SCHEMBL1109640

SCHEMBL1109640

CO[Si](OC)(OC)c1cccc(-c2ccccc2)c1[Si](OC)(OC)OC

nearest known ligand 0.34

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PDCD1 Q15116 1/20 0.34
CD274 Q9NZQ7 1/20 0.34
SQOR Q9Y6N5 2/20 0.34
ADRA2A P08913 1/20 0.34
ADRA2B P18089 1/20 0.34
ADRA2C P18825 1/20 0.34
ALDH1A1 P00352 6/20 0.33
HSD17B10 Q99714 2/20 0.33
PDE4B Q07343 2/20 0.33
LMNA P02545 2/20 0.33
MAPT P10636 2/20 0.33
HPGD P15428 1/20 0.33
BCL2L1 Q07817 1/20 0.33
KDM4E B2RXH2 1/20 0.33
GAA P10253 1/20 0.33
CYP2A6 P11509 1/20 0.33
MITF O75030 1/20 0.33
HTT P42858 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
PDE4A P27815 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1637771 0.85 SQOR (0.34) SQORPDE4BMAPTPDE4APDE4C
SCHEMBL1637769 0.85 KDM4E (0.30) ALDH1A1LMNAMAPTHPGDKDM4E
SCHEMBL29975082 0.84 ALDH1A1 (0.38) SQORALDH1A1HSD17B10PDE4BLMNA
SCHEMBL7188378 0.84 ALDH1A1 (0.38) SQORALDH1A1HSD17B10PDE4BLMNA
SCHEMBL27655192 0.80 ALDH1A1 (0.41) PDCD1CD274SQORADRA2AADRA2B
SCHEMBL1639805 0.80 KDM4E (0.31) ALDH1A1KDM4EMAPK1SMN1; SMN2
SCHEMBL545764 0.77 CD274 (0.35) PDCD1CD274ADRA2AADRA2BADRA2C
SCHEMBL1639810 0.76 MAPT (0.35) PDCD1CD274SQORALDH1A1HSD17B10
SCHEMBL1109638 0.75 ALDH1A1 (0.37) ALDH1A1LMNAMAPTHPGDKDM4E
Benzene SCHEMBL28228276 0.75 CA4 (0.41) ALDH1A1PDE4BLMNAMAPTKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115135803-B Electroless plating base agent containing polymer and metal microparticles 日产化学株式会社 2024-06-28 CN disclosed
CN-115135803-A Electroless plating base agent comprising polymer and metal fine particles 日产化学株式会社 2022-09-30 CN disclosed
CN-110256630-A Phase difference material is formed with resin combination, orientation material and phase difference material 日产化学工业株式会社 2019-09-20 CN disclosed
CN-106030355-B Resin composition for forming phase difference material, alignment material, and phase difference material 日产化学工业株式会社 2019-06-18 CN disclosed
CN-105283512-B Composition for forming cured film, alignment material, and phase difference material 日产化学工业株式会社 2018-12-11 CN disclosed
CN-107406720-A Composition for forming cured film, alignment material, and phase difference material 日产化学工业株式会社 2017-11-28 CN disclosed
CN-106030355-A Resin composition for forming phase difference material, alignment material, and phase difference material 日产化学工业株式会社 2016-10-12 CN disclosed
CN-105378033-A Method for producing substrate having liquid crystal orientation membrane for use in in-plane-switching liquid crystal display element NISSAN CHEMICAL IND LTD 2016-03-02 CN disclosed
EP-2280309-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE EACH COMPRISING THE CURED FILM SUMITOMO BAKELITE CO (JP) 2016-02-24 EP disclosed
CN-105283512-A Composition for forming cured film, alignment material, and phase difference material NISSAN CHEMICAL IND LTD 2016-01-27 CN disclosed
US-20110097669-A1 PHOTOCURABLE COMPOSITION SEKISUI CHEMICAL CO., LTD. (JP) 2011-04-28 US disclosed
EP-2280309-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE EACH COMPRISING THE CURED FILM Sumitomo Bakelite Co., Ltd. (JP) 2011-02-02 EP disclosed
US-7312013-B2 Photoreactive composition SEKISUI CHEMICAL CO., LTD. (JP) 2007-12-25 US disclosed
EP-1276807-B1 CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS DOW CORNING (US) 2005-10-12 EP disclosed
US-20040202956-A1 a photocurable mixture of a hydrolyzable metal (silyl) compound and a reaction, polymerization or crosslinking promoter; curing; adhesives, seals, semiconductors, dielectrics, microlenses, optical fibers, color filters, gas permeable films SEKISUI CHEMICAL CO., LTD. (JP) 2004-10-14 US disclosed
US-6780471-B2 USING CROSSLINKER WITH NONFLEXIBLE LINKAGE INCLUDING AT LEAST ONE P-ARYLENE MOIETY FOR SPATIAL SEPARATION; FLEXURAL STRENGTH, FRACTURE TOUGHNESS, MODULUS AND/OR MECHANICAL DAMPING DOW CORNING CORPORATION 2004-08-24 US disclosed
EP-1391476-A1 PHOTOREACTIVE COMPOSITION SEKISUI CHEMICAL CO., LTD. (JP) 2004-02-25 EP disclosed
US-20030130389-A1 Curable silicone resin composition and reactive silicon compounds DOW CORNING LIMITED (GB) 2003-07-10 US disclosed
EP-1276807-A1 CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS Dow Corning Corporation (US) 2003-01-22 EP disclosed
WO-2001083608-A1 CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS DOW CORNING CORPORATION (US) 2001-11-08 WO disclosed