SCHEMBL928946

SCHEMBL928946

CCCCCS(=O)(=O)C(CCCC)S(=O)(=O)C=[N+]=[N-]

nearest known ligand 0.38

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
CA2 P00918 5/20 0.38
FAAH O00519 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL927904 0.89 NPC1 (0.32) CA2
SCHEMBL17688495 0.71 NPC1 (0.45) CA2FAAH
SCHEMBL8357995 0.70 FAAH (0.45) CA2FAAH
SCHEMBL27508414 0.70 FAAH (0.45) CA2FAAH
SCHEMBL7846186 0.66 CA2 (0.46) CA2FAAH
SCHEMBL16829660 0.65 ALDH1A1 (0.52) CA2FAAH
SCHEMBL14381329 0.65 MMP1 (0.35)
SCHEMBL7740349 0.64 CA2 (0.57) CA2FAAH
SCHEMBL11566341 0.64 CA2 (0.52) CA2FAAH
SCHEMBL9464587 0.64 CA2 (0.47) CA2FAAH

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 69 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3263626-B1 SILICONE SKELETON-CONTAINING POLYMER, PHOTO-CURABLE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM, LAMINATE, AND PATTERNING PROCESS SHINETSU CHEMICAL CO (JP) 2024-03-13 EP disclosed
EP-3382453-B1 RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM SHINETSU CHEMICAL CO (JP) 2023-09-20 EP disclosed
US-10457779-B2 Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-10-29 US disclosed
US-10451970-B2 Silicone skeleton-containing polymer, photo-curable resin composition, photo-curable dry film, laminate, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-10-22 US disclosed
US-10416563-B2 Resist underlayer film composition, patterning process, and method for forming resist underlayer film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-09-17 US disclosed
EP-3103831-B1 PHOTO-CURABLE RESIN COMPOSITION AND PHOTO-CURABLE DRY FILM USING THE SAME SHINETSU CHEMICAL CO (JP) 2019-09-04 EP disclosed
EP-3382454-B1 RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM SHINETSU CHEMICAL CO (JP) 2019-07-24 EP disclosed
EP-3275857-B1 TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM SHINETSU CHEMICAL CO (JP) 2019-06-05 EP disclosed
US-10241412-B2 Resist underlayer film composition, patterning process, and method for forming resist underlayer film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-03-26 US disclosed
US-20180284615-A1 RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-10-04 US disclosed
US-20050079446-A1 Novel polymerizable compound, polymer, positive-resist composition, and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2005-04-14 US disclosed
US-20040259037-A1 Resist lower layer film material and method for forming a pattern SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-12-23 US disclosed
US-6730451-B2 FLUOROACRYLATE POLYMERS; TRANSPARENCY; PREVENTING NEGATIVE WORKING; LOW ABSORPTION OF FLUORINE EXCIMER LASER LIGHT; HIGH TRANSMITTANCE TO VACUUM ULTRAVIOLET RADITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-05-04 US disclosed
US-6670498-B2 Norbornene and dimethanonaphthalenes substituted with a branched or cyclic tertiary alkoxycarbonyl hydrocarbyleneoxycarbonyl group SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-12-30 US disclosed
US-6566037-B2 A polymer with monomers of a robust alicyclic structure having both polar and acid labile groups; resist composition of improved reactivity, substrate adhesion and etching resistance SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-05-20 US disclosed
US-20030088115-A1 Novel ester compounds, polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-05-08 US disclosed
US-20020004178-A1 Novel ester compounds, polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-01-10 US disclosed
US-20010026904-A1 Polymer, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-04 US disclosed
US-20010010890-A1 Polymers, chemical amplification resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-08-02 US disclosed
US-6156481-A WITH HYDROXYSTYRENE-(METH)ACRYLIC ACID OR (METH)ACRYLATE COPOLYMER WHERE SOME PHENOLIC HYDROXYL GROUPS ARE CROSSLINKED WITH ETHER CONTAINING ACID LABILE GROUPS; DISSOLUTION INHIBITION AND INCREASED DISSOLUTION CONTRAST AFTER EXPOSURE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-12-05 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180284615-A1 RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM GPX4, PLOD1, AQP1 CA2 2609/4885FAAH 3069/4885
US-10416563-B2 Resist underlayer film composition, patterning process, and method for forming resist underlayer film PRDX1, PRDX4, QSOX1 CA2 1091/4885FAAH 3088/4885
US-10457779-B2 Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film ARCN1, COL1A1, F12 CA2 1663/4885FAAH 2979/4885
US-20030088115-A1 Novel ester compounds, polymers, resist compositions and patterning process RER1, ARCN1, H1-0 CA2 3349/4885FAAH 1512/4885
US-10241412-B2 Resist underlayer film composition, patterning process, and method for forming resist underlayer film GPX4, PLOD1, AQP1 CA2 2609/4885FAAH 3069/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.