SCHEMBL10098935

SCHEMBL10098935

Cc1ccc(Cc2ccc(NC(=O)C3CCC4C(=O)N(C)C(=O)C4C3)cc2)cc1

nearest known ligand 0.56

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
LMNA P02545 5/20 0.56
KMT2A Q03164 3/20 0.56
MEN1 O00255 2/20 0.56
SMN1; SMN2 Q16637 5/20 0.50
GLA P06280 1/20 0.49
POLB P06746 1/20 0.47
ALDH1A1 P00352 6/20 0.45
HTT P42858 2/20 0.45
CYP2C19 P33261 1/20 0.44
TRPV1 Q8NER1 1/20 0.42
GAA P10253 1/20 0.42
L3MBTL1 Q9Y468 1/20 0.42
KDM4E B2RXH2 1/20 0.42
HPGD P15428 1/20 0.42
HSD17B10 Q99714 1/20 0.42
FAAH O00519 1/20 0.41
NAMPT P43490 1/20 0.41
EPHX2 P34913 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10098934 0.93 ALDH1A1 (0.49) LMNAKMT2AMEN1SMN1; SMN2POLB
SCHEMBL10098938 0.90 ALDH1A1 (0.46) LMNAKMT2AMEN1SMN1; SMN2POLB
SCHEMBL10098936 0.78 LMNA (0.52) LMNAKMT2AMEN1SMN1; SMN2POLB
SCHEMBL17561649 0.76 KMT2A (0.64) LMNAKMT2AMEN1SMN1; SMN2GLA
SCHEMBL10098932 0.74 CHRNB2 (0.36) LMNASMN1; SMN2ALDH1A1KDM4EHPGD
SCHEMBL7865123 0.72 NAMPT (0.72) LMNAKMT2AMEN1SMN1; SMN2POLB
Hydrochloric Acid SCHEMBL435505 0.71 NAMPT (0.70) LMNAKMT2AMEN1SMN1; SMN2POLB
SCHEMBL7863859 0.70 PTPN1 (0.66) LMNAKMT2AMEN1POLBALDH1A1
SCHEMBL10098933 0.68 LMNA (0.51) LMNAKMT2ASMN1; SMN2POLBALDH1A1
SCHEMBL19302972 0.68 ALDH1A1 (0.69) SMN1; SMN2POLBALDH1A1HTTCYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8470913-B2 Thermosetting resin composition and cured product of the same DIC CORPORATION (JP) 2013-06-25 US disclosed
US-20120142829-A1 THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT OF THE SAME DIC CORPORATION (JP) 2012-06-07 US disclosed