Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 2/20 | 0.51 |
| ▸ | TSHR | P16473 | 1/20 | 0.47 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.47 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.42 |
| ▸ | RAB9A | P51151 | 1/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.40 |
| ▸ | PKM | P14618 | 1/20 | 0.40 |
| ▸ | POLB | P06746 | 2/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.38 |
| ▸ | GAA | P10253 | 1/20 | 0.38 |
| ▸ | MAPT | P10636 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10098936 | 0.91 | LMNA (0.52) | LMNATSHRMAPK1KMT2ARAB9A | |
| SCHEMBL10098944 | 0.85 | LMNA (0.49) | LMNATSHRKMT2ARAB9AALDH1A1 | |
| SCHEMBL10098937 | 0.83 | SMN1; SMN2 (0.52) | LMNAKMT2ARAB9AALDH1A1PKM | |
| SCHEMBL10098942 | 0.77 | TP53 (0.40) | TSHRKMT2AALDH1A1SMN1; SMN2GAA | |
| SCHEMBL10098938 | 0.76 | ALDH1A1 (0.46) | LMNAKMT2ARAB9AALDH1A1POLB | |
| SCHEMBL10098932 | 0.74 | CHRNB2 (0.36) | LMNATSHRMAPK1ALDH1A1SMN1; SMN2 | |
| SCHEMBL12221373 | 0.73 | LMNA (0.51) | LMNAKMT2AALDH1A1POLBSMN1; SMN2 | |
| SCHEMBL1218625 | 0.73 | POLB (0.64) | LMNAMAPK1KMT2ARAB9AALDH1A1 | |
| SCHEMBL12221387 | 0.71 | LMNA (0.47) | LMNAKMT2ARAB9AALDH1A1PKM | |
| SCHEMBL10098934 | 0.71 | ALDH1A1 (0.49) | LMNAKMT2ARAB9AALDH1A1POLB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8470913-B2 | Thermosetting resin composition and cured product of the same | DIC CORPORATION (JP) | 2013-06-25 | — | — | US | disclosed |
| US-8222365-B2 | Polyamideimide resin, as well as a colorless and transparent flexible metal-clad laminate and circuit board obtained therefrom | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2012-07-17 | — | — | US | disclosed |
| US-20120142829-A1 | THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT OF THE SAME | DIC CORPORATION (JP) | 2012-06-07 | — | — | US | disclosed |
| US-20100018756-A1 | POLYAMIDEIMIDE RESIN, AS WELL AS A COLORLESS AND TRANSPARENT FLEXIBLE METAL-CLAD LAMINATE AND CIRCUIT BOARD OBTAINED THEREFROM | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2010-01-28 | — | — | US | disclosed |