SCHEMBL9745454

SCHEMBL9745454

CCc1ccccc1[SiH](O)C(C)(C)C

nearest known ligand 0.45

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
GABRA1 P14867 2/20 0.45
GABRB2 P47870 2/20 0.45
ALDH1A1 P00352 2/20 0.39
GAA P10253 2/20 0.39
TSHR P16473 2/20 0.39
MEN1 O00255 1/20 0.39
PKM P14618 1/20 0.39
KMT2A Q03164 1/20 0.39
RIPK1 Q13546 4/20 0.35
HSD11B1 P28845 1/20 0.33
MGLL Q99685 1/20 0.33
PDK2 Q15119 1/20 0.33
HTT P42858 1/20 0.33
MAPT P10636 1/20 0.33
CTSB P07858 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1917938 0.79 GABRA1 (0.46) GABRA1GABRB2ALDH1A1GAAMGLL
SCHEMBL9746462 0.72 GABRA1 (0.40) GABRA1GABRB2ALDH1A1GAATSHR
SCHEMBL9747152 0.72 GABRA1 (0.40) GABRA1GABRB2ALDH1A1GAATSHR
SCHEMBL20637440 0.72 GABRA1 (0.42) GABRA1GABRB2ALDH1A1GAAMGLL
SCHEMBL4267262 0.71 GABRA1 (0.39) GABRA1GABRB2ALDH1A1GAATSHR
SCHEMBL27870531 0.71 GABRA1 (0.39) GABRA1GABRB2ALDH1A1GAATSHR
SCHEMBL28853525 0.70 GABRA1 (0.41) GABRA1GABRB2ALDH1A1GAARIPK1
SCHEMBL21383367 0.70 GABRA1 (0.41) GABRA1GABRB2ALDH1A1GAARIPK1
SCHEMBL115194 0.70 MGLL (0.42) GABRA1GABRB2ALDH1A1GAAMGLL
SCHEMBL6114728 0.70 GABRA1 (0.46) GABRA1GABRB2ALDH1A1GAAMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114207038-B Resin composition, method for producing cured product, pattern cured product, interlayer insulating film, covercoat, surface protective film, and electronic component 艾曲迪微系统股份有限公司 2024-03-22 CN disclosed
CN-110088680-B Double-layer photosensitive layer roll 旭化成株式会社 2022-12-30 CN disclosed
CN-112334833-A Negative photosensitive resin composition, polyimide using same, and method for producing cured relief pattern 旭化成株式会社 2021-02-05 CN disclosed
US-10175577-B2 Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component HITACHI CHEMICAL COMPANY, LTD. (JP) 2019-01-08 US disclosed
US-20150024173-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, AND ELECTRONIC COMPONENT RESONAC CORPORATION (JP) 2015-01-22 US disclosed
US-5100762-A Radiation-sensitive polymer and radiation-sensitive composition containing the same MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 1992-03-31 US disclosed