Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 5/20 | 0.43 |
| ▸ | CA1 | P00915 | 1/20 | 0.37 |
| ▸ | CA2 | P00918 | 1/20 | 0.37 |
| ▸ | FAAH | O00519 | 3/20 | 0.35 |
| ▸ | ATM | Q13315 | 2/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.35 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.35 |
| ▸ | PKM | P14618 | 1/20 | 0.35 |
| ▸ | HTT | P42858 | 1/20 | 0.35 |
| ▸ | COMT | P21964 | 1/20 | 0.35 |
| ▸ | IDH1 | O75874 | 1/20 | 0.35 |
| ▸ | POLB | P06746 | 2/20 | 0.34 |
| ▸ | GAA | P10253 | 3/20 | 0.34 |
| ▸ | LMNA | P02545 | 2/20 | 0.34 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.34 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.34 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.34 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.34 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.34 |
| ▸ | RECQL | P46063 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19291106 | 1.00 | MGLL (0.43) | MGLLCA1CA2FAAHATM | |
| SCHEMBL19003835 | 0.90 | CA1 (0.40) | MGLLCA1CA2FAAHALDH1A1 | |
| SCHEMBL19084203 | 0.82 | DDAH1 (0.53) | CA1CA2ALDH1A1POLBSMN1; SMN2 | |
| SCHEMBL24960497 | 0.81 | MGLL (0.36) | MGLLFAAHATMALDH1A1HSP90AA1 | |
| SCHEMBL23094941 | 0.81 | MGLL (0.56) | MGLLFAAHATMALDH1A1HSP90AA1 | |
| SCHEMBL21377555 | 0.80 | NPC1 (0.46) | MGLLCA2FAAHALDH1A1POLB | |
| SCHEMBL18546007 | 0.79 | MGLL (0.61) | MGLLFAAHATMALDH1A1HSP90AA1 | |
| SCHEMBL19084202 | 0.78 | VHL (0.39) | MGLLCA1CA2FAAH | |
| SCHEMBL23616010 | 0.77 | KMT2A (0.49) | CA1CA2ALDH1A1LMNAKDM4E | |
| SCHEMBL25841170 | 0.77 | ALDH1A1 (0.50) | ALDH1A1HSP90AA1HTTPOLBGAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12037507-B2 | Resin composition for generating allylphenol-maleimide copolymer for electronic component protective film, and electronic component protective film comprising this copolymer | OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) | 2024-07-16 | — | — | US | disclosed |
| US-20230331944-A1 | RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLADDED LAMINATE BOARD, AND WIRING BOARD | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2023-10-19 | — | — | US | disclosed |
| US-20230323104-A1 | RESIN COMPOSITION, PREPREG, FILM PROVIDED WITH RESIN, METAL FOIL PROVIDED WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2023-10-12 | — | — | US | disclosed |
| US-11767287-B2 | Compound and method for producing the same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-09-26 | — | — | US | disclosed |
| US-11760876-B2 | Resin composition and article made therefrom | Elite Material Co., Ltd. (TW) | 2023-09-19 | — | — | US | disclosed |
| WO-2023063277-A1 | RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR CHIP HAVING RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR CHIP HAVING RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2023-04-20 | — | — | WO | disclosed |
| US-20230057045-A1 | COMPOUND AND METHOD FOR PRODUCING THE SAME, RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-02-23 | — | — | US | disclosed |
| US-11573491-B2 | Negative tone photosensitive composition for EUV light, pattern forming method, and method for manufacturing electronic device | FUJIFILM CORPORATION (JP) | 2023-02-07 | — | — | US | disclosed |
| US-20230023832-A1 | COPOLYMER AND LAMINATE CONTAINING SAME | DENKA COMPANY LIMITED (JP) | 2023-01-26 | — | — | US | disclosed |
| WO-2022264987-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2022-12-22 | — | — | WO | disclosed |
| US-20180163048-A1 | METHOD FOR PRODUCING PRINTED CIRCUIT BOARD, AND RESIN COMPOSITION | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-06-14 | — | — | US | disclosed |
| US-9952361-B2 | IR cut filter, method for manufacturing the same, and solid-state imaging device | FUJIFILM CORPORATION (JP) | 2018-04-24 | — | — | US | disclosed |
| US-9902851-B2 | Resin composition, prepreg, laminate, and printed wiring board | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-02-27 | — | — | US | disclosed |
| US-9905328-B2 | Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-02-27 | — | — | US | disclosed |
| US-20170346075-A1 | SOLID ELECTROLYTE COMPOSITION, ELECTRODE SHEET FOR BATTERY USING THE SAME, ALL SOLID STATE SECONDARY BATTERY, METHOD FOR MANUFACTURING ELECTRODE SHEET FOR BATTERY, AND METHOD FOR MANUFACTURING ALL SOLID STATE SECONDARY BATTERY | FUJIFILM CORPORATION (JP) | 2017-11-30 | — | — | US | disclosed |
| EP-2042921-B1 | Pigment dispersion composition, photocurable composition and color filter | FUJIFILM CORP (JP) | 2017-10-25 | — | — | EP | disclosed |
| EP-2947122-B1 | RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL CO (JP) | 2017-08-30 | — | — | EP | disclosed |
| US-20170101532-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR ENCAPSULATING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, BUILD-UP SUBSTRATE, FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED RESIN MOLDED PRODUCT | DIC CORPORATION (JP) | 2017-04-13 | — | — | US | disclosed |
| WO-2017027358-A1 | TRICYCLIC COMPOUNDS AND THEIR USE IN THE TREATMENT OF CANCER | ARNER, Elias, Set Jenö (SE) | 2017-02-16 | — | — | WO | disclosed |
| US-20120082840-A1 | THERMALLY REVERSIBLE HOT MELT ADHESIVE COMPOSITION CONTAINING MULTIFUNCTIONAL DIENE AND DIENOPHILE COMPOUNDS | HENKEL CORPORATION (US) | 2012-04-05 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-11767287-B2 | Compound and method for producing the same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | ASH2L, ASH1L, SMARCB1 | MGLL 3319/4885CA1 2585/4885CA2 4372/4885 |
| US-20230057045-A1 | COMPOUND AND METHOD FOR PRODUCING THE SAME, RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | ASH2L, ASH1L, SMARCB1 | MGLL 3319/4885CA1 2585/4885CA2 4372/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.