SCHEMBL9908398

SCHEMBL9908398

O=C1OCCC1OC(=O)C(O)C1CC2CCC1C2

nearest known ligand 0.40

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.40
ALDH1A1 P00352 3/20 0.38
KDM4E B2RXH2 2/20 0.38
HPGD P15428 2/20 0.38
HSD17B10 Q99714 1/20 0.38
SMN1; SMN2 Q16637 2/20 0.36
MAPK1 P28482 3/20 0.35
CYP1A2 P05177 1/20 0.34
CYP2C9 P11712 1/20 0.34
CYP2C19 P33261 1/20 0.34
TDP1 Q9NUW8 2/20 0.34
CASP6 P55212 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9908400 0.75 ALDH1A1 (0.43) POLBALDH1A1KDM4EHPGDHSD17B10
SCHEMBL9908387 0.72 LMNA (0.33) POLBALDH1A1HPGDSMN1; SMN2
SCHEMBL7746827 0.70 POLB (0.56) POLBALDH1A1KDM4EHPGDHSD17B10
SCHEMBL7746830 0.70 POLB (0.56) POLBALDH1A1KDM4EHPGDHSD17B10
SCHEMBL12256175 0.70 POLB (0.49) POLBALDH1A1KDM4EHPGDHSD17B10
SCHEMBL7747755 0.70 POLB (0.56) POLBALDH1A1KDM4EHPGDHSD17B10
SCHEMBL18641576 0.68 POLB (0.49) POLBALDH1A1KDM4EHPGDHSD17B10
SCHEMBL17717479 0.68 POLB (0.54) POLBALDH1A1KDM4EHPGDHSD17B10
SCHEMBL12705164 0.68 POLB (0.54) POLBALDH1A1KDM4EHPGDHSD17B10
SCHEMBL9908405 0.68 HPGD (0.34) POLBALDH1A1HPGDSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9448482-B2 Pattern forming method, resist pattern formed by the method, method for manufacturing electronic device using the same, and electronic device FUJIFILM CORPORATION (JP) 2016-09-20 US disclosed
US-20150253673-A1 PATTERN FORMING METHOD, RESIST PATTERN FORMED BY THE METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE USING THE SAME, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2015-09-10 US disclosed
US-8198016-B2 Patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-06-12 US disclosed
US-20090286188-A1 Patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-11-19 US disclosed