Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 12/20 | 0.54 |
| ▸ | FAAH | O00519 | 4/20 | 0.52 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.42 |
| ▸ | MEN1 | O00255 | 2/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.42 |
| ▸ | HSP90AA1 | P07900 | 2/20 | 0.42 |
| ▸ | HPGD | P15428 | 2/20 | 0.42 |
| ▸ | HTT | P42858 | 2/20 | 0.42 |
| ▸ | LMNA | P02545 | 1/20 | 0.42 |
| ▸ | PKM | P14618 | 1/20 | 0.42 |
| ▸ | CCR6 | P51684 | 1/20 | 0.42 |
| ▸ | ATM | Q13315 | 1/20 | 0.42 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.40 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.39 |
| ▸ | CACNA1B | Q00975 | 1/20 | 0.39 |
| ▸ | APBA1 | Q02410 | 1/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
| ▸ | SLC2A1 | P11166 | 1/20 | 0.38 |
| ▸ | LTA4H | P09960 | 1/20 | 0.37 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29986752 | 1.00 | MGLL (0.54) | MGLLFAAHKMT2AMEN1ALDH1A1 | |
| SCHEMBL28288548 | 0.95 | MGLL (0.56) | MGLLFAAHKMT2AMEN1ALDH1A1 | |
| SCHEMBL28273833 | 0.89 | MGLL (0.59) | MGLLFAAHKMT2AMEN1ALDH1A1 | |
| SCHEMBL1115859 | 0.84 | KMT2A (0.39) | MGLLFAAHKMT2AMEN1LMNA | |
| SCHEMBL349905 | 0.83 | MGLL (0.63) | MGLLFAAHKMT2AMEN1ALDH1A1 | |
| SCHEMBL8852859 | 0.83 | MGLL (0.51) | MGLLFAAHKMT2AMEN1ALDH1A1 | |
| SCHEMBL8402814 | 0.80 | MGLL (0.83) | MGLLFAAHKMT2AMEN1ALDH1A1 | |
| SCHEMBL28264654 | 0.78 | MGLL (0.52) | MGLLFAAHALDH1A1HSP90AA1HTT | |
| SCHEMBL8852774 | 0.78 | MGLL (0.80) | MGLLFAAHKMT2AMEN1ALDH1A1 | |
| SCHEMBL27174528 | 0.76 | MGLL (0.72) | MGLLFAAHKMT2AMEN1ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 183 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-7149893-A | — | — | None | — | — | JP | disclosed |
| WO-2025063142-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM, LAMINATE, AND METHOD FOR PRODUCING CIRCUIT CONNECTION STRUCTURE | 株式会社レゾナック | 2025-03-27 | — | — | WO | disclosed |
| WO-2025041839-A1 | ADHESIVE AGENT COMPOSITION, ADHESIVE AGENT FILM FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING SAME | 株式会社レゾナック | 2025-02-27 | — | — | WO | disclosed |
| CN-119013625-A | Photosensitive resin composition, patterned resin film, method for producing patterned resin film, and semiconductor circuit board | JSR株式会社 | 2024-11-22 | — | — | CN | disclosed |
| WO-2023243199-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED RESIN FILM, METHOD FOR PRODUCING PATTERNED RESIN FILM, AND SEMICONDUCTOR CIRCUIT SUBSTRATE | JSR株式会社 | 2023-12-21 | — | — | WO | disclosed |
| CN-109949968-B | Circuit connecting material, connecting body, and method for manufacturing connecting body | 昭和电工材料株式会社 | 2021-09-21 | — | — | CN | disclosed |
| EP-3357959-B1 | LOW LOSS PRE-PREGS AND LAMINATES AND COMPOSITIONS USEFUL FOR THE PREPARATION THEREOF | ARLON LLC (US) | 2020-11-25 | — | — | EP | disclosed |
| US-10418148-B2 | Low loss pre-pregs and laminates and compositions useful for the preparation thereof | ARLON LLC (US) | 2019-09-17 | — | — | US | disclosed |
| CN-109949968-A | Circuit connection material, connector and the method for manufacturing connector | 日立化成株式会社 | 2019-06-28 | — | — | CN | disclosed |
| CN-104380197-B | Hot curing resin composition, the printed circuit board of alkali developable | 太阳油墨制造株式会社 | 2019-01-01 | — | — | CN | disclosed |
| US-6841628-B2 | Resin composition, adhesives prepared therewith for bonding circuit members, and circuit boards | HITACHI CHEMICAL CO., LTD. (JP) | 2005-01-11 | — | — | US | disclosed |
| US-20040214979-A1 | Polyurethanes and polyimides for wires or connectors and a process for connecting wires, curing with curing agents to form films. | FUJINAWA TOHRU | 2004-10-28 | — | — | US | disclosed |
| US-6777464-B1 | ELECTRONIC CIRCUIT-CONNECTING MATERIAL HAVING A SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-08-17 | — | — | US | disclosed |
| US-6762249-B1 | RAPID LOW TEMPERATURE SETTING; HIGH ADHESION, STRESS RELEAVING POLYURETHANE RESIN, FREE RADICAL POLYMERIZABLE MATERIAL AND CURING AGENT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-07-13 | — | — | US | disclosed |
| US-20030178138-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-25 | — | — | US | disclosed |
| US-20030141014-A1 | Mixture of electroconductive particles and polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2003-07-31 | — | — | US | disclosed |
| US-20030027942-A1 | Resin composition , adhesive prepared therewith for bonding circuit members,and circuit boards | HITACHI CHEMICAL CO., LTD. (JP) | 2003-02-06 | — | — | US | disclosed |
| EP-1229095-A1 | ADHESIVE AGENT, METHOD FOR CONNECTING WIRING TERMINALS AND WIRING STRUCTURE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-08-07 | — | — | EP | disclosed |
| EP-1223795-A1 | WIRING-CONNECTING MATERIAL AND PROCESS FOR PRODUCING CIRCUIT BOARD WITH THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-07-17 | — | — | EP | disclosed |
| JP-H07149893-A | THERMOSETTING RESIN COMPOSITION WITH LOW DIELECTRIC CONSTANT | SUMITOMO BAKELITE CO LTD | 1995-06-13 | — | — | JP | disclosed |