SCHEMBL98714

SCHEMBL98714

CCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S

nearest known ligand 0.35

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25709485 0.95 MMP1 (0.33) THRB
SCHEMBL13129067 0.93 THRB (0.32) THRB
SCHEMBL24650045 0.92 THRB (0.31) THRB
SCHEMBL869262 0.91 ALDH1A1 (0.34)
SCHEMBL25709446 0.91 ALDH1A1 (0.34)
SCHEMBL98537 0.90 MAPK1 (0.31)
SCHEMBL14262761 0.90 ALDH1A1 (0.33)
SCHEMBL25709353 0.89
SCHEMBL868170 0.85
SCHEMBL869642 0.85 ALDH1A1 (0.37)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 954 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4642651-A1 PHOSPHINE OXIDE-BASED PHOTOINITIATORS ARKEMA France (FR) 2025-11-05 EP claimed
WO-2024141190-A1 PHOSPHINE OXIDE-BASED PHOTOINITIATORS ARKEMA FRANCE (FR) 2024-07-04 WO claimed
US-12023640-B2 Aqueous dispersion of microcapsules, and uses thereof TAKASAGO INTERNATIONAL CORPORATION (JP) 2024-07-02 US claimed
US-11639428-B2 Hardcoat multilayer film RIKEN TECHNOS CORPORATION 2023-05-02 US claimed
US-11635692-B2 Resist underlying film forming composition NISSAN CHEMICAL CORPORATION (JP) 2023-04-25 US claimed
US-20230059522-A1 LATEX COMPOSITION, MOLDED BODY, AND METHOD FOR PRODUCING MOLDED BODY SHOWA DENKO K.K. (JP) 2023-02-23 US claimed
US-11572467-B2 Resin composition for acoustic matching layer, cured product, acoustic matching sheet, acoustic probe, acoustic measuring apparatus, method for producing acoustic probe, and acoustic matching layer material set FUJIFILM CORPORATION (JP) 2023-02-07 US claimed
US-20220387955-A1 AQUEOUS DISPERSION OF MICROCAPSULES, AND USES THEREOF TAKASAGO INTERNATIONAL CORPORATION (JP) 2022-12-08 US claimed
EP-4094827-A1 AQUEOUS DISPERSION OF MICROCAPSULES, AND USES THEREOF Takasago International Corporation (JP) 2022-11-30 EP claimed
US-11015007-B2 Active energy ray-curable composition and cured product thereof SHOWA DENKO K.K. (JP) 2021-05-25 US claimed
US-8865801-B2 Epoxy resin-based coating composition SHOWA DENKO K.K. (JP) 2014-10-21 US claimed
EP-1478668-B1 THIOL COMPOUND, PHOTOPOLYMERIZATION INITIATOR COMPOSITION AND PHOTOSENSITIVE COMPOSITION SHOWA DENKO KK (JP) 2013-04-10 EP claimed
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US claimed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP claimed
US-20120077903-A1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO K.K. (JP) 2012-03-29 US claimed
US-7989567-B2 Method for production of water/oil repellent composition and article ASAHI GLASS COMPANY, LIMITED (JP) 2011-08-02 US claimed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US claimed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP claimed
US-7341828-B2 Thiol compound, photopolymerization initiator composition and photosensitive composition SHOWA DENKO K.K. (JP) 2008-03-11 US claimed
US-20050153231-A1 Thiol compound, photopolymerization initiator composition and photosensitive composition SHOWA DENKO K.K. (JP) 2005-07-14 US claimed