035760-A2 Thermosetting resin composition, process for preparation thereof and cured product thereof Hitachi, Ltd. (JP) 1981-09-16 EP disclosed