SCHEMBL1070822

SCHEMBL1070822

CC(=O)N(C(=N)N)C(C)=O

nearest known ligand 0.41

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.41
ALOX15 P16050 1/20 0.41
BLM P54132 1/20 0.41
PMP22 Q01453 1/20 0.41
TDP1 Q9NUW8 1/20 0.33
CRBN Q96SW2 1/20 0.30
NQO1 P15559 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Nitric Acid SCHEMBL28428377 0.85 CA5A (0.36) LMNAALOX15BLMPMP22
Urea SCHEMBL27293669 0.76 LMNA (0.50) LMNAALOX15BLMPMP22TDP1
SCHEMBL1696462 0.73 LMNA (0.47) LMNAALOX15BLMPMP22TDP1
SCHEMBL11501793 0.73 ALDH1A1 (0.33) LMNATDP1
SCHEMBL5799121 0.73 ALDH1A1 (0.33) LMNATDP1
SCHEMBL15468786 0.73
SCHEMBL17075171 0.73
SCHEMBL867771 0.71 LMNA (0.46) LMNAALOX15BLMPMP22TDP1
SCHEMBL28022214 0.71 MAPK1 (0.31)
SCHEMBL28405955 0.71 ACHE (0.38) LMNATDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106008255-B A kind of Quaternary Ammonium Gemini Surfactants and its preparation, product and application 中国石油大学(北京) 2019-01-22 CN claimed
CN-108094438-A Sanitizer formulations and application based on hydrogen peroxide activation system 中国人民解放军陆军防化学院 2018-06-01 CN claimed
CN-106008255-A Quaternary ammonium salt type Gemini surface active agent and preparation, product and application thereof 中国石油大学(北京) 2016-10-12 CN claimed
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
WO-2025121026-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-06-12 WO disclosed
CN-119894957-A Epoxy resin composition, resin paste, film-type adhesive, printed circuit board, semiconductor chip package, and electronic device 旭化成株式会社 2025-04-25 CN disclosed
WO-2025009354-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-01-09 WO disclosed
US-20240301176-A1 EPOXY RESIN COMPOSITION, ADHESIVE FILM, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR USING ADHESIVE FILM ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-09-12 US disclosed
CN-118084740-A Preparation method of acetoguanidine 辽宁惠风生物医药科技有限公司 2024-05-28 CN disclosed
CN-116615509-A Epoxy resin composition, adhesive film, printed circuit board, semiconductor chip package, semiconductor device, and method for using adhesive film 旭化成株式会社 2023-08-18 CN disclosed
CN-112522946-B Low-temperature scouring and bleaching agent and preparation method and application thereof 湖南工程学院 2022-11-01 CN disclosed
US-20090032286-A1 Epoxy Resin Composition ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-02-05 US disclosed
CN-101151294-A Epoxy resin composition ASAHI CHEMICAL CORP (JP) 2008-03-26 CN disclosed
US-20080050596-A1 Flame-Retardant Epoxy Resin Composition ASAHI KASEI CHEMICALS CORPORATION (JP) 2008-02-28 US disclosed
EP-1867672-A1 EPOXY RESIN COMPOSITION Asahi Kasei Chemicals Corporation (JP) 2007-12-19 EP disclosed
CN-1989203-A Flame-retardant epoxy resin composition ASAHI CHEMICAL CORP (JP) 2007-06-27 CN disclosed
EP-1775321-A1 FLAME-RETARDANT EPOXY RESIN COMPOSITION Asahi Kasei Chemicals Corporation (JP) 2007-04-18 EP disclosed
EP-0304353-B1 BENZIMIDAZOLES DERIVATIVES AND PROCESS FOR THEIR PREPARATION SYNTHELABO (FR) 1993-09-08 EP disclosed
US-4833204-A Epoxy resin composition for a copper-clad laminate HITACHI CHEMICAL COMPANY, LTD. (JP) 1989-05-23 US disclosed
EP-0304353-A1 Benzimidazoles derivatives and process for their preparation SYNTHELABO (FR) 1989-02-22 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASH2L, DOT1L, ASH1L LMNA 3009/4885ALOX15 1255/4885BLM 1866/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.