Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CHRNB2 | P17787 | 2/20 | 0.36 |
| ▸ | CHRNA4 | P43681 | 2/20 | 0.36 |
| ▸ | CHRNA7 | P36544 | 1/20 | 0.36 |
| ▸ | CHRNB4 | P30926 | 1/20 | 0.35 |
| ▸ | CHRNA3 | P32297 | 1/20 | 0.35 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.33 |
| ▸ | BCHE | P06276 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | HPGD | P15428 | 1/20 | 0.31 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.31 |
| ▸ | RXFP1 | Q9HBX9 | 1/20 | 0.31 |
| ▸ | LTA4H | P09960 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19263933 | 0.81 | ACHE (0.30) | LMNAALDH1A1 | |
| SCHEMBL26590835 | 0.80 | BRD4 (0.44) | CHRNB2CHRNA4CHRNA7CHRNB4CHRNA3 | |
| SCHEMBL10098944 | 0.78 | LMNA (0.49) | LMNATSHRALDH1A1SMN1; SMN2 | |
| SCHEMBL10098934 | 0.77 | ALDH1A1 (0.49) | LMNAALDH1A1SMN1; SMN2KDM4EHPGD | |
| SCHEMBL10098935 | 0.74 | LMNA (0.56) | LMNAALDH1A1SMN1; SMN2KDM4EHPGD | |
| SCHEMBL10098937 | 0.74 | SMN1; SMN2 (0.52) | LMNAALDH1A1SMN1; SMN2 | |
| SCHEMBL10098933 | 0.74 | LMNA (0.51) | LMNATSHRMAPK1ALDH1A1SMN1; SMN2 | |
| SCHEMBL19423931 | 0.74 | — | — | |
| SCHEMBL10098938 | 0.74 | ALDH1A1 (0.46) | LMNAALDH1A1SMN1; SMN2KDM4EHPGD | |
| SCHEMBL21423317 | 0.73 | GAA (0.34) | ALDH1A1SMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2540759-B1 | Thermosetting resin composition and cured product of the same | DAINIPPON INK & CHEMICALS (JP) | 2014-08-06 | — | — | EP | disclosed |
| EP-2436734-B1 | THERMOSETTING RESIN COMPOSITE AND CURED PRODUCT THEREOF | DAINIPPON INK & CHEMICALS (JP) | 2014-07-23 | — | — | EP | disclosed |
| US-8470913-B2 | Thermosetting resin composition and cured product of the same | DIC CORPORATION (JP) | 2013-06-25 | — | — | US | disclosed |
| US-8470913-B2 | Thermosetting resin composition and cured product of the same | DIC CORPORATION (JP) | 2013-06-25 | — | — | US | disclosed |
| EP-2540759-A2 | Thermosetting resin composition and cured product of the same | DIC Corporation (JP) | 2013-01-02 | — | — | EP | disclosed |
| US-8222365-B2 | Polyamideimide resin, as well as a colorless and transparent flexible metal-clad laminate and circuit board obtained therefrom | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2012-07-17 | — | — | US | disclosed |
| US-8222365-B2 | Polyamideimide resin, as well as a colorless and transparent flexible metal-clad laminate and circuit board obtained therefrom | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2012-07-17 | — | — | US | disclosed |
| US-20120142829-A1 | THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT OF THE SAME | DIC CORPORATION (JP) | 2012-06-07 | — | — | US | disclosed |
| US-20120142829-A1 | THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT OF THE SAME | DIC CORPORATION (JP) | 2012-06-07 | — | — | US | disclosed |
| US-20100018756-A1 | POLYAMIDEIMIDE RESIN, AS WELL AS A COLORLESS AND TRANSPARENT FLEXIBLE METAL-CLAD LAMINATE AND CIRCUIT BOARD OBTAINED THEREFROM | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2010-01-28 | — | — | US | disclosed |
| US-20100018756-A1 | POLYAMIDEIMIDE RESIN, AS WELL AS A COLORLESS AND TRANSPARENT FLEXIBLE METAL-CLAD LAMINATE AND CIRCUIT BOARD OBTAINED THEREFROM | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2010-01-28 | — | — | US | disclosed |