Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MCL1 | Q07820 | 4/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28504677 | 0.80 | MCL1 (0.44) | MCL1 | |
| SCHEMBL6489591 | 0.74 | MCL1 (0.39) | MCL1 | |
| SCHEMBL11597449 | 0.70 | ALDH1A1 (0.30) | — | |
| SCHEMBL6219908 | 0.69 | MEN1 (0.38) | MCL1 | |
| SCHEMBL5079020 | 0.68 | MCL1 (0.52) | MCL1 | |
| SCHEMBL4943847 | 0.66 | LMNA (0.48) | MCL1 | |
| SCHEMBL1405183 | 0.66 | LMNA (0.48) | MCL1 | |
| SCHEMBL1070889 | 0.66 | MCL1 (0.48) | MCL1 | |
| SCHEMBL9653268 | 0.65 | — | — | |
| Hydrochloric Acid SCHEMBL5796983 | 0.65 | LMNA (0.46) | MCL1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260109849-A1 | EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-23 | — | — | US | disclosed |
| US-12610853-B2 | Curable composition for inkjet and air cavity formation, electronic component, and method for manufacturing electronic component | SEKISUI CHEMICAL CO., LTD. (JP) | 2026-04-21 | — | — | US | disclosed |
| US-12528956-B2 | Ink-jet adhesive, method for producing electronic component, and electronic component | SEKISUI CHEMICAL CO., LTD. (JP) | 2026-01-20 | — | — | US | disclosed |
| CN-120021422-A | Curable composition for inkjet, LED module, and method for manufacturing LED module | 积水化学工业株式会社 | 2025-05-20 | — | — | CN | disclosed |
| WO-2024214809-A1 | NONAQUEOUS CURABLE COMPOSITION FOR INK JETTING, SUBSTRATE PROVIDED WITH CURED PRODUCT, METHOD FOR PRODUCING SUBSTRATE PROVIDED WITH CURED PRODUCT, AND METHOD FOR PRODUCING ELECTRONIC DEVICE | 積水化学工業株式会社 | 2024-10-17 | — | — | WO | disclosed |
| WO-2024204093-A1 | INKJET COMPOSITION FOR FORMING PARTITION WALL, LED MODULE AND METHOD FOR MANUFACTURING LED MODULE | 積水化学工業株式会社 | 2024-10-03 | — | — | WO | disclosed |
| WO-2024204095-A1 | INKJET COMPOSITION FOR PARTITION WALL FORMATION, LED MODULE, AND METHOD FOR PRODUCING LED MODULE | 積水化学工業株式会社 | 2024-10-03 | — | — | WO | disclosed |
| US-12077677-B2 | Method for manufacturing cured film, method for manufacturing electronic component, and electronic component | SEKISUI CHEMICAL CO., LTD. (JP) | 2024-09-03 | — | — | US | disclosed |
| WO-2024172153-A1 | CURABLE COMPOSITION FOR INKJET AND ELECTRONIC COMPONENT | 積水化学工業株式会社 | 2024-08-22 | — | — | WO | disclosed |
| US-20240234226-A9 | CURABLE COMPOSITION FOR INKJET AND AIR CAVITY FORMATION, ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | SEKISUI CHEMICAL CO., LTD. (JP) | 2024-07-11 | — | — | US | disclosed |
| US-9337019-B2 | Method for manufacturing electronic component, and electronic component | SEKISUI CHEMICAL CO., LTD. (JP) | 2016-05-10 | — | — | US | disclosed |
| US-20160049297-A1 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT | SEKISUI CHEMICAL CO., LTD. (JP) | 2016-02-18 | — | — | US | disclosed |
| US-20160046813-A1 | METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT | SEKISUI CHEMICAL CO., LTD. (JP) | 2016-02-18 | — | — | US | disclosed |
| EP-1867672-B1 | EPOXY RESIN COMPOSITION | ASAHI KASEI CHEMICALS CORP (JP) | 2011-01-26 | — | — | EP | disclosed |
| US-7671147-B2 | Composition of oxazolidine epoxy resin, epoxy phosphazene, phosphorus compound or polyphenylene ether and curing agent | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2010-03-02 | — | — | US | disclosed |
| US-20090032286-A1 | Epoxy Resin Composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2009-02-05 | — | — | US | disclosed |
| US-20080050596-A1 | Flame-Retardant Epoxy Resin Composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2008-02-28 | — | — | US | disclosed |
| EP-1867672-A1 | EPOXY RESIN COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2007-12-19 | — | — | EP | disclosed |
| EP-1775321-A1 | FLAME-RETARDANT EPOXY RESIN COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2007-04-18 | — | — | EP | disclosed |
| US-4833204-A | Epoxy resin composition for a copper-clad laminate | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1989-05-23 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12528956-B2 | Ink-jet adhesive, method for producing electronic component, and electronic component | PTK2, ELL, BMI1 | MCL1 1505/4885 |
| US-12610853-B2 | Curable composition for inkjet and air cavity formation, electronic component, and method for manufacturing electronic component | MMAB, VCL, ACR | MCL1 1869/4885 |
| US-20260109849-A1 | EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE | ASH2L, DOT1L, ASH1L | MCL1 3452/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.