SCHEMBL978172

SCHEMBL978172

COC(=O)NC(C)[SiH](OC)OC

nearest known ligand 0.34

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 2/20 0.34
MMP1 P03956 2/20 0.34
MMP2 P08253 2/20 0.34
CA12 O43570 1/20 0.34
CA1 P00915 1/20 0.34
CA2 P00918 1/20 0.34
MMP9 P14780 1/20 0.34
MMP8 P22894 1/20 0.34
CA9 Q16790 1/20 0.34
MMP3 P08254 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6115473 0.81 MMP1 (0.34) SMN1; SMN2MMP1MMP2CA12CA1
SCHEMBL2460038 0.79 CA12 (0.33) SMN1; SMN2MMP1MMP2CA12CA1
SCHEMBL9665646 0.71 TDP1 (0.39) SMN1; SMN2MMP1MMP2CA12CA1
SCHEMBL1106979 0.71
SCHEMBL3641120 0.69
SCHEMBL15478609 0.69
SCHEMBL8370783 0.69 EPHX1 (0.33) CA1CA2
SCHEMBL2818886 0.68
SCHEMBL23637708 0.67
SCHEMBL16266424 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2021115621-A1 METHOD FOR PRODUCING ORGANYLOXYSILANE-TERMINATED POLYMERS WACKER CHEMIE AG (DE) 2021-06-17 WO disclosed
US-8623170-B2 Moisture-curing compostion with improved initial strength SIKA TECHNOLOGY AG (CH) 2014-01-07 US disclosed
US-20120298300-A1 MOISTURE-CURING COMPOSTION WITH IMPROVED INITIAL STRENGTH SIKA TECHNOLOGY AG (CH) 2012-11-29 US disclosed
US-7867619-B2 Moisture-curing compositions containing silane-functional polymers with good adhesive properties SIKA TECHNOLOGY AG (CH) 2011-01-11 US disclosed
US-20090214879-A1 Moisture-Curing Compositions Containing Silane-Functional Polymers With Good Adhesive Properties SIKA TECHNOLOGY AG (CH) 2009-08-27 US disclosed