SCHEMBL1127740

SCHEMBL1127740

O=C(c1[c]c2ccccc2cc1)c1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.46
CNR2 P34972 1/20 0.43
TDP1 Q9NUW8 2/20 0.41
L3MBTL1 Q9Y468 2/20 0.41
ATM Q13315 1/20 0.41
SRD5A2 P31213 1/20 0.41
MEN1 O00255 5/20 0.40
KMT2A Q03164 5/20 0.40
RAB9A P51151 4/20 0.40
NPC1 O15118 3/20 0.40
TSHR P16473 2/20 0.39
MAPK1 P28482 1/20 0.39
AKR1C3 P42330 1/20 0.38
CES2 O00748 2/20 0.37
CES1 P23141 2/20 0.37
DAO P14920 1/20 0.37
NAPRT Q6XQN6 1/20 0.37
MAPT P10636 3/20 0.36
LMNA P02545 1/20 0.36
GAA P10253 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1127619 0.84 MEN1 (0.44) ALDH1A1CNR2TDP1L3MBTL1ATM
SCHEMBL3241728 0.82 MAP2K1 (0.48) ALDH1A1TDP1L3MBTL1MEN1KMT2A
SCHEMBL49732 0.82 MGAM (0.42) ALDH1A1TDP1SRD5A2MEN1KMT2A
SCHEMBL1181527 0.81 PARP1 (0.41) ALDH1A1TDP1L3MBTL1TSHRCES2
SCHEMBL758982 0.77 ALDH1A1 (0.38) ALDH1A1MEN1KMT2ARAB9ANPC1
SCHEMBL4719409 0.76 CDC25B (0.51) CNR2TDP1L3MBTL1MEN1KMT2A
SCHEMBL11480752 0.76 ALDH1A1 (0.40) ALDH1A1L3MBTL1MEN1KMT2ANPC1
SCHEMBL1452098 0.76 ALDH1A1 (0.59) ALDH1A1TDP1L3MBTL1ATMSRD5A2
SCHEMBL8757247 0.74 RAB9A (0.47) ALDH1A1MEN1KMT2ARAB9ANPC1
SCHEMBL3251538 0.74 IDO1 (0.43) ALDH1A1L3MBTL1SRD5A2MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 85 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2589625-B1 THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR SEALING MATERIAL, PREPREG, PRINTED CIRCUIT BOARD, AND BUILD-UP FILM DAINIPPON INK & CHEMICALS (JP) 2016-10-26 EP claimed
US-8669333-B2 Thermosetting resin composition, cured product thereof, active ester resin, semiconductor encapsulating material, prepreg, circuit board, and build-up film DIC CORPORATION (JP) 2014-03-11 US claimed
EP-2589625-A1 THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR SEALING MATERIAL, PREPREG, PRINTED CIRCUIT BOARD, AND BUILD-UP FILM DIC Corporation (JP) 2013-05-08 EP claimed
US-20130101857-A1 THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR ENCAPSULATING MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM DIC CORPORATION (JP) 2013-04-25 US claimed
EP-0966456-B1 TAXOID REVERSAL AGENTS FOR DRUG-RESISTANCE IN CANCER CHEMOTHERAPY AND PHARMACEUTICAL COMPOSITIONS THEREOF UNIV NEW YORK STATE RES FOUND (US) 2003-04-02 EP claimed
EP-0966456-A4 TAXOID REVERSAL AGENTS FOR DRUG-RESISTANCE IN CANCER CHEMOTHERAPY AND PHARMACEUTICAL COMPOSITIONS THEREOF RES FOUNDATION OF (US) 2000-07-26 EP claimed
EP-0966456-A1 TAXOID REVERSAL AGENTS FOR DRUG-RESISTANCE IN CANCER CHEMOTHERAPY AND PHARMACEUTICAL COMPOSITIONS THEREOF THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK (US) 1999-12-29 EP claimed
US-5811452-A ADMINISTERING WITH PACLITAXEL OR DOXORUBICIN THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK (US) 1998-09-22 US claimed
WO-1998030553-A1 TAXOID REVERSAL AGENTS FOR DRUG-RESISTANCE IN CANCER CHEMOTHERAPY AND PHARMACEUTICAL COMPOSITIONS THEREOF THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK (US) 1998-07-16 WO claimed
US-20240045330-A1 NEGATIVE PHOTOSENSITIVE COMPOSITION AND PATTERN FORMATION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-08 US disclosed
CN-117420731-A Negative photosensitive composition and pattern forming method 东京应化工业株式会社 2024-01-19 CN disclosed
CN-113286781-B Sulfonium salt, photoacid generator, curable composition, and resist composition 三亚普罗股份有限公司 2023-08-08 CN disclosed
US-20230236505-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND LAMINATED FILM SAN-APRO LTD. (JP) 2023-07-27 US disclosed
CN-116018558-A Negative photosensitive resin composition, pattern forming method and laminated film 三亚普罗股份有限公司 2023-04-25 CN disclosed
WO-1997021664-A1 NAPHTHYL ACETAMIDES AS sPLA2 INHIBITORS ELI LILLY AND COMPANY (US) 1997-06-19 WO disclosed
EP-0779271-A1 Naphthyl acetamides as sPLA2 inhibitors ELI LILLY AND COMPANY (US) 1997-06-18 EP disclosed
US-5614521-A NERVE GROWTH FACTOR SANKYO COMPANY, LIMITED (JP) 1997-03-25 US disclosed
EP-0501656-B1 New benzene derivatives having (NGF) production-promoting activity SANKYO CO (JP) 1997-01-22 EP disclosed
CN-1064273-A The new NGF that has generates the active benzene derivative of promotion SANKYO CO (JP) 1992-09-09 CN disclosed
EP-0501656-A2 New benzene derivatives having (NGF) production-promoting activity Sankyo Company Limited (JP) 1992-09-02 EP disclosed