Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 2/20 | 0.54 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.49 |
| ▸ | MEN1 | O00255 | 1/20 | 0.48 |
| ▸ | LMNA | P02545 | 1/20 | 0.48 |
| ▸ | TP53 | P04637 | 1/20 | 0.48 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.48 |
| ▸ | HPGD | P15428 | 1/20 | 0.48 |
| ▸ | ATM | Q13315 | 1/20 | 0.48 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.47 |
| ▸ | FAAH | O00519 | 1/20 | 0.47 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16225601 | 0.95 | KMT2A (0.54) | MGLLKMT2AMEN1LMNATP53 | |
| SCHEMBL15969811 | 0.94 | TGM2 (0.45) | MGLLKMT2AMEN1LMNATP53 | |
| SCHEMBL1057422 | 0.90 | KMT2A (0.44) | MGLLKMT2AMEN1LMNATP53 | |
| SCHEMBL16924653 | 0.87 | ALDH1A1 (0.42) | KMT2AMEN1LMNA | |
| SCHEMBL6448999 | 0.86 | MGLL (0.53) | MGLLKMT2AMEN1LMNATP53 | |
| SCHEMBL10401227 | 0.86 | MGLL (0.53) | MGLLKMT2AMEN1LMNATP53 | |
| SCHEMBL1053903 | 0.86 | MGLL (0.53) | MGLLKMT2AMEN1LMNATP53 | |
| SCHEMBL3612593 | 0.86 | MGLL (0.53) | MGLLKMT2AMEN1LMNATP53 | |
| SCHEMBL6868708 | 0.84 | ALDH1A1 (0.47) | KMT2AMEN1LMNATP53 | |
| SCHEMBL14962143 | 0.81 | ALDH1A1 (0.42) | KMT2AMEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025034474-A1 | 3D PRINTED POROUS SUPRAMOLECULAR SORBENTS | BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (US) | 2025-02-13 | — | — | WO | disclosed |
| US-20240199854-A1 | COMPOSITION, CURED FILM, STRUCTURAL BODY, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND MANUFACTURING METHOD OF CURED FILM | FUJIFLIM CORPORATION (JP) | 2024-06-20 | — | — | US | disclosed |
| US-20240030030-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION | JSR CORPORATION (JP) | 2024-01-25 | — | — | US | disclosed |
| US-20240021429-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION | JSR CORPORATION (JP) | 2024-01-18 | — | — | US | disclosed |
| WO-2022209816-A1 | METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE AND COMPOSITION FOR FORMING RESIST UNDERLAYER FILM | JSR株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022202402-A1 | SEMICONDUCTOR SUBSTRATE PRODUCTION METHOD AND COMPOSITION FOR FORMING RESIST UNDERLAYER FILM | JSR株式会社 | 2022-09-29 | — | — | WO | disclosed |
| CN-107077070-B | Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device | 东丽株式会社 | 2020-06-16 | — | — | CN | disclosed |
| EP-3203320-B9 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2020-05-06 | — | — | EP | disclosed |
| EP-3203320-B1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2019-10-23 | — | — | EP | disclosed |
| US-10409163-B2 | Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2019-09-10 | — | — | US | disclosed |
| US-20140335448-A1 | PHOTOSENSITIVE SILOXANE RESIN COMPOSITION | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2014-11-13 | — | — | US | disclosed |
| EP-2799928-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT | Toray Industries, Inc. (JP) | 2014-11-05 | — | — | EP | disclosed |
| US-20140242787-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2014-08-28 | — | — | US | disclosed |
| US-8486604-B2 | Positive-type radiation-sensitive composition, cured film, interlayer insulating film, method of forming interlayer insulating film, display device, and siloxane polymer for forming interlayer insulating film | JSR CORPORATION (JP) | 2013-07-16 | — | — | US | disclosed |
| US-20110008730-A1 | POSITIVE-TYPE RADIATION-SENSITIVE COMPOSITION, CURED FILM, INTERLAYER INSULATING FILM, METHOD OF FORMING INTERLAYER INSULATING FILM, DISPLAY DEVICE, AND SILOXANE POLYMER FOR FORMING INTERLAYER INSULATING FILM | JSR CORPORATION (JP) | 2011-01-13 | — | — | US | disclosed |
| US-7374856-B2 | Positive type photo-sensitive siloxane composition, cured film formed from the composition and device incorporating the cured film | TORAY INDUSTRIES, INC. (JP) | 2008-05-20 | — | — | US | disclosed |
| US-20060115766-A1 | Positive type photo-sensitive siloxane composition, cured film formed from the composition and device incorporating the cured film | TORAY INDUSTRIES, INC. (JP) | 2006-06-01 | — | — | US | disclosed |
| EP-1662322-A2 | Positive type photo-sensitive siloxane composition, curing film formed by the composition and device with the curing film | TORAY INDUSTRIES, INC. (JP) | 2006-05-31 | — | — | EP | disclosed |
| US-6815142-B1 | Method for forming resist pattern, and overlying layer material and semiconductor device used for forming resist pattern | RENESAS TECHNOLOGY CORP. (JP) | 2004-11-09 | — | — | US | disclosed |
| US-6180320-B1 | Method of manufacturing a semiconductor device having a fine pattern, and semiconductor device manufactured thereby | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 2001-01-30 | — | — | US | disclosed |