Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KMT2A | Q03164 | 2/20 | 0.39 |
| ▸ | MEN1 | O00255 | 1/20 | 0.39 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.39 |
| ▸ | MGLL | Q99685 | 2/20 | 0.36 |
| ▸ | FAAH | O00519 | 1/20 | 0.36 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.36 |
| ▸ | PTGER4 | P35408 | 1/20 | 0.35 |
| ▸ | PTGER2 | P43116 | 1/20 | 0.35 |
| ▸ | SLC2A1 | P11166 | 1/20 | 0.34 |
| ▸ | LTA4H | P09960 | 2/20 | 0.33 |
| ▸ | DPP4 | P27487 | 2/20 | 0.33 |
| ▸ | MMP2 | P08253 | 1/20 | 0.33 |
| ▸ | MMP3 | P08254 | 1/20 | 0.33 |
| ▸ | MMP9 | P14780 | 1/20 | 0.33 |
| ▸ | MMP8 | P22894 | 1/20 | 0.33 |
| ▸ | MMP13 | P45452 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | CDC25B | P30305 | 1/20 | 0.32 |
| ▸ | GRM2 | Q14416 | 1/20 | 0.32 |
| ▸ | NR1I2 | O75469 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28398984 | 0.85 | MGLL (0.41) | KMT2AMEN1NPSR1MGLLLMNA | |
| SCHEMBL94040 | 0.84 | MGLL (0.54) | KMT2AMEN1NPSR1MGLLFAAH | |
| SCHEMBL29986752 | 0.84 | MGLL (0.54) | KMT2AMEN1NPSR1MGLLFAAH | |
| SCHEMBL4391609 | 0.79 | MGLL (0.49) | KMT2AMEN1MGLLFAAHLMNA | |
| SCHEMBL28288548 | 0.79 | MGLL (0.56) | KMT2AMEN1NPSR1MGLLFAAH | |
| SCHEMBL28530800 | 0.77 | MGLL (0.60) | KMT2AMGLLFAAHSMN1; SMN2LTA4H | |
| SCHEMBL28273833 | 0.73 | MGLL (0.59) | KMT2AMEN1NPSR1MGLLFAAH | |
| SCHEMBL24208309 | 0.72 | BRD4 (0.49) | KMT2AMEN1NPSR1MGLLSMN1; SMN2 | |
| SCHEMBL10698450 | 0.71 | SLC2A1 (0.48) | SMN1; SMN2SLC2A1LTA4HMMP9MMP8 | |
| SCHEMBL6394673 | 0.71 | SLC2A1 (0.48) | SMN1; SMN2SLC2A1LTA4HMMP9MMP8 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8501045-B2 | Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-08-06 | — | — | US | disclosed |
| US-8202622-B2 | Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same | HITACHI CHEMICAL CO., LTD. (JP) | 2012-06-19 | — | — | US | disclosed |
| US-8043709-B2 | Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same | HITACHI CHEMICAL CO., LTD. (JP) | 2011-10-25 | — | — | US | disclosed |
| US-20110247757-A1 | CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF MANUFACTURING THE SAME | ARIFUKU MOTOHIRO | 2011-10-13 | — | — | US | disclosed |
| US-20110247870-A1 | CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-10-13 | — | — | US | disclosed |
| US-8029911-B2 | Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-10-04 | — | — | US | disclosed |
| EP-2182585-B1 | Circuit member connecting structure | HITACHI CHEMICAL CO LTD (JP) | 2011-08-10 | — | — | EP | disclosed |
| EP-2282374-A1 | Circuit material | Hitachi Chemical Company, Ltd. (JP) | 2011-02-09 | — | — | EP | disclosed |
| US-20100294551-A1 | ADHESIVE FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION METHOD USING THE SAME, AND CIRCUIT CONNECTED STRUCTURE | NOMURA SATOYUKI | 2010-11-25 | — | — | US | disclosed |
| EP-2182585-A1 | Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same | Hitachi Chemical Company, Ltd. (JP) | 2010-05-05 | — | — | EP | disclosed |
| EP-1628363-B1 | CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF PRODUCING THE SAME | HITACHI CHEMICAL CO LTD (JP) | 2009-12-16 | — | — | EP | disclosed |
| US-7528488-B2 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2009-05-05 | — | — | US | disclosed |
| US-7258918-B2 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2007-08-21 | — | — | US | disclosed |
| US-20070166549-A1 | Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure | NOMURA SATOYUKI | 2007-07-19 | — | — | US | disclosed |
| US-7208105-B2 | Mixture of electroconductive particles and polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2007-04-24 | — | — | US | disclosed |
| US-20060263599-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | TSUKAGOSHI ISAO | 2006-11-23 | — | — | US | disclosed |
| US-20060100314-A1 | Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same | HITACHI CHEMICAL CO., LTD. (JP) | 2006-05-11 | — | — | US | disclosed |
| EP-1628363-A1 | CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF PRODUCING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2006-02-22 | — | — | EP | disclosed |
| US-20030178138-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-25 | — | — | US | disclosed |
| US-20030141014-A1 | Mixture of electroconductive particles and polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2003-07-31 | — | — | US | disclosed |