Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PGK1 | P00558 | 1/20 | 0.33 |
| ▸ | PGK2 | P07205 | 1/20 | 0.33 |
| ▸ | RAPGEF4 | Q8WZA2 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16707367 | 0.83 | PGK1 (0.31) | PGK1PGK2 | |
| SCHEMBL28255936 | 0.83 | ACHE (0.39) | — | |
| Bromide SCHEMBL28807681 | 0.81 | CYP3A4 (0.37) | — | |
| SCHEMBL11406384 | 0.79 | AR (0.41) | PGK1PGK2 | |
| SCHEMBL9140039 | 0.78 | PGK1 (0.31) | PGK1PGK2 | |
| SCHEMBL24716330 | 0.78 | CYP1A2 (0.35) | — | |
| SCHEMBL10001971 | 0.77 | AR (0.30) | — | |
| SCHEMBL13816869 | 0.74 | TRPA1 (0.35) | — | |
| SCHEMBL11747128 | 0.74 | SMN1; SMN2 (0.38) | PGK1PGK2 | |
| SCHEMBL10993439 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 60 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117402172-A | Synthesis method of 3, 6-bis (trifluoromethyl) -pyromellitic dianhydride | 中国科学院上海有机化学研究所 | 2024-01-16 | — | — | CN | claimed |
| CN-117402172-A | Synthesis method of 3, 6-bis (trifluoromethyl) -pyromellitic dianhydride | 中国科学院上海有机化学研究所 | 2024-01-16 | — | — | CN | disclosed |
| CN-117402172-A | Synthesis method of 3, 6-bis (trifluoromethyl) -pyromellitic dianhydride | 中国科学院上海有机化学研究所 | 2024-01-16 | — | — | CN | disclosed |
| CN-117384121-A | Preparation method of 2,2' -di (trifluoromethyl) -4,4', 5' -biphenyl dianhydride | 中国科学院上海有机化学研究所 | 2024-01-12 | — | — | CN | disclosed |
| US-11319410-B2 | Precursor for polyimide and use thereof | ETERNAL MATERIALS CO., LTD. (TW) | 2022-05-03 | — | — | US | disclosed |
| US-11034797-B2 | Polyimide precursor composition, use thereof and polyimide made therefrom | ETERNAL MATERIALS CO., LTD. (TW) | 2021-06-15 | — | — | US | disclosed |
| US-20210079161-A1 | POLYIMIDE PRECURSOR COMPOSITION, USE THEREOF AND POLYIMIDE MADE THEREFROM | ETERNAL MATERIALS CO., LTD. (TW) | 2021-03-18 | — | — | US | disclosed |
| US-10731004-B2 | Polyimide precursor composition and use thereof | ETERNAL MATERIALS CO., LTD. (TW) | 2020-08-04 | — | — | US | disclosed |
| US-10696793-B2 | Process for preparing polyimides | ETERNAL MATERIALS CO., LTD. (TW) | 2020-06-30 | — | — | US | disclosed |
| US-10626220-B2 | Precursor for polyimide and use thereof | ETERNAL MATERIALS CO., LTD. (TW) | 2020-04-21 | — | — | US | disclosed |
| US-20100086871-A1 | PHOTOSENSITIVE POLYIMIDES | ETERNAL CHEMICAL CO., LTD. | 2010-04-08 | — | — | US | disclosed |
| US-20100086874-A1 | Photosensitive polymides | ETERNAL CHEMICAL CO., LTD. (TW) | 2010-04-08 | — | — | US | disclosed |
| US-20100086874-A1 | Photosensitive polymides | ETERNAL CHEMICAL CO., LTD. (TW) | 2010-04-08 | — | — | US | disclosed |
| WO-2010001780-A1 | HEAT-RESISTANT RESIN PRECURSOR AND PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME | 旭化成イーマテリアルズ株式会社 (JP) | 2010-01-07 | — | — | WO | disclosed |
| US-20090181324-A1 | PHOTOSENSITIVE POLYIMIDES | ETERNAL CHEMICAL CO., LTD. | 2009-07-16 | — | — | US | disclosed |
| US-20090181324-A1 | PHOTOSENSITIVE POLYIMIDES | ETERNAL CHEMICAL CO., LTD. | 2009-07-16 | — | — | US | disclosed |
| US-20080103275-A1 | Negative photosensitive polyimide polymer and uses thereof | ETERNAL CHEMICAL CO., LTD. | 2008-05-01 | — | — | US | disclosed |
| US-20080103275-A1 | Negative photosensitive polyimide polymer and uses thereof | ETERNAL CHEMICAL CO., LTD. | 2008-05-01 | — | — | US | disclosed |
| US-20080096997-A1 | Amic acid ester oligomer precursor composition for polyimide resin containing the same, and uses | ETERNAL MATERIALS CO., LTD. (TW) | 2008-04-24 | — | — | US | disclosed |
| US-20080096997-A1 | Amic acid ester oligomer precursor composition for polyimide resin containing the same, and uses | ETERNAL MATERIALS CO., LTD. (TW) | 2008-04-24 | — | — | US | disclosed |