SCHEMBL105187

SCHEMBL105187

CCCOCC(C)OC(C)=O

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.52
HSD17B10 Q99714 1/20 0.50
TSHR P16473 3/20 0.45
CHRM2 P08172 1/20 0.45
CHRM4 P08173 1/20 0.45
CHRM1 P11229 1/20 0.45
TBXA2R P21731 1/20 0.45
GALR3 O60755 1/20 0.44
MAPT P10636 1/20 0.44
BLM P54132 1/20 0.44
SMN1; SMN2 Q16637 1/20 0.44
ALDH1A1 P00352 2/20 0.35
PLA2G2C Q5R387 1/20 0.34
ADRA1D P25100 1/20 0.34
PTAFR P25105 1/20 0.34
HTR1D P28221 1/20 0.34
HTR2C P28335 1/20 0.34
ADRA1B P35368 1/20 0.34
DRD3 P35462 1/20 0.34
TMEM97 Q5BJF2 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methyl Alcohol SCHEMBL15345249 0.98 TDP1 (0.50) TDP1HSD17B10TSHRCHRM2CHRM4
SCHEMBL15259597 0.93 TDP1 (0.46) TDP1HSD17B10TSHRCHRM2CHRM4
SCHEMBL487418 0.93 TDP1 (0.59) TDP1HSD17B10TSHRCHRM2CHRM4
SCHEMBL896812 0.93 TDP1 (0.59) TDP1HSD17B10TSHRCHRM2CHRM4
Propylene Glycol SCHEMBL154787 0.89 TDP1 (0.51) TDP1HSD17B10TSHRCHRM2CHRM4
SCHEMBL21357986 0.89 ALDH1A1 (0.48) TDP1HSD17B10TSHRCHRM2CHRM4
SCHEMBL15333361 0.89 TDP1 (0.43) TDP1HSD17B10TSHRCHRM2CHRM4
SCHEMBL107643 0.88 ALDH1A1 (0.47) TDP1TSHRCHRM2CHRM4CHRM1
SCHEMBL2230535 0.86 PLA2G2C (0.49) PLA2G2CADRA1DPTAFRHTR1DHTR2C
Water SCHEMBL27447449 0.86 ALDH1A1 (0.45) TDP1TSHRCHRM2CHRM4CHRM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 10976 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260147279-A1 DEVELOPER COMPOSITION FOR METAL-CONTAINING PHOTORESIST, AND METHOD OF FORMING PATTERNS INCLUDING DEVELOPING METHOD USING THE COMPOSITION SAMSUNG SDI CO., LTD. (KR) 2026-05-28 US claimed
CN-122095033-A Formulations 2026-05-26 CN claimed
WO-2026104328-A1 FORMULATION MERCK PATENT GMBH (DE) 2026-05-21 WO claimed
CN-122037616-A Pigment red 254 kneading inducer and application thereof 重庆安尚科技有限公司 2026-05-15 CN claimed
EP-4720077-A1 ORGANOMETALLIC TIN OXO CARBOXYLATE CLUSTERS WITH MIXED ORGANIC LIGANDS FOR EUV LITHOGRAPHY Merck Patent GmbH (DE) 2026-04-08 EP claimed
EP-4072992-B1 COMPOSITION SAMSUNG ELECTRONICS CO LTD (KR) 2026-04-08 EP claimed
CN-121578590-A Composition for forming lower layer film of patterning material and lower layer film of patterning material 珠海基石科技有限公司 2026-02-27 CN claimed
US-20260016747-A1 RESIST COMPOSITION AND METHOD OF FORMING PATTERN BY USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2026-01-15 US claimed
US-20250377591-A1 PHOTORESIST COMPOSITION AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE SAMSUNG ELECTRONICS CO LTD (KR) 2025-12-11 US claimed
US-12393122-B2 Thinner composition and method of processing surfaces of semiconductor substrates SK Hynix Inc. (KR) 2025-08-19 US claimed
WO-2003083126-A2 ENZYMATIC RESOLUTION OF PROPYLENE GLYCOL ALKYL (OR ARYL) ETHERS AND ETHER ACETATES DOW GLOBAL TECHNOLOGIES INC. (US) 2003-10-09 WO claimed
WO-2003083032-A1 THINNER COMPOSITION FOR REMOVING PHOTOSENSITIVE RESIN DONGJIN SEMICHEM CO., LTD. (KR) 2003-10-09 WO claimed
EP-1336609-A2 Recovery of 3,4-epoxy-1-butene by extractive distillation EASTMAN CHEMICAL COMPANY (US) 2003-08-20 EP claimed
US-6582565-B1 Recovery of 3,4-epoxy-1-butene by extractive distillation EASTMAN CHEMICAL COMPANY 2003-06-24 US claimed
US-20020132123-A1 Thermosetting anti-reflective coatings for full-fill dual damascene process BREWER SCIENCE, INC. 2002-09-19 US claimed
US-6444320-B1 CAN BE USED TO PROTECT CONTACT OR VIA HOLES FROM DEGRADATION DURING SUBSEQUENT ETCHING IN THE DUAL DAMASCENE BREWER SCIENCE 2002-09-03 US claimed
US-6395450-B1 MIXTURE OF ACID GENERATOR, BINDER AND SOLVENT SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-05-28 US claimed
US-6379860-B1 RESIN OBTAINED BY REACTION OF ALKALI-SOLUBLE RESIN HAVING PHENOLIC HYDROXYL GROUPS WITH ENOL ETHER DECOMPOSES IN ACID TO INCREASE SOLUBILITY; HEAT RESISTANCE, SENSITIVIY, RESOLUTION; GENERATES ACID UPON ACTINIC RADIATION EXPOSURE FUJI PHOTO FILM CO., LTD. (JP) 2002-04-30 US claimed
EP-1085003-A1 HIGH-PURITY 1,3-PROPANEDIOL DERIVATIVE SOLVENT, PROCESS FOR PRODUCING THE SAME, AND USE THEREOF DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2001-03-21 EP claimed
US-5422221-A Hydrogen atoms of hydroxyl groups in novolac resin replaced by 1,2-naphthoquinonediazidosulfonyl group; sensitiivity, resolution, heat resistance SHIN-ETSU CHEMICAL CO., LTD. (JP) 1995-06-06 US claimed