SCHEMBL9973559

SCHEMBL9973559

CO[Si](C)(C)CC[Si](C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL331046 0.89
SCHEMBL13089578 0.81
SCHEMBL2866415 0.80
SCHEMBL1889271 0.78 LMNA (0.32)
SCHEMBL2739834 0.78
SCHEMBL17637294 0.77
SCHEMBL703801 0.76
SCHEMBL648313 0.76
SCHEMBL17539032 0.75
SCHEMBL13038578 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106010382-B Optical laminate and liquid crystal display device 住友化学株式会社 2020-03-27 CN disclosed
US-9605150-B2 Recording media and related methods PRESSTEK, LLC. (US) 2017-03-28 US disclosed
US-20160375712-A1 WATERLESS PRINTING MEMBERS AND RELATED METHODS PRESSTEK, INC. 2016-12-29 US disclosed
US-20160172240-A1 METHOD FOR FORMING A COUPLING LAYER NXP B.V. (NL) 2016-06-16 US disclosed
US-20140302690-A1 CHEMICAL LINKERS TO IMPART IMPROVED MECHANICAL STRENGTH TO FLOWABLE FILMS APPLIED MATERIALS, INC. (US) 2014-10-09 US disclosed
US-20130135800-A1 PACKAGE STRUCTURE OF ELECTRONIC MODULES WITH SILICONE SEALING FRAME PROLOGIUM HOLDING INC. (KY) 2013-05-30 US disclosed
US-20120156624-A1 WATERLESS PRINTING MEMBERS AND RELATED METHODS PRESSTEK, LLC 2012-06-21 US disclosed
US-20100261925-A1 METHOD FOR PRODUCING SILICON COMPOUND JSR CORPORATION (JP) 2010-10-14 US disclosed
US-20100174103-A1 MATERIAL FOR FORMING SILICON-CONTAINING FILM, AND SILICON-CONTAINING INSULATING FILM AND METHOD FOR FORMING THE SAME JSR CORPORATION (JP) 2010-07-08 US disclosed
US-20100140754-A1 FILM-FORMING MATERIAL, SILICON-CONTAINING INSULATING FILM AND METHOD FOR FORMING THE SAME JSR CORPORATION (JP) 2010-06-10 US disclosed