Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 8/20 | 1.00 |
| ▸ | KDM4E | B2RXH2 | 8/20 | 1.00 |
| ▸ | HPGD | P15428 | 7/20 | 1.00 |
| ▸ | MAPT | P10636 | 7/20 | 1.00 |
| ▸ | KMT2A | Q03164 | 7/20 | 1.00 |
| ▸ | MEN1 | O00255 | 5/20 | 1.00 |
| ▸ | HTT | P42858 | 2/20 | 1.00 |
| ▸ | LMNA | P02545 | 2/20 | 0.76 |
| ▸ | THRB | P10828 | 1/20 | 0.76 |
| ▸ | POLB | P06746 | 1/20 | 0.64 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.64 |
| ▸ | VDR | P11473 | 2/20 | 0.60 |
| ▸ | F2 | P00734 | 2/20 | 0.55 |
| ▸ | PARL | Q9H300 | 2/20 | 0.54 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.47 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.46 |
| ▸ | ERCC1 | P07992 | 1/20 | 0.46 |
| ▸ | FEN1 | P39748 | 1/20 | 0.46 |
| ▸ | ERCC4 | Q92889 | 1/20 | 0.46 |
| ▸ | CA12 | O43570 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31218469 | 1.00 | ALDH1A1 (1.00) | ALDH1A1KDM4EHPGDMAPTKMT2A | |
| SCHEMBL462229 | 0.88 | ALDH1A1 (0.78) | ALDH1A1KDM4EHPGDMAPTKMT2A | |
| SCHEMBL64368 | 0.87 | KDM4E (1.00) | ALDH1A1KDM4EHPGDMAPTKMT2A | |
| SCHEMBL462047 | 0.87 | ALDH1A1 (1.00) | ALDH1A1KDM4EHPGDMAPTKMT2A | |
| SCHEMBL7572742 | 0.87 | ALDH1A1 (1.00) | ALDH1A1KDM4EHPGDMAPTKMT2A | |
| SCHEMBL10409879 | 0.86 | KDM4E (0.75) | ALDH1A1KDM4EHPGDMAPTKMT2A | |
| SCHEMBL24943438 | 0.85 | KDM4E (0.74) | ALDH1A1KDM4EHPGDMAPTKMT2A | |
| SCHEMBL27842380 | 0.84 | KDM4E (0.72) | ALDH1A1KDM4EHPGDMAPTKMT2A | |
| SCHEMBL22251608 | 0.84 | KDM4E (0.75) | ALDH1A1KDM4EHPGDMAPTKMT2A | |
| SCHEMBL10409867 | 0.84 | KDM4E (0.71) | ALDH1A1KDM4EHPGDMAPTKMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 281 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2326744-B1 | METAL COMPOSITIONS AND METHODS OF MAKING SAME | PRYOG LLC (US) | 2022-06-01 | — | — | EP | claimed |
| US-4425424-A | LEUCO DYE AND N-SULFONYLOXY PHOTOOXIDANT | EASTMAN KODAK COMPANY (US) | 1984-01-10 | — | — | US | claimed |
| US-11939428-B2 | Polyimides | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2024-03-26 | — | — | US | disclosed |
| US-11899364-B2 | Photosensitive polyimide compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2024-02-13 | — | — | US | disclosed |
| CN-111324013-B | Chemically amplified positive photosensitive resin composition and application thereof | 奇美实业股份有限公司 | 2023-12-01 | — | — | CN | disclosed |
| US-11803122-B2 | Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-10-31 | — | — | US | disclosed |
| US-11803122-B2 | Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-10-31 | — | — | US | disclosed |
| US-11782344-B2 | Photosensitive polyimide compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2023-10-10 | — | — | US | disclosed |
| WO-2023162552-A1 | CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE COMPOSITION, PRODUCTION METHOD FOR SUBSTRATE WITH TEMPLATE, AND PRODUCTION METHOD FOR PLATED ARTICLE | 東京応化工業株式会社 | 2023-08-31 | — | — | WO | disclosed |
| WO-2023162551-A1 | METHOD FOR PRODUCING PLATED SHAPED ARTICLE | 東京応化工業株式会社 | 2023-08-31 | — | — | WO | disclosed |
| US-20230273521-A1 | CHEMICALLY AMPLIFIED PHOTOSENTIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-08-31 | — | — | US | disclosed |
| WO-1992017821-A1 | LITHOGRAPHIC PRINTING PLATES | EASTMAN KODAK COMPANY (US) | 1992-10-15 | — | — | WO | disclosed |
| US-5141839-A | LITHOGRAPHIC PRINTING PLATES HAVING A RADIATION-SENSITIVE LAYER COMPRISING A PHOTOCROSSLINKABLE POLYMER, A LEUCO DYE, A PHOTOOXIDANT AND A HETEROAROMATIC AMINE N-OXIDE | EASTMAN KODAK COMPANY (US) | 1992-08-25 | — | — | US | disclosed |
| US-5141842-A | Negative working lithography printing plates | EASTMAN KODAK COMPANY (US) | 1992-08-25 | — | — | US | disclosed |
| EP-0388343-A2 | Chemically amplified photoresist | International Business Machines Corporation (US) | 1990-09-19 | — | — | EP | disclosed |
| US-4618564-A | Process for production of positive images using sulfonic acid precursors | CIBA-GEIGY CORPORATION (US) | 1986-10-21 | — | — | US | disclosed |
| EP-0058638-B1 | CURABLE COMPOSITIONS CONTAINING AN ACID-CURABLE RESIN, AND PROCESS FOR CURING THEM | CIBA-GEIGY AG (CH) | 1985-08-28 | — | — | EP | disclosed |
| US-4439517-A | Process for the formation of images with epoxide resin | CIBA-GEIGY CORPORATION (US) | 1984-03-27 | — | — | US | disclosed |
| US-4425424-A | LEUCO DYE AND N-SULFONYLOXY PHOTOOXIDANT | EASTMAN KODAK COMPANY (US) | 1984-01-10 | — | — | US | disclosed |
| EP-0058638-A2 | Curable compositions containing an acid-curable resin, and process for curing them | CIBA-GEIGY AG (CH) | 1982-08-25 | — | — | EP | disclosed |