SCHEMBL994717

SCHEMBL994717

CCCC(=O)C(CC)(CC)C(=O)O

nearest known ligand 0.43

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
HDAC3 O15379 4/20 0.43
HDAC1 Q13547 4/20 0.43
HDAC2 Q92769 4/20 0.43
HDAC8 Q9BY41 4/20 0.43
FFAR3 O14843 3/20 0.43
CES1 P23141 6/20 0.39
CES2 O00748 2/20 0.39
TSHR P16473 1/20 0.36
ALDH1A1 P00352 2/20 0.35
MEN1 O00255 2/20 0.35
CYP1A2 P05177 2/20 0.35
KMT2A Q03164 2/20 0.35
THRB P10828 1/20 0.35
FAAH O00519 8/20 0.33
AKR1B1 P15121 1/20 0.33
HDAC6 Q9UBN7 1/20 0.33
HSD17B10 Q99714 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1615829 0.98 HDAC3 (0.42) HDAC3HDAC1HDAC2HDAC8FFAR3
Butyl Alcohol SCHEMBL9150356 0.86 ALDH1A1 (0.41) HDAC3HDAC1HDAC2HDAC8FFAR3
SCHEMBL7347647 0.83 ALDH1A1 (0.43) HDAC3HDAC1HDAC2HDAC8FFAR3
SCHEMBL29152693 0.82 FAAH (0.55) CES1CES2TSHRALDH1A1MEN1
SCHEMBL31066793 0.79 SLC22A6 (0.48) TSHRALDH1A1MEN1CYP1A2KMT2A
SCHEMBL13545111 0.79 FFAR3 (0.40) FFAR3TSHRALDH1A1MEN1CYP1A2
SCHEMBL8838208 0.79 CES2 (0.38) CES1CES2ALDH1A1
SCHEMBL27642055 0.78 CES1 (0.38) HDAC3HDAC1HDAC2HDAC8FFAR3
SCHEMBL51201 0.78 FFAR3 (0.41) HDAC3HDAC1HDAC2HDAC8FFAR3
SCHEMBL29159521 0.78 ALDH1A1 (0.36) CES1CES2ALDH1A1MEN1CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 60 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0582472-B1 Non-magnetic particles TODA KOGYO CORP (JP) 1997-05-28 EP claimed
EP-0129069-B1 PROCESS FOR BONDING NON-POLAR OR HIGHLY CRYSTALLINE RESIN SUBSTRATS TO EACH OTHER OR TO ANOTHER MATERIAL TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1991-08-21 EP claimed
CN-116283690-B Compound and polymer with dynamic function formed by same 上海交通大学 2025-03-11 CN disclosed
CN-118043423-A Adhesive composition and laminate comprising same 综研化学株式会社 2024-05-14 CN disclosed
WO-2023119654-A1 NEGATIVE ELECTRODE, SECONDARY BATTERY, AND BATTERY PACK 株式会社 東芝 2023-06-29 WO disclosed
CN-116283690-A Compound and polymer with dynamic function formed by same 上海交通大学 2023-06-23 CN disclosed
WO-2022202173-A1 CURABLE RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2022-09-29 WO disclosed
CN-110249000-B Resin composition, molded body, laminate, gas barrier material, coating material, and adhesive DIC株式会社 2022-07-08 CN disclosed
CN-110291151-B Resin composition, molded body, laminate, coating material, and adhesive DIC株式会社 2022-05-06 CN disclosed
CN-110431186-B Resin composition, molded body, laminate, gas barrier material, coating material, and adhesive DIC株式会社 2022-02-25 CN disclosed
EP-3262110-A1 STORAGE-STABLE IMPREGNATING RESINS AND ELECTRICAL INSULATING TAPES Siemens Aktiengesellschaft (DE) 2018-01-03 EP disclosed
EP-1586295-A1 Cosmetic composition for skin, lips and / or nails. L'OREAL (FR) 2005-10-19 EP disclosed
EP-1572701-A1 PROCESS FOR THE PRODUCTION OF HYDROCARBYL SILYL CARBOXYLATE COMPOUNDS SIGMA COATINGS B.V. (NL) 2005-09-14 EP disclosed
US-20040187783-A1 Thin film forming apparatus and thin film forming method KONICA MINOLTA HOLDINGS, INC. (JP) 2004-09-30 US disclosed
WO-2004056837-A1 PROCESS FOR THE PRODUCTION OF HYDROCARBYL SILYL CARBOXYLATE COMPOUNDS SIGMA COATINGS B.V. (NL) 2004-07-08 WO disclosed
EP-0859021-A2 Epoxidised compositions DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1998-08-19 EP disclosed
US-5494977-A A CURABLE EPOXIDIZED POLYESTER, ADDITION POLYMER OR ADDITION-CONDENSATION COPOLYMER FORMED WITH AN ANHYDRIDE STARTING COMPOUND; SOFTENING TEMPERATURE; INKS, COATINGS, VARNISHES DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1996-02-27 US disclosed
EP-0540027-A2 Compositions, expoxidized compositions, a heat-curable resin composition, an epoxy resin composition, radically polymerized composition, a curable resin composition and a polymer having epoxy groups DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1993-05-05 EP disclosed
US-5110392-A PRIMER COMPOSITION CONTAINING AN ORGANOMETALLIC COMPOUND FOR BINDING SUBSTRATES WITH A CYANOCRYLATE ADHESIVE TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1992-05-05 US disclosed
US-4976785-A MODIFIED WITH ALUMINUM CHELATE NIPPON PAINT CO., LTD. (JP) 1990-12-11 US disclosed