SCHEMBL9053497

SCHEMBL9053497

CCCCOC(OCCCC)c1ccc(C)cc1

nearest known ligand 0.45

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
MAPT P10636 2/20 0.39
RECQL P46063 1/20 0.39
HRH3 Q9Y5N1 1/20 0.37
MAPK1 P28482 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
L3MBTL1 Q9Y468 2/20 0.37
THRB P10828 1/20 0.37
SLC2A1 P11166 2/20 0.37
MEN1 O00255 1/20 0.37
KMT2A Q03164 1/20 0.37
PTGES O14684 1/20 0.36
ALOX5 P09917 1/20 0.36
PPARG P37231 1/20 0.36
PPARA Q07869 1/20 0.36
DRD2 P14416 1/20 0.36
DRD4 P21917 1/20 0.36
DRD3 P35462 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17864870 0.92 SLC2A1 (0.41) MAPK1SMN1; SMN2L3MBTL1SLC2A1
SCHEMBL9846188 0.90 CHRNA7 (0.43) HRH3SMN1; SMN2MEN1KMT2A
SCHEMBL10584634 0.84 NPC1 (0.49) SMN1; SMN2L3MBTL1SLC2A1MEN1KMT2A
SCHEMBL10154337 0.82 LTA4H (0.52) MAPTMAPK1SMN1; SMN2DRD3
SCHEMBL11251423 0.82 FAAH (0.44) MAPK1L3MBTL1SLC2A1
SCHEMBL9069754 0.82 MAPT (0.39) MAPTRECQLHRH3MAPK1SMN1; SMN2
SCHEMBL10717745 0.82 LTA4H (0.47) SMN1; SMN2L3MBTL1DRD3
SCHEMBL9070331 0.81 MAPT (0.38) MAPTRECQLHRH3MAPK1SMN1; SMN2
SCHEMBL27697359 0.81 MAPT (0.40) MAPTRECQLHRH3MAPK1SMN1; SMN2
SCHEMBL9451044 0.80 PTGS2 (0.41) MAPTSMN1; SMN2SLC2A1DRD3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-8283390-A None JP disclosed
CN-114730706-A Method for manufacturing semiconductor device, dicing die-bonding integrated film, and method for manufacturing the same 昭和电工材料株式会社 2022-07-08 CN disclosed
CN-112292431-A Crystal cutting and crystal bonding integrated film and pressure-sensitive adhesive film used by same 昭和电工材料株式会社 2021-01-29 CN disclosed
CN-1737055-A Epoxy resin composition and its cured article NIPPON STEEL CHEMICAL CO (JP) 2006-02-22 CN disclosed
JP-H08283390-A PURIFICATION OF HYDROXYCARBOXYLIC ACID RESIN COMPOSITION MITSUI TOATSU CHEM INC 1996-10-29 JP disclosed