SCHEMBL29986752

SCHEMBL29986752

CCCCCCCC(c1ccc(Oc2ccc(N3C(=O)C=CC3=O)cc2)cc1)c1ccc(Oc2ccc(N3C(=O)C=CC3=O)cc2)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 12/20 0.54
FAAH O00519 4/20 0.52
KMT2A Q03164 3/20 0.42
MEN1 O00255 2/20 0.42
ALDH1A1 P00352 2/20 0.42
HSP90AA1 P07900 2/20 0.42
HPGD P15428 2/20 0.42
HTT P42858 2/20 0.42
LMNA P02545 1/20 0.42
PKM P14618 1/20 0.42
CCR6 P51684 1/20 0.42
ATM Q13315 1/20 0.42
NPSR1 Q6W5P4 2/20 0.40
SMN1; SMN2 Q16637 1/20 0.39
CACNA1B Q00975 1/20 0.39
APBA1 Q02410 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
SLC2A1 P11166 1/20 0.38
LTA4H P09960 1/20 0.37
PTGS1 P23219 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL94040 1.00 MGLL (0.54) MGLLFAAHKMT2AMEN1ALDH1A1
SCHEMBL28288548 0.95 MGLL (0.56) MGLLFAAHKMT2AMEN1ALDH1A1
SCHEMBL28273833 0.89 MGLL (0.59) MGLLFAAHKMT2AMEN1ALDH1A1
SCHEMBL1115859 0.84 KMT2A (0.39) MGLLFAAHKMT2AMEN1LMNA
SCHEMBL349905 0.83 MGLL (0.63) MGLLFAAHKMT2AMEN1ALDH1A1
SCHEMBL8852859 0.83 MGLL (0.51) MGLLFAAHKMT2AMEN1ALDH1A1
SCHEMBL8402814 0.80 MGLL (0.83) MGLLFAAHKMT2AMEN1ALDH1A1
SCHEMBL28264654 0.78 MGLL (0.52) MGLLFAAHALDH1A1HSP90AA1HTT
SCHEMBL8852774 0.78 MGLL (0.80) MGLLFAAHKMT2AMEN1ALDH1A1
SCHEMBL27174528 0.76 MGLL (0.72) MGLLFAAHKMT2AMEN1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119013625-A Photosensitive resin composition, patterned resin film, method for producing patterned resin film, and semiconductor circuit board JSR株式会社 2024-11-22 CN disclosed
WO-2022210096-A1 RADIATION-SENSITIVE COMPOSITION FOR INSULATION FILM FORMATION USE, RESIN FILM HAVING PATTERN, AND SEMICONDUCTOR CIRCUIT BOARD JSR株式会社 2022-10-06 WO disclosed