SCHEMBL1123365

SCHEMBL1123365

CO[SiH](OC)c1ccccc1CCCS

nearest known ligand 0.38

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
HDAC3 O15379 1/20 0.32
HDAC4 P56524 1/20 0.32
HDAC1 Q13547 1/20 0.32
HDAC7 Q8WUI4 1/20 0.32
HDAC2 Q92769 1/20 0.32
HDAC10 Q969S8 1/20 0.32
HDAC11 Q96DB2 1/20 0.32
HDAC8 Q9BY41 1/20 0.32
HDAC6 Q9UBN7 1/20 0.32
HDAC9 Q9UKV0 1/20 0.32
HDAC5 Q9UQL6 1/20 0.32
TAAR1 Q96RJ0 1/20 0.31
FOLH1 Q04609 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3482639 0.84 LIPG (0.41)
SCHEMBL28546603 0.83 CYP4F2 (0.32) HDAC3HDAC4HDAC1HDAC7HDAC2
SCHEMBL28545893 0.82 CYP4A11 (0.34) TAAR1
SCHEMBL1931186 0.82 TAAR1 (0.42) TAAR1
SCHEMBL22551425 0.81 IDO1 (0.40) TAAR1
SCHEMBL19356831 0.81 LIPG (0.50)
SCHEMBL1929389 0.81 MAOA (0.41) TAAR1
SCHEMBL4346247 0.79 FOLH1 (0.32) HDAC3HDAC4HDAC1HDAC7HDAC2
SCHEMBL3482132 0.79 ADRA2A (0.34) TAAR1
SCHEMBL1144164 0.78 ATM (0.36)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20040014840-A1 Rubber compositions and methods for improving scorch safety and hysteretic properties of the compositions UNIROYAL CHEMICAL COMPANY 2004-01-22 US claimed
CN-108368263-B Resin, paste, laminate obtained using the same, and method for producing the laminate 东丽株式会社 2021-03-12 CN disclosed
EP-1619692-B1 PROTON-CONDUCTIVE FILM, PROCESS FOR PRODUCING THE SAME, AND FUEL CELL EMPOLYING THE PROTON-CONDUCTIVE FILM SEKISUI CHEMICAL CO LTD (JP) 2011-02-09 EP disclosed
US-20090012233-A1 Epoxy Resin Molding Material for Sealing and Electronic Component Device HITACHI CHEMICAL CO., LTD. (JP) 2009-01-08 US disclosed
US-20060219981-A1 Proton conductive film, process for producing the same, and fuel cell employing the proton-conductive film SEKISUI CHEMICAL CO., LTD. (JP) 2006-10-05 US disclosed
EP-1619692-A1 PROTON-CONDUCTIVE FILM, PROCESS FOR PRODUCING THE SAME, AND FUEL CELL EMPOLYING THE PROTON-CONDUCTIVE FILM SEKISUI CHEMICAL CO., LTD. (JP) 2006-01-25 EP disclosed
US-6743303-B2 CONTACTING METAL SURFACE WITH ADHESION PROMOTION FORMULATION COMPRISING SULFURIC ACID AND PHOSPHORIC ACID TO FORM A MICRO-ROUGHENED CONVERSION COATED METAL SURFACE, CONTACTING WITH AQUEOUS ORGANOSILICON FORMULATION SHIPLEY COMPANY, L.L.C. 2004-06-01 US disclosed
US-20020132056-A1 Contacting metal surface with adhesion promotion formulation comprising sulfuric acid and phosphoric acid to form a micro-roughened conversion coated metal surface, contacting with aqueous organosilicon formulation SHIPLEY COMPANY, L.L.C. (US) 2002-09-19 US disclosed
US-6147242-A Method of producing silylalkylthiols DEGUSSA-HULS AG (DE) 2000-11-14 US disclosed
US-6051665-A A FLUOROPOLYMER IS OBTAINED FROM THE MONOMER SELECTED FROM THE GROUP CONTAINING A FLUORO-OLEFIN, A FLUORO VINYL ETHER, A FLUORO (METH) ACRYLATE AND MIXTURE, ALSO CONTAIN HYDROLYZABLE SILYL GROUP, A SILOXY COMPOUND AND A CHELATE COMPLEX JSR CORPORATION (JP) 2000-04-18 US disclosed
US-5107009-A PROCESS FOR THE PREPARATION OF MERCAPTOSILANES HULS AKTIENGESELLSCHAFT (DE) 1992-04-21 US disclosed
US-4556724-A Method for the preparation of mercapto alkyl silanes DYNAMIT NOBEL AG (DE) 1985-12-03 US disclosed