SCHEMBL10046291

SCHEMBL10046291

c1ccc(N2COc3ccc(-c4ccc5c(c4)CN(c4ccccc4)CO5)cc3C2)cc1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 3/20 0.43
NPC1 O15118 2/20 0.43
RAB9A P51151 2/20 0.43
VDR P11473 1/20 0.41
PIK3CA P42336 3/20 0.38
GPR142 Q7Z601 3/20 0.38
ACLY P53396 1/20 0.37
LMNA P02545 3/20 0.35
GAA P10253 2/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
CYP3A4 P08684 1/20 0.34
CYP2D6 P10635 1/20 0.34
HIF1A Q16665 1/20 0.34
MEN1 O00255 2/20 0.34
KMT2A Q03164 2/20 0.34
TSHR P16473 2/20 0.34
HSD17B10 Q99714 2/20 0.34
PKM P14618 1/20 0.34
GFER P55789 1/20 0.34
DYRK1A Q13627 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21160927 0.90 VDR (0.40) MAPTNPC1RAB9AVDRPIK3CA
SCHEMBL20865773 0.84 MAPT (0.41) MAPTNPC1RAB9AVDRACLY
SCHEMBL20345505 0.84 MAPT (0.41) MAPTNPC1RAB9AVDRACLY
SCHEMBL21437303 0.84 NPC1 (0.41) MAPTNPC1RAB9AVDRACLY
SCHEMBL15694713 0.84 MEN1 (0.46) MAPTNPC1RAB9AVDRACLY
SCHEMBL12645280 0.84 VDR (0.51) MAPTNPC1RAB9AVDRACLY
SCHEMBL24445717 0.83 LTB4R (0.41) ACLYMEN1KMT2APKMALDH1A1
SCHEMBL40317 0.83 NPC1 (0.40) MAPTNPC1RAB9AVDRACLY
SCHEMBL12451412 0.83 MAPT (0.40) MAPTNPC1RAB9AVDRACLY
SCHEMBL13168997 0.83 CYP3A4 (0.43) MAPTNPC1RAB9AVDRACLY

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 77 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11584824-B2 Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device ENEOS CORPORATION (JP) 2023-02-21 US disclosed
US-11578166-B2 Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device ENEOS CORPORATION (JP) 2023-02-14 US disclosed
US-11560465-B2 Composition for curable resin, cured product of said composition, method of producing said composition and said cured product, and semiconductor device ENEOS CORPORATION (JP) 2023-01-24 US disclosed
US-20220195188-A1 COMPOSITION FOR CURABLE RESINS, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE ENEOS CORPORATION (JP) 2022-06-23 US disclosed
US-20210301076-A1 COMPOSITION FOR CURABLE RESIN, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE ENEOS CORPORATION (JP) 2021-09-30 US disclosed
US-20210024748-A1 BENZOXAZINE RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES, INC. (JP) 2021-01-28 US disclosed
US-20200325270-A1 COMPOSITION FOR CURABLE RESIN, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE JXTG NIPPON OIL & ENERGY CORPORATION (JP) 2020-10-15 US disclosed
US-20200308340-A1 COMPOSITION FOR CURABLE RESIN, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE JXTG NIPPON OIL & ENERGY CORPORATION (JP) 2020-10-01 US disclosed
US-20200291173-A1 COMPOSITION FOR CURABLE RESIN, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE JXTG NIPPON OIL & ENERGY CORPORATION (JP) 2020-09-17 US disclosed
US-10752773-B2 Fiber-reinforced resin composite material and method for producing same Subaru Corporation (JP) 2020-08-25 US disclosed
US-8470918-B2 Epoxy resin composition and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2013-06-25 US disclosed
US-8324319-B2 Redox-induced cationically polymerizable compositions with low cure temperature HENKEL AG & CO. KGAA (DE) 2012-12-04 US disclosed
US-8324319-B2 Redox-induced cationically polymerizable compositions with low cure temperature HENKEL AG & CO. KGAA (DE) 2012-12-04 US disclosed
US-20120029116-A1 CURABLE ADHESIVE COMPOSITIONS, PROCESS, AND APPLICATIONS TRILLION SCIENCE, INC. (US) 2012-02-02 US disclosed
US-8084553-B2 Curable adhesive compositions, process, and applications TRILLION SCIENCE, INC. (US) 2011-12-27 US disclosed
US-20100222512-A1 Redox-Induced Cationically Polymerizable Compositions With Low Cure Temperature HENKEL AG & CO. KGAA (DE) 2010-09-02 US disclosed
US-20100222512-A1 Redox-Induced Cationically Polymerizable Compositions With Low Cure Temperature HENKEL AG & CO. KGAA (DE) 2010-09-02 US disclosed
US-20090215943-A1 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2009-08-27 US disclosed
US-20090215943-A1 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2009-08-27 US disclosed
US-20090181165-A1 Curable adhesive compositions, Process, and applications TRILLION SCIENCE, INC. (US) 2009-07-16 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20120029116-A1 CURABLE ADHESIVE COMPOSITIONS, PROCESS, AND APPLICATIONS RBX1, SUZ12, CDH1 MAPT 547/4885NPC1 4850/4885RAB9A 4443/4885
US-20200325270-A1 COMPOSITION FOR CURABLE RESIN, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE SEM1, SMARCA1, SMARCD2 MAPT 2475/4885NPC1 4513/4885RAB9A 4332/4885
US-11578166-B2 Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device SEM1, SMARCA1, SMARCD2 MAPT 2475/4885NPC1 4513/4885RAB9A 4332/4885
US-20090181165-A1 Curable adhesive compositions, Process, and applications RBX1, SUZ12, CDH1 MAPT 547/4885NPC1 4850/4885RAB9A 4443/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.