Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FOLH1 | Q04609 | 1/20 | 0.32 |
| ▸ | LIPG | Q9Y5X9 | 1/20 | 0.32 |
| ▸ | HDAC3 | O15379 | 1/20 | 0.31 |
| ▸ | HDAC4 | P56524 | 1/20 | 0.31 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.31 |
| ▸ | HDAC7 | Q8WUI4 | 1/20 | 0.31 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.31 |
| ▸ | HDAC10 | Q969S8 | 1/20 | 0.31 |
| ▸ | HDAC11 | Q96DB2 | 1/20 | 0.31 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.31 |
| ▸ | HDAC6 | Q9UBN7 | 1/20 | 0.31 |
| ▸ | HDAC9 | Q9UKV0 | 1/20 | 0.31 |
| ▸ | HDAC5 | Q9UQL6 | 1/20 | 0.31 |
| ▸ | IDO1 | P14902 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4201232 | 0.94 | LIPG (0.34) | FOLH1LIPGHDAC3HDAC4HDAC1 | |
| SCHEMBL13714249 | 0.82 | LIPG (0.44) | LIPG | |
| SCHEMBL7743404 | 0.80 | TAAR1 (0.41) | — | |
| SCHEMBL1123365 | 0.79 | HDAC3 (0.32) | FOLH1HDAC3HDAC4HDAC1HDAC7 | |
| SCHEMBL9035443 | 0.79 | IDO1 (0.44) | IDO1 | |
| SCHEMBL22701003 | 0.78 | FOLH1 (0.41) | FOLH1LIPGHDAC3HDAC4HDAC1 | |
| SCHEMBL28546603 | 0.77 | CYP4F2 (0.32) | LIPGHDAC3HDAC4HDAC1HDAC7 | |
| SCHEMBL17933790 | 0.72 | TAAR1 (0.56) | FOLH1 | |
| SCHEMBL20637440 | 0.72 | GABRA1 (0.42) | — | |
| SCHEMBL4810563 | 0.70 | PNMT (0.44) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6507049-B1 | Encapsulants for solid state devices | GENERAL ELECTRIC COMPANY | 2003-01-14 | — | — | US | claimed |
| US-5145889-A | For light-emitting diodes | KABUSHIKI KAISHA TOSHIBA (JP) | 1992-09-08 | — | — | US | claimed |
| US-20090121251-A1 | Siloxane-hydantoin copolymer, optoelectronic device encapsulated therewith and method | LUMINATION LLC | 2009-05-14 | — | — | US | disclosed |
| US-20080160317-A1 | Optoelectronic device | GELCORE LLC | 2008-07-03 | — | — | US | disclosed |
| US-20080001140-A1 | Optoelectronic device | GELCORE LLC | 2008-01-03 | — | — | US | disclosed |
| US-20070299162-A1 | Light emitting semiconductor and encapsulant is made from nano-functionalized zirconia; silicone epoxy, epoxy isocyanurate and succinic anhydride, dodecenylsuccinic anhydride, phthalic anhydride curing agent; ancillary curing catalyst, cure modifier, coupling agent, UV, thermal stabilizer | GELCORE LLC | 2007-12-27 | — | — | US | disclosed |
| US-20070295956-A1 | Optoelectronic device | GELCORE LLC | 2007-12-27 | — | — | US | disclosed |
| US-20070295983-A1 | Optoelectronic device | GELCORE LLC | 2007-12-27 | — | — | US | disclosed |
| EP-1408087-B1 | Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method | GEN ELECTRIC (US) | 2007-10-10 | — | — | EP | disclosed |
| US-7144763-B2 | light emitting diode; curable silicone with pendant epoxy groups, a hydroxyl-containing compound or silicone, anhydride curing agent, ancillary curing catalyst; radiation transparent, UV stability, clear; packaging | GENERAL ELECTRIC COMPANY (US) | 2006-12-05 | — | — | US | disclosed |
| EP-1285938-B1 | Epoxy resin encapsulation compositions | GEN ELECTRIC (US) | 2006-01-25 | — | — | EP | disclosed |
| US-6617400-B2 | Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device | GENERAL ELECTRIC COMPANY | 2003-09-09 | — | — | US | disclosed |
| US-6617401-B2 | Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device | GENERAL ELECTRIC COMPANY | 2003-09-09 | — | — | US | disclosed |
| US-20030071366-A1 | For encapsulating a solid state device, such as a light emitting diode | GENERAL ELECTRIC COMPANY | 2003-04-17 | — | — | US | disclosed |
| US-20030071367-A1 | Epoxy resin compositions, solid state devices encapsulated therewith and method | GENERAL ELECTRIC COMPANY | 2003-04-17 | — | — | US | disclosed |
| US-20030071368-A1 | Epoxy resin compositions, solid state devices encapsulated therewith and method | GENERAL ELECTRIC COMPANY | 2003-04-17 | — | — | US | disclosed |
| EP-1285938-A1 | Epoxy resin encapsulation compositions | GENERAL ELECTRIC COMPANY (US) | 2003-02-26 | — | — | EP | disclosed |
| EP-1285939-A1 | Epoxy resin compositions and solid state devices encapsulated therewith | GENERAL ELECTRIC COMPANY (US) | 2003-02-26 | — | — | EP | disclosed |
| US-6507049-B1 | Encapsulants for solid state devices | GENERAL ELECTRIC COMPANY | 2003-01-14 | — | — | US | disclosed |
| US-5145889-A | For light-emitting diodes | KABUSHIKI KAISHA TOSHIBA (JP) | 1992-09-08 | — | — | US | disclosed |