⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL927904 | 0.77 | NPC1 (0.32) | — | |
| SCHEMBL928946 | 0.76 | CA2 (0.38) | — | |
| SCHEMBL5666637 | 0.75 | NPC1 (0.30) | — | |
| SCHEMBL13836864 | 0.70 | — | — | |
| SCHEMBL27820865 | 0.69 | — | — | |
| SCHEMBL31190020 | 0.67 | CA2 (0.41) | — | |
| SCHEMBL2023253 | 0.67 | FAAH (0.30) | — | |
| SCHEMBL4828508 | 0.64 | — | — | |
| SCHEMBL6761679 | 0.62 | — | — | |
| SCHEMBL16829660 | 0.61 | ALDH1A1 (0.52) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 114 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4664197-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-12-17 | — | — | EP | disclosed |
| EP-3263626-B1 | SILICONE SKELETON-CONTAINING POLYMER, PHOTO-CURABLE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM, LAMINATE, AND PATTERNING PROCESS | SHINETSU CHEMICAL CO (JP) | 2024-03-13 | — | — | EP | disclosed |
| EP-3382453-B1 | RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM | SHINETSU CHEMICAL CO (JP) | 2023-09-20 | — | — | EP | disclosed |
| US-20210165327-A1 | FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-06-03 | — | — | US | disclosed |
| US-20210055651-A1 | OPTICAL COMPONENT FORMING COMPOSITION AND CURED PRODUCT THEREOF | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-02-25 | — | — | US | disclosed |
| EP-3235803-B1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | SHINETSU CHEMICAL CO (JP) | 2020-06-03 | — | — | EP | disclosed |
| US-10457779-B2 | Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-10-29 | — | — | US | disclosed |
| US-10451970-B2 | Silicone skeleton-containing polymer, photo-curable resin composition, photo-curable dry film, laminate, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-10-22 | — | — | US | disclosed |
| US-10416563-B2 | Resist underlayer film composition, patterning process, and method for forming resist underlayer film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-09-17 | — | — | US | disclosed |
| EP-3103831-B1 | PHOTO-CURABLE RESIN COMPOSITION AND PHOTO-CURABLE DRY FILM USING THE SAME | SHINETSU CHEMICAL CO (JP) | 2019-09-04 | — | — | EP | disclosed |
| US-6566037-B2 | A polymer with monomers of a robust alicyclic structure having both polar and acid labile groups; resist composition of improved reactivity, substrate adhesion and etching resistance | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-20 | — | — | US | disclosed |
| US-20030088115-A1 | Novel ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-08 | — | — | US | disclosed |
| US-20020147290-A1 | Cyclic acetal compound, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-10-10 | — | — | US | disclosed |
| US-20020004178-A1 | Novel ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-01-10 | — | — | US | disclosed |
| US-20010026904-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-04 | — | — | US | disclosed |
| US-20010010890-A1 | Polymers, chemical amplification resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-08-02 | — | — | US | disclosed |
| US-6180313-B1 | SUITABLE AS RADIATION-SENSITIVE ACID-GENERATING AGENT; PHOTORESISTS FOR USE IN PHOTOLITHOGRAPHY | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-01-30 | — | — | US | disclosed |
| US-6171749-B1 | COMPRISING ALKALI-SOLUBLE RESIN, RADIATION-SENSITIVE ACID GENERATING AGENT AND CROSS-LINKING AGENT; CHARACTERISTICALLY, THE ACID GENERATING AGENT IS A COMBINATION OF A HALOGENOACID GENERATING COMPOUND AND A BIS(ALKYLSULFONYL) DIAZOMETHANE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-01-09 | — | — | US | disclosed |
| US-6156481-A | WITH HYDROXYSTYRENE-(METH)ACRYLIC ACID OR (METH)ACRYLATE COPOLYMER WHERE SOME PHENOLIC HYDROXYL GROUPS ARE CROSSLINKED WITH ETHER CONTAINING ACID LABILE GROUPS; DISSOLUTION INHIBITION AND INCREASED DISSOLUTION CONTRAST AFTER EXPOSURE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-12-05 | — | — | US | disclosed |
| US-6153733-A | (Disulfonyl diazomethane compounds) | TOKYO OHKA KOGYO CO., LTD. (JP) | 2000-11-28 | — | — | US | disclosed |