SCHEMBL97997

SCHEMBL97997

CC(S)CC(=O)OCCC(C)OC(=O)CC(C)S

nearest known ligand 0.36

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
PRKCA P17252 1/20 0.34
FAAH O00519 4/20 0.32
CNR1 P21554 1/20 0.32
CNR2 P34972 1/20 0.32
CYP19A1 P11511 1/20 0.32
MMP1 P03956 1/20 0.32
MMP2 P08253 1/20 0.32
MMP3 P08254 1/20 0.32
MMP9 P14780 1/20 0.32
MMP13 P45452 1/20 0.32
CHRNB2 P17787 2/20 0.31
CHRNA4 P43681 2/20 0.31
CHRNB4 P30926 1/20 0.31
CHRNA3 P32297 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6361385 0.84 CYP19A1 (0.35) PRKCACYP19A1CHRNB2CHRNA4CHRNB4
SCHEMBL2859972 0.84 PRKCA (0.40) PRKCAMMP1MMP2MMP3MMP9
SCHEMBL20299549 0.83 CYP19A1 (0.36) PRKCAFAAHCNR1CNR2CYP19A1
SCHEMBL4567207 0.83 CYP19A1 (0.36) PRKCAFAAHCNR1CNR2CYP19A1
SCHEMBL100193 0.82 DGKA (0.37) PRKCACYP19A1
SCHEMBL17068924 0.81 PRKCA (0.34) PRKCAFAAHCNR1CNR2CYP19A1
SCHEMBL98666 0.81 PRKCA (0.43) PRKCAMMP1MMP2MMP3MMP9
SCHEMBL6003547 0.80 ADRA2A (0.34) FAAHCNR1CNR2CYP19A1CHRNB2
SCHEMBL17068925 0.80 PRKCA (0.33) PRKCAFAAHCNR1CNR2CYP19A1
SCHEMBL20237253 0.78 PRKCA (0.36) PRKCA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12492293-B2 Multi-component systems for preparing foamed products ARKEMA FRANCE (FR) 2025-12-09 US disclosed
EP-3891210-B1 MULTI-COMPONENT SYSTEMS FOR PREPARING FOAMED PRODUCTS ARKEMA FRANCE (FR) 2023-08-23 EP disclosed
US-20220033606-A1 MULTI-COMPONENT SYSTEMS FOR PREPARING FOAMED PRODUCTS ARKEMA FRANCE (FR) 2022-02-03 US disclosed
EP-3891210-A1 MULTI-COMPONENT SYSTEMS FOR PREPARING FOAMED PRODUCTS ARKEMA FRANCE (FR) 2021-10-13 EP disclosed
US-11130891-B2 Photocurable sealing material BOSTIK SA (FR) 2021-09-28 US disclosed
CN-113166416-A Multicomponent system for producing foamed products 阿科玛法国公司 2021-07-23 CN disclosed
US-20210054251-A1 Photocurable Sealing Material BOSTIK SA (FR) 2021-02-25 US disclosed
EP-3744807-A1 PHOTOCURABLE SEALING MATERIAL Bostik SA (FR) 2020-12-02 EP disclosed
CN-111699234-A Photocurable sealing material 博斯蒂克股份公司 2020-09-22 CN disclosed
WO-2020115560-A1 MULTI-COMPONENT SYSTEMS FOR PREPARING FOAMED PRODUCTS ARKEMA FRANCE (FR) 2020-06-11 WO disclosed
US-8921446-B2 Photocurable material for sealing, sealing method, sealing material, and housing using said sealing material NITTA GELATIN INC. (JP) 2014-12-30 US disclosed
US-20130303651-A1 PHOTOCURABLE MATERIAL FOR SEALING, SEALING METHOD, SEALING MATERIAL, AND HOUSING USING SAID SEALING MATERIAL BOSTIK SA (FR) 2013-11-14 US disclosed
EP-2471873-A1 ENERGY RAY-CURABLE ELASTOMER COMPOSITION Bridgestone Corporation (JP) 2012-07-04 EP disclosed
US-20120157564-A1 ENERGY RAY-CURABLE ELASTOMER COMPOSITION BRIDGESTONE CORPORATION (JP) 2012-06-21 US disclosed
EP-2426162-A1 ENERGY-RAY-CURABLE ELASTOMER COMPOSITION, MATERIAL FOR GASKET, GASKET, AND HARD DISK DEVICE Bridgestone Corporation (JP) 2012-03-07 EP disclosed
US-20120041096-A1 ENERGY-RAY-CURABLE ELASTOMER COMPOSITION, MATERIAL FOR GASKET, GASKET, AND HARD DISK DEVICE BRIDGESTONE CORPORATION (JP) 2012-02-16 US disclosed
US-20060079593-A1 Hexaarylbiimidazole compounds and photopolymerization initiator compositions containing the same SHOWA DENKO K.K. (JP) 2006-04-13 US disclosed
US-20060036023-A1 Color filter black matrix resist composition SHOWA DENKO K.K. (JP) 2006-02-16 US disclosed
EP-1573397-A1 COLOR FILTER BLACK MATRIX RESIST COMPOSITION Showa Denko K.K. (JP) 2005-09-14 EP disclosed
WO-2004055596-A1 COLOR FILTER BLACK MATRIX RESIST COMPOSITION SHOWA DENKO K. K. (JP) 2004-07-01 WO disclosed