SCHEMBL107649

SCHEMBL107649

Nc1ccc(C(=O)Oc2ccc(OC(=O)c3ccc(N)cc3)cc2)cc1

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PRSS1 P07477 8/20 0.71
F2 P00734 3/20 0.71
PRSS2 P07478 3/20 0.71
PRSS3 P35030 3/20 0.71
KMT2A Q03164 2/20 0.71
PKM P14618 1/20 0.71
PARP10 Q53GL7 2/20 0.60
NR1H4 Q96RI1 1/20 0.58
HSD17B10 Q99714 1/20 0.57
LMNA P02545 2/20 0.53
CYP1A2 P05177 2/20 0.53
CYP3A4 P08684 2/20 0.53
MAOA P21397 1/20 0.53
HGFAC Q04756 2/20 0.53
CYP2C9 P11712 1/20 0.52
TSHR P16473 1/20 0.52
CYP2C19 P33261 1/20 0.52
PDE4D Q08499 1/20 0.52
ACR P10323 6/20 0.50
MEN1 O00255 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL346698 1.00 PRSS1 (0.71) PRSS1F2PRSS2PRSS3KMT2A
SCHEMBL347429 1.00 PRSS1 (0.71) PRSS1F2PRSS2PRSS3KMT2A
SCHEMBL3143505 0.94 PRSS1 (0.65) PRSS1F2PRSS2PRSS3KMT2A
SCHEMBL28283207 0.94 PRSS1 (0.65) PRSS1F2PRSS2PRSS3KMT2A
SCHEMBL22310501 0.94 PRSS1 (0.65) PRSS1F2PRSS2PRSS3KMT2A
SCHEMBL10021501 0.94 PRSS1 (0.65) PRSS1F2PRSS2PRSS3KMT2A
SCHEMBL9148082 0.92 PARP10 (0.68) PRSS1F2PRSS2PRSS3KMT2A
SCHEMBL8585571 0.92 PRSS1 (0.63) PRSS1F2PRSS2PRSS3KMT2A
SCHEMBL9003587 0.92 PRSS1 (0.63) PRSS1F2PRSS2PRSS3KMT2A
SCHEMBL9003865 0.92 F2 (0.63) PRSS1F2PRSS2PRSS3KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 297 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4628461-A1 POLY(AMIC ACID) SLURRY FOR OPTICAL FIBERS, PREPARATION METHOD THEREFOR, AND APPLICATION THEREOF Ningbo Boya Poly Advanced Materials Co., Ltd. (CN) 2025-10-08 EP claimed
WO-2025105900-A1 LOW DIELECTRIC POLYIMIDE FILM USING MONOMER HAVING ESTER GROUP AND MANUFACTURING METHOD THEREOF 피아이첨단소재 주식회사 2025-05-22 WO claimed
WO-2025100921-A1 POLISHING PAD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE BY USING SAME 에스케이엔펄스 주식회사 2025-05-15 WO claimed
CN-119978369-A Polyimide film for optical fiber and preparation method thereof 宁波博雅聚力新材料科技有限公司 2025-05-13 CN claimed
US-20250144766-A1 POLISHING PAD AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME ENPULSE CO., LTD. (KR) 2025-05-08 US claimed
US-20250144767-A1 POLISHING PAD WITH EXCELLENT RECYCLABILITY AND PYROLYSIS OIL OBTAINED THEREFROM ENPULSE CO., LTD. (KR) 2025-05-08 US claimed
EP-4549090-A1 POLISHING PAD WITH EXCELLENT RECYCLABILITY AND PYROLYSIS OIL OBTAINED THEREFROM SK enpulse Co., Ltd. (KR) 2025-05-07 EP claimed
CN-119391016-A Polyimide film and preparation method thereof 安徽国风新材料股份有限公司 2025-02-07 CN claimed
US-20250033160-A1 POLISHING PAD WITH REDUCED DEFECT AND METHOD OF PREPARING A SEMICONDUCTOR DEVICE USING THE SAME ENPULSE CO., LTD. (KR) 2025-01-30 US claimed
CN-119264868-A Polyimide mixed glue containing graphite and graphene and preparation process thereof 李恒飞 2025-01-07 CN claimed
CN-112745504-B Poly (imide-ester-amide) copolymer and optical film 达兴材料股份有限公司 2024-01-19 CN claimed
CN-111770949-B Polyimide, polyimide solution composition, polyimide film, and substrate UBE株式会社 2024-01-16 CN claimed
CN-117384406-A Transparent polyimide film with high cohesiveness, preparation method and application 苏州尊尔光电科技有限公司 2024-01-12 CN claimed
CN-116925352-A High-transparency low-yellowing high-performance polyamide acid resin and preparation method of polyimide film 山东理工大学 2023-10-24 CN claimed
CN-116496623-A Resin composition, polyimide preparation method and related products 瑞声科技(南京)有限公司 2023-07-28 CN claimed
CN-116333310-A TPI resin and preparation method and application thereof 广州方邦电子股份有限公司 2023-06-27 CN claimed
CN-112692725-B Composition for polishing pad and polishing pad SKC索密思株式会社 2023-05-16 CN claimed
US-20210122007-A1 COMPOSITION FOR POLISHING PAD AND POLISHING PAD ENPULSE CO., LTD. (KR) 2021-04-29 US claimed
CN-112692725-A Composition for polishing pad and polishing pad SKC索密思株式会社 2021-04-23 CN claimed
US-20210087319-A1 POLYIMIDE FILM, BLOCK COPOLYMER OF POLYAMIDE ACID, AND METHOD FOR MANUFACTURING THE BLOCK COPOLYMER OF POLYAMIDE ACID Zhen Ding Technology Co., Ltd. (TW) 2021-03-25 US claimed