⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19615908 | 0.82 | — | — | |
| SCHEMBL9186532 | 0.76 | LMNA (0.40) | — | |
| SCHEMBL2548792 | 0.76 | THRB (0.33) | — | |
| SCHEMBL2481094 | 0.69 | — | — | |
| SCHEMBL13130048 | 0.69 | ALDH1A1 (0.50) | — | |
| SCHEMBL15315 | 0.69 | — | — | |
| SCHEMBL5136351 | 0.69 | — | — | |
| SCHEMBL270137 | 0.69 | — | — | |
| SCHEMBL6687011 | 0.67 | — | — | |
| SCHEMBL6378821 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-105829931-B | Optical waveguide photosensitive polymer combination, optical waveguide core layer formation photo-curable film, optical waveguide and flexible print wiring board | 日东电工株式会社 | 2019-06-14 | — | — | CN | claimed |
| CN-110520766-A | Array of optical components with adhesive layer | DAICEL CORP | 2019-11-29 | — | — | CN | disclosed |
| CN-106062631-B | Radiation sensitive resin composition and electronic component | 日本瑞翁株式会社 | 2019-11-22 | — | — | CN | disclosed |
| CN-110461571-A | Method for manufacturing resin molded article and method for manufacturing optical component | DAICEL CORP | 2019-11-15 | — | — | CN | disclosed |
| CN-105474096-B | Radiation-sensitive resin composition, resin film, and electronic component | 日本瑞翁株式会社 | 2019-11-12 | — | — | CN | disclosed |
| CN-110418704-A | Silicone mold | DAICEL CORP | 2019-11-05 | — | — | CN | disclosed |
| CN-106164773-B | Radiation sensitive resin composition, resin film and electronic component | ZEON CORP. (JP) | 2019-11-01 | — | — | CN | disclosed |
| CN-110140425-A | Sealing organic electroluminescent element composition | 株式会社大赛璐 | 2019-08-16 | — | — | CN | disclosed |
| CN-109843994-A | Sheet prepreg | 株式会社大赛璐 | 2019-06-04 | — | — | CN | disclosed |
| EP-2272541-A1 | AROMATIC AGENT COMPOSITION FOR OPENABLE STORAGE SPACE | Kobayashi Pharmaceutical Co., Ltd. (JP) | 2011-01-12 | — | — | EP | disclosed |
| EP-2263700-A1 | AROMATIC AGENT COMPOSITION FOR OPENABLE STORAGE SPACE | Kobayashi Pharmaceutical Co., Ltd. (JP) | 2010-12-22 | — | — | EP | disclosed |
| US-5763690-A | MIXING REACTION PRODUCT OF BUTYRALDEHYDE AND FORNMALDEHYDE WITH LOWER ALCOHOLS PRIOR TO CATALYZED HYDROGENATION | ARISTECH CHEMICAL CORPORATION (US) | 1998-06-09 | — | — | US | disclosed |