Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LIPG | Q9Y5X9 | 1/20 | 0.41 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.40 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.40 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.38 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.38 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.38 |
| ▸ | TLR8 | Q9NR97 | 1/20 | 0.36 |
| ▸ | PPARA | Q07869 | 1/20 | 0.36 |
| ▸ | THRA | P10827 | 1/20 | 0.35 |
| ▸ | THRB | P10828 | 1/20 | 0.35 |
| ▸ | TYR | P14679 | 1/20 | 0.34 |
| ▸ | NR1H2 | P55055 | 1/20 | 0.34 |
| ▸ | NR1H3 | Q13133 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19356831 | 0.93 | LIPG (0.50) | LIPGALOX5PTGS2PPARATHRA | |
| SCHEMBL3482132 | 0.89 | ADRA2A (0.34) | LIPGALOX5PTGS2PPARA | |
| SCHEMBL1931186 | 0.84 | TAAR1 (0.42) | TLR8 | |
| SCHEMBL28545893 | 0.84 | CYP4A11 (0.34) | LIPGALOX5PTGS2 | |
| SCHEMBL1123365 | 0.84 | HDAC3 (0.32) | — | |
| SCHEMBL3481842 | 0.84 | LIPG (0.40) | LIPGALOX5PTGS2CYP3A4CYP2D6 | |
| SCHEMBL1929389 | 0.82 | MAOA (0.41) | TLR8 | |
| SCHEMBL3482697 | 0.82 | LIPG (0.42) | LIPGALOX5PTGS2CYP3A4CYP2D6 | |
| SCHEMBL1144164 | 0.80 | ATM (0.36) | — | |
| SCHEMBL555622 | 0.79 | TAAR1 (0.53) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3727686-A1 | MOISTURE-CURING COMPOSITIONS | Covestro Deutschland AG (DE) | 2020-10-28 | — | — | EP | disclosed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| EP-2599836-B1 | CURABLE COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | ADEKA CORP (JP) | 2015-03-25 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-8470937-B2 | Curable composition for semiconductor encapsulation | ADEKA CORPORATION (JP) | 2013-06-25 | — | — | US | disclosed |
| EP-2599836-A1 | CURABLE COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | Adeka Corporation (JP) | 2013-06-05 | — | — | EP | disclosed |
| US-20120126435-A1 | CURABLE COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | ADEKA CORPORATION (JP) | 2012-05-24 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |