SCHEMBL10021501

SCHEMBL10021501

Nc1ccc(C(=O)Oc2ccc(-c3ccc(OC(=O)c4ccc(N)cc4)cc3)cc2)cc1

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PRSS1 P07477 7/20 0.65
F2 P00734 3/20 0.65
PRSS2 P07478 3/20 0.65
PRSS3 P35030 3/20 0.65
KMT2A Q03164 2/20 0.65
PKM P14618 1/20 0.65
PARP10 Q53GL7 2/20 0.55
NR1H4 Q96RI1 1/20 0.54
HSD17B10 Q99714 2/20 0.52
HGFAC Q04756 2/20 0.49
LMNA P02545 2/20 0.48
CYP1A2 P05177 2/20 0.48
CYP3A4 P08684 2/20 0.48
MAOA P21397 1/20 0.48
CYP2C9 P11712 1/20 0.47
TSHR P16473 1/20 0.47
CYP2C19 P33261 1/20 0.47
PDE4D Q08499 1/20 0.47
ACR P10323 5/20 0.46
MEN1 O00255 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22310501 1.00 PRSS1 (0.65) PRSS1F2PRSS2PRSS3KMT2A
SCHEMBL3143505 1.00 PRSS1 (0.65) PRSS1F2PRSS2PRSS3KMT2A
SCHEMBL107649 0.94 PRSS1 (0.71) PRSS1F2PRSS2PRSS3KMT2A
SCHEMBL347429 0.94 PRSS1 (0.71) PRSS1F2PRSS2PRSS3KMT2A
SCHEMBL346698 0.94 PRSS1 (0.71) PRSS1F2PRSS2PRSS3KMT2A
SCHEMBL9128037 0.93 F2 (0.58) PRSS1F2PRSS2PRSS3KMT2A
SCHEMBL28858885 0.93 HSD17B10 (0.59) PRSS1F2PRSS2PRSS3KMT2A
SCHEMBL3136588 0.93 PARP10 (0.62) PRSS1F2PRSS2PRSS3KMT2A
SCHEMBL23085069 0.91 PRSS1 (0.59) PRSS1F2PRSS2PRSS3KMT2A
SCHEMBL3144272 0.91 KMT2A (0.56) PRSS1F2PRSS2PRSS3KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260071029-A1 POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM AND POLYIMIDE/SUBSTRATE LAMINATE UBE CORP (JP) 2026-03-12 US disclosed
US-20250243324-A1 POLYIMIDE PRECURSOR COMPOSITION AND METHOD FOR PRODUCING THE SAME UBE CORPORATION (JP) 2025-07-31 US disclosed
US-20250215153-A1 POLYIMIDE PRECURSOR COMPOSITION FOR FLEXIBLE WIRING BOARDS, POLYIMIDE FILM, AND POLYIMIDE METAL LAMINATE UBE CORPORATION (JP) 2025-07-03 US disclosed
US-20250206883-A1 POLYIMIDE PRECURSOR COMPOSITION FOR FLEXIBLE WIRING BOARDS, POLYIMIDE FILM, AND POLYIMIDE METAL LAMINATE UBE CORPORATION (JP) 2025-06-26 US disclosed
US-20250112240-A1 POLYIMIDE BINDER PRECURSOR COMPOSITION, AND POWER STORAGE DEVICE USING SAME UBE CORPORATION (JP) 2025-04-03 US disclosed
EP-4468418-A1 POLYIMIDE BINDER PRECURSOR COMPOSITION, AND POWER STORAGE DEVICE USING SAME UBE Corporation (JP) 2024-11-27 EP disclosed
US-20240158578-A1 POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE FILM UBE CORPORATION (JP) 2024-05-16 US disclosed
US-11667754-B2 Tetracarboxylic dianhydride, carbonyl compound, polyimide precursor resin, and polyimide ENEOS CORPORATION (JP) 2023-06-06 US disclosed
CN-110628025-B Polyimide precursor, polyimide, and material for use in production thereof 宇部兴产株式会社 2022-07-12 CN disclosed
US-10781288-B2 Polyimide precursor and polyimide UBE INDUSTRIES, LTD. (JP) 2020-09-22 US disclosed
EP-2597111-A1 POLYIMIDE PRECURSOR, POLYIMIDE, AND MATERIALS TO BE USED IN PRODUCING SAME Ube Industries, Ltd. (JP) 2013-05-29 EP disclosed
US-20130012620-A1 CURING AGENTS FOR EPOXY RESINS DESIGNER MOLECULES, INC. (US) 2013-01-10 US disclosed
US-20130012620-A1 CURING AGENTS FOR EPOXY RESINS DESIGNER MOLECULES, INC. (US) 2013-01-10 US disclosed
US-8288591-B2 Curing agents for epoxy resins DESIGNER MOLECULES, INC. (US) 2012-10-16 US disclosed
US-8288591-B2 Curing agents for epoxy resins DESIGNER MOLECULES, INC. (US) 2012-10-16 US disclosed
US-20120015298-A1 PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2012-01-19 US disclosed
US-20120015298-A1 PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2012-01-19 US disclosed
US-20100144977-A1 CURING AGENTS FOR EPOXY RESINS DESIGNER MOLECULES, INC. (US) 2010-06-10 US disclosed
US-20100144977-A1 CURING AGENTS FOR EPOXY RESINS DESIGNER MOLECULES, INC. (US) 2010-06-10 US disclosed
EP-1092721-B1 Chiral glucosides and their use as chiral dopants for the production of cholesteric liquid crystalline compositions BASF AG (DE) 2007-12-19 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260071029-A1 POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM AND POLYIMIDE/SUBSTRATE LAMINATE SMC1A, F11, F12 PRSS1 2220/4885F2 268/4885PRSS2 2163/4885
US-11667754-B2 Tetracarboxylic dianhydride, carbonyl compound, polyimide precursor resin, and polyimide ELL, EED, DIS3 PRSS1 3881/4885F2 824/4885PRSS2 3116/4885
US-10781288-B2 Polyimide precursor and polyimide PKN2, PKN1, PCLAF PRSS1 1514/4885F2 349/4885PRSS2 1485/4885
US-20130012620-A1 CURING AGENTS FOR EPOXY RESINS DOT1L, EHMT1, ASH1L PRSS1 3472/4885F2 1820/4885PRSS2 3109/4885
US-20100144977-A1 CURING AGENTS FOR EPOXY RESINS PTGER3, PTGER4, ELL PRSS1 3579/4885F2 727/4885PRSS2 3341/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.