SCHEMBL9846188

SCHEMBL9846188

CCCOC(OCCC)c1ccc(C)cc1

nearest known ligand 0.43

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
CHRNA7 P36544 1/20 0.43
ACHE P22303 5/20 0.37
BCHE P06276 3/20 0.37
PTGS2 P35354 3/20 0.37
TDP1 Q9NUW8 1/20 0.36
MEN1 O00255 3/20 0.34
KMT2A Q03164 3/20 0.34
SLC6A2 P23975 2/20 0.34
SLC6A4 P31645 2/20 0.34
SLC6A3 Q01959 2/20 0.34
KCNH2 Q12809 2/20 0.34
NPSR1 Q6W5P4 2/20 0.34
KDM4E B2RXH2 1/20 0.34
LMNA P02545 2/20 0.33
ALDH1A1 P00352 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
HRH3 Q9Y5N1 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9451044 0.91 PTGS2 (0.41) ACHEBCHEPTGS2TDP1SLC6A2
SCHEMBL17481685 0.90 CHRNA7 (0.39) CHRNA7ACHETDP1MEN1KMT2A
SCHEMBL9053497 0.90 MAPT (0.39) MEN1KMT2ASMN1; SMN2HRH3
SCHEMBL18806270 0.87 CHRNA7 (0.40) CHRNA7ACHEBCHEPTGS2TDP1
SCHEMBL3906858 0.84 ACHE (0.50) CHRNA7ACHEBCHEPTGS2TDP1
SCHEMBL9069284 0.83 CHRNA7 (0.40) CHRNA7ACHETDP1MEN1KMT2A
SCHEMBL7523618 0.79 SLC6A4 (0.50) CHRNA7TDP1SLC6A2SLC6A4SLC6A3
SCHEMBL15161598 0.79 CHRNA7 (0.38) CHRNA7ACHETDP1MEN1KMT2A
SCHEMBL4384773 0.79 HTT (0.44) MEN1KMT2ASLC6A2SLC6A4SLC6A3
SCHEMBL17864870 0.79 SLC2A1 (0.41) ACHEBCHEPTGS2LMNASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118053799-A Method for manufacturing semiconductor device 株式会社力森诺科 2024-05-17 CN disclosed
CN-117157733-A Method for manufacturing semiconductor device and dicing die-bonding integrated film 株式会社力森诺科 2023-12-01 CN disclosed
CN-110945634-B Heat-dissipating die bonding film and dicing die bonding film 株式会社力森诺科 2023-08-29 CN disclosed
CN-114730706-A Method for manufacturing semiconductor device, dicing die-bonding integrated film, and method for manufacturing the same 昭和电工材料株式会社 2022-07-08 CN disclosed
CN-112292431-A Crystal cutting and crystal bonding integrated film and pressure-sensitive adhesive film used by same 昭和电工材料株式会社 2021-01-29 CN disclosed
CN-101084250-B Modified phenol resin, epoxy resin composition containing the same, and prepreg using the composition MITSUI CHEMICALS INC 2011-06-15 CN disclosed
CN-101084250-A Modified phenol resin, epoxy resin composition containing the same, and prepreg using the composition MITSUI CHEMICALS INC (JP) 2007-12-05 CN disclosed
CN-1156532-C Epoxy-resin composition and use thereof 三井化学株式会社 2004-07-07 CN disclosed
CN-1239116-A Epoxy-resin composition and use thereof MITSUI CHEMICALS INC (US) 1999-12-22 CN disclosed
EP-0415790-A2 Naphthol-based epoxy resins, intermediates for the same, process for preparing the same, and epoxy resin compositions containing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 1991-03-06 EP disclosed
CN-1037721-A Compositions of thermosetting resin MITSUI TOATSU CHEMICALS (JP) 1989-12-06 CN disclosed