SCHEMBL986236

SCHEMBL986236

C=C(C)C(=O)OCCCC([SiH3])(OCC)OCC

nearest known ligand 0.53

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.53
THRB P10828 1/20 0.50
POLB P06746 1/20 0.38
APEX1 P27695 1/20 0.38
HTT P42858 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
ALDH1A1 P00352 3/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL486168 0.95 TSHR (0.56) TSHRTHRBPOLBAPEX1HTT
SCHEMBL21066735 0.94 TSHR (0.58) TSHRTHRBPOLBAPEX1HTT
SCHEMBL21066701 0.94 TSHR (0.58) TSHRTHRBPOLBAPEX1HTT
SCHEMBL17922843 0.90 THRB (0.53) TSHRTHRBPOLBAPEX1HTT
SCHEMBL4441169 0.89 TSHR (0.56) TSHRTHRBPOLBAPEX1HTT
SCHEMBL4358822 0.84 TSHR (0.46) TSHRTHRBPOLBAPEX1HTT
SCHEMBL419928 0.83 TSHR (0.51) TSHRTHRBPOLBAPEX1HTT
SCHEMBL23321949 0.81 TSHR (0.53) TSHRTHRBPOLBAPEX1HTT
SCHEMBL20555059 0.81 TSHR (0.50) TSHRTHRBPOLBAPEX1HTT
SCHEMBL9226776 0.80 TSHR (0.56) TSHRTHRBPOLBAPEX1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 542 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118221883-A Multilayer core-shell structure polymer and preparation method and application thereof 中化学科学技术研究有限公司 2024-06-21 CN claimed
EP-3452524-B1 WATER VAPOR-BLOCKING ADHESIVE COMPOUND HAVING HIGHLY FUNCTIONALIZED POLY(METH)ACRYLATE TESA SE (DE) 2021-03-03 EP claimed
CN-106866971-B Weather-resistant low-temperature-resistant organic silicon impact modifier and preparation method and application thereof 广东优科艾迪高分子材料有限公司 2020-05-05 CN claimed
US-7615594-B2 Graft copolymers and impact-resistant flame-retardant resin compositions containing the same KANEKA CORPORATION (JP) 2009-11-10 US claimed
US-5616753-A Stabilizers for unsaturated, polymerizable organosilicon compounds OSI SPECIALTIES, INC. (US) 1997-04-01 US claimed
US-12486371-B2 Thermally curable resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2025-12-02 US disclosed
US-12312323-B2 Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-05-27 US disclosed
CN-119866352-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 日本化药株式会社 2025-04-22 CN disclosed
EP-3212727-B1 ADHESIVE COMPOUNDS CONTAINING GETTER MATERIALS THAT CAN BE ACTIVATED TESA SE (DE) 2025-03-05 EP disclosed
US-12133339-B2 Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-10-29 US disclosed
WO-2024162319-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2024-08-08 WO disclosed
WO-2024162321-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2024-08-08 WO disclosed
EP-0355927-A2 A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1990-02-28 EP disclosed
US-4894415-A BLENDS, FRAFT COPOLYMERS, POLYALKYL (METH)ACRYLATE MITSUBISHI RAYON CO., LTD. (JP) 1990-01-16 US disclosed
US-4892900-A CONTAINING POLYSILOXANE GRAFT POLYMER, IMPROVED IMPACT STRENGTH MITSUBISHI RAYON CO., LTD. (JP) 1990-01-09 US disclosed
US-4888388-A BLENDS WITH POLYESTERS AND GRAFTED POLYSILOXANE-ACRYLIC POLYMERS MITSUBISHI RAYON COMPANY LIMITED (JP) 1989-12-19 US disclosed
US-4775712-A BLENDS WITH POLYSILOXANES-IMPACT STRENGTH, HEAT AND COLD RESISTANT, WEATHERPROOFING-MOLDING MATERIALS MITSUBISHI RAYON CO., LTD. (JP) 1988-10-04 US disclosed
EP-0260552-A2 Graft copolymer rubber and polyphenylene ether resin composition comprising this rubber. MITSUBISHI RAYON CO., LTD. (JP) 1988-03-23 EP disclosed
US-4690986-A Impact-resistant thermoplastic polyorganosiloxane-based graft copolymer and process for producing same MITSUBISHI RAYON CO., LTD. (JP) 1987-09-01 US disclosed
EP-0231776-A1 Thermoplastic polyester resin composition MITSUBISHI RAYON CO., LTD. (JP) 1987-08-12 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12312323-B2 Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device ASH2L, RER1, SEM1 TSHR 3751/4885THRB 3055/4885POLB 1609/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.