SCHEMBL10018

SCHEMBL10018

c1ccc(-c2cnn[nH]2)cc1

nearest known ligand 0.46

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
SCN4A P35499 1/20 0.46
CYP3A4 P08684 1/20 0.45
IDO1 P14902 1/20 0.45
NPY5R Q15761 4/20 0.43
SCN2A Q99250 2/20 0.43
POLB P06746 1/20 0.43
RAB9A P51151 1/20 0.43
MASP2 O00187 1/20 0.42
HPGDS O60760 3/20 0.39
AKT1 P31749 2/20 0.38
AKT2 P31751 2/20 0.38
LMNA P02545 1/20 0.38
ALDH1A1 P00352 1/20 0.36
PDE10A Q9Y233 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17283676 0.96 SCN4A (0.43) SCN4ACYP3A4IDO1NPY5RSCN2A
SCHEMBL13411815 0.87 POLB (0.33) SCN4ACYP3A4IDO1POLBALDH1A1
SCHEMBL3175390 0.84 SCN4A (0.45) SCN4ACYP3A4IDO1NPY5RSCN2A
SCHEMBL8780980 0.83 METAP2 (0.42) SCN4ACYP3A4IDO1AKT1AKT2
SCHEMBL4806159 0.79 PDPK1 (0.50) IDO1NPY5RAKT1LMNA
SCHEMBL1509473 0.79 CYP2A6 (0.58) CYP3A4IDO1NPY5RHPGDSLMNA
SCHEMBL15288191 0.78 PLK4 (0.36) IDO1POLBAKT1AKT2LMNA
SCHEMBL5020178 0.77 ASIC3 (0.48) CYP3A4RAB9ALMNAALDH1A1
SCHEMBL1187135 0.77 RPS6KA3 (0.42) RAB9A
SCHEMBL5020208 0.77 METAP2 (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 250 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118244583-A Negative photosensitive polyimide precursor resin composition 深圳先进电子材料国际创新研究院 2024-06-25 CN claimed
CN-118240213-A Negative photosensitive polyimide precursor and composition thereof 深圳先进电子材料国际创新研究院 2024-06-25 CN claimed
WO-2026100338-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN 旭化成株式会社 2026-05-15 WO disclosed
WO-2026100079-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2026-05-15 WO disclosed
WO-2026100734-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2026-05-15 WO disclosed
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-28 US disclosed
US-20260063999-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-03-05 US disclosed
US-20260036904-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-02-05 US disclosed
US-12504688-B2 Negative photosensitive resin composition and method for manufacturing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-12-23 US disclosed
US-20250370339-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-12-04 US disclosed
US-20250341778-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-11-06 US disclosed
EP-0920966-A2 A process for devolatilization UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION (US) 1999-06-09 EP disclosed
EP-0650505-B1 PRODUCTION OF ENCAPSULATED CHEMICAL FOAMING CONCENTRATES GAIA RES LP (US) 1998-09-30 EP disclosed
US-5621015-A BLENDING GLYCEROL TRISTEARATE GAIA RESERCH LIMITED PARTNERSHIP (US) 1997-04-15 US disclosed
US-5611962-A HIGH MELTING THERMOPLASTIC RESIN CARRIER AND ORGANIC ACID AND BASE FOAMING AGENTS GAIA RESEARCH (US) 1997-03-18 US disclosed
US-5609892-A Apparatus for the production of encapsulated foaming concentrates GAIA RESEARCH (US) 1997-03-11 US disclosed
EP-0705863-A1 Two stage melt polymerization process for making polybenzimidazoles HOECHST CELANESE CORPORATION (US) 1996-04-10 EP disclosed
EP-0650505-A1 PRODUCTION OF ENCAPSULATED CHEMICAL FOAMING CONCENTRATES GAIA RESEARCH L.P. (US) 1995-05-03 EP disclosed
WO-1993023463-A2 PRODUCTION OF ENCAPSULATED CHEMICAL FOAMING CONCENTRATES GAIA RESEARCH L.P. (US) 1993-11-25 WO disclosed
US-5234963-A Production of encapsulated chemical foaming concentrates GAIA RESEARCH (US) 1993-08-10 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ARCN1, GLRA1, PSMA1 SCN4A 1461/4885CYP3A4 4650/4885IDO1 2906/4885
US-20260036904-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE RER1, ASIC1, FRG1 SCN4A 1315/4885CYP3A4 3061/4885IDO1 2599/4885
US-20260063999-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ARCN1, PBRM1, LCP1 SCN4A 3007/4885CYP3A4 4411/4885IDO1 1848/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.