Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ACHE | P22303 | 3/20 | 0.42 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.41 |
| ▸ | TSHR | P16473 | 1/20 | 0.41 |
| ▸ | LMNA | P02545 | 1/20 | 0.40 |
| ▸ | CA1 | P00915 | 1/20 | 0.39 |
| ▸ | CA2 | P00918 | 1/20 | 0.39 |
| ▸ | CA9 | Q16790 | 1/20 | 0.39 |
| ▸ | TEAD4 | Q15561 | 1/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.35 |
| ▸ | POLB | P06746 | 1/20 | 0.35 |
| ▸ | MAPT | P10636 | 1/20 | 0.35 |
| ▸ | MEN1 | O00255 | 1/20 | 0.35 |
| ▸ | WDR5 | P61964 | 1/20 | 0.35 |
| ▸ | RELA | Q04206 | 1/20 | 0.34 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.34 |
| ▸ | MMP13 | P45452 | 1/20 | 0.33 |
| ▸ | HTT | P42858 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28852634 | 0.90 | LMNA (0.38) | ACHECYP3A4TSHRLMNACA1 | |
| SCHEMBL12352300 | 0.90 | HTT (0.42) | ACHECYP3A4TSHRLMNACA1 | |
| SCHEMBL3920867 | 0.84 | ACHE (0.58) | ACHECYP3A4LMNACA1CA2 | |
| SCHEMBL3191986 | 0.82 | CA1 (0.50) | ACHECYP3A4CA1CA2CA9 | |
| SCHEMBL8842286 | 0.78 | ACHE (0.42) | ACHECYP3A4TSHRLMNACA1 | |
| SCHEMBL1416559 | 0.78 | ACHE (0.48) | ACHECYP3A4TSHRLMNACA1 | |
| SCHEMBL23777849 | 0.77 | MEN1 (0.44) | CYP3A4LMNACA1CA2CA9 | |
| SCHEMBL989137 | 0.77 | MEN1 (0.39) | CYP3A4LMNACA1CA2CA9 | |
| SCHEMBL4320820 | 0.77 | CA1 (0.44) | TSHRLMNACA1CA2CA9 | |
| SCHEMBL28876962 | 0.77 | NQO1 (0.56) | TSHRLMNACA1CA2CA9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3845578-B1 | PHOSPHOROUS-CONTAINING EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, LAMINATED PLATE, MATERIAL FOR CIRCUIT BOARD AND CURED PRODUCT | NIPPON STEEL CHEMICAL & MAT CO LTD (JP) | 2023-06-07 | — | — | EP | disclosed |
| US-11421071-B2 | Phosphorus-containing epoxy resin, epoxy resin composition, prepreg, laminated plate, material for circuit board and cured product | NIPPON STEEL CHEMICAL & MATERIALS CO., LTD. (JP) | 2022-08-23 | — | — | US | disclosed |
| US-20210253783-A1 | PHOSPHORUS-CONTAINING EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, LAMINATED PLATE, MATERIAL FOR CIRCUIT BOARD AND CURED PRODUCT | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) | 2021-08-19 | — | — | US | disclosed |
| EP-3845578-A1 | PHOSPHOROUS-CONTAINING EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, LAMINATED PLATE, MATERIAL FOR CIRCUIT BOARD AND CURED PRODUCT | NIPPON STEEL Chemical & Material Co., Ltd. (JP) | 2021-07-07 | — | — | EP | disclosed |
| EP-3620459-A1 | PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, PHOSPHORUS-CONTAINING EPOXY RESIN, CURABLE RESIN COMPOSITION THEREOF, OR EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF | NIPPON STEEL Chemical & Material Co., Ltd. (JP) | 2020-03-11 | — | — | EP | disclosed |
| US-9822425-B2 | Processes for recovering metals from aqueous solutions | CYTEC TECHNOLOGY CORP. (US) | 2017-11-21 | — | — | US | disclosed |
| US-20150135903-A1 | PROCESSES FOR RECOVERING METALS FROM AQUEOUS SOLUTIONS | CYTEC TECHNOLOGY CORP. (US) | 2015-05-21 | — | — | US | disclosed |
| US-8968698-B2 | Processes for recovering metals from aqueous solutions | CYTEC TECHNOLOGY CORP. (US) | 2015-03-03 | — | — | US | disclosed |
| US-20140127095-A1 | PROCESSES FOR RECOVERING METALS FROM AQUEOUS SOLUTIONS | CYTEC TECHNOLOGY CORP. (US) | 2014-05-08 | — | — | US | disclosed |
| US-8328900-B2 | Processes for recovering metals from aqueous solutions | CYTEC TECHNOLOGY CORP. (US) | 2012-12-11 | — | — | US | disclosed |
| US-7687229-B2 | Silver halide color photographic light-sensitive material and image forming method | FUJIFILM CORPORATION (JP) | 2010-03-30 | — | — | US | disclosed |
| US-7556918-B2 | Color photographic films comprising support having color developable light sensitive silver halide emulsion layers and color dye-forming couplers, used for high speed print reproduction; storage stability | FUJIFILM CORPORATION (JP) | 2009-07-07 | — | — | US | disclosed |
| US-7531585-B2 | Polyactic acid resin composition | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2009-05-12 | — | — | US | disclosed |
| US-20080113305-A1 | SILVER HALIDE COLOR PHOTOGRAPHIC LIGHT-SENSITIVE MATERIAL | FUJIFILM CORPORATION | 2008-05-15 | — | — | US | disclosed |
| US-20070298348-A1 | Silver Halide Color Photographic Light-Sensitive Material and Image Forming Method | FUJIFILM CORPORATION (JP) | 2007-12-27 | — | — | US | disclosed |
| US-20070299170-A1 | Containing zinc phenyl phosphonate as crystal nucleator appropriate for accelerating crystallization; heat resistance and forming processability | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2007-12-27 | — | — | US | disclosed |
| US-7183044-B2 | Silver halide color photographic light-sensitive material | FUJI PHOTO FILM CO., LTD. (JP) | 2007-02-27 | — | — | US | disclosed |
| EP-1736510-A1 | POLYLACTIC ACID RESIN COMPOSITION | Nissan Chemical Industries, Ltd. (JP) | 2006-12-27 | — | — | EP | disclosed |
| US-5242960-A | Polyphenol phosphinic acids and zinc borate or zinc oxide | BAYER AKTIENGESELLSCHAFT (DE) | 1993-09-07 | — | — | US | disclosed |
| US-5191000-A | FLAMEPROOFED, NON-DRIPPING POLYALKYLENE TEREPHTHALATE MOLDING COMPOUNDS | BAYER AKTIENGESELLSCHAFT (DE) | 1993-03-02 | — | — | US | disclosed |