SCHEMBL1152586

SCHEMBL1152586

CC(=O)OC(OCCOc1ccccc1CC(=O)O)C(=O)c1ccccc1

nearest known ligand 0.45

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 1/20 0.45
ALDH1A1 P00352 1/20 0.44
CYP3A4 P08684 1/20 0.44
CXCL8 P10145 2/20 0.39
PPARG P37231 11/20 0.39
LTB4R Q15722 1/20 0.39
CFD P00746 2/20 0.38
F11 P03951 2/20 0.38
TPSB2 P20231 2/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
PLG P00747 1/20 0.37
PLAU P00749 1/20 0.37
KLKB1 P03952 1/20 0.37
F7 P08709 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28382844 0.84 ALDH1A1 (0.47) L3MBTL1ALDH1A1CYP3A4SMN1; SMN2
SCHEMBL21268099 0.84 ALDH1A1 (0.47) L3MBTL1ALDH1A1CYP3A4CXCL8CFD
SCHEMBL28914292 0.83 ALDH1A1 (0.54) L3MBTL1ALDH1A1CYP3A4SMN1; SMN2
SCHEMBL22472238 0.78 ALDH1A1 (0.54) L3MBTL1ALDH1A1CYP3A4SMN1; SMN2
SCHEMBL3175900 0.78 ALDH1A1 (0.43) ALDH1A1CYP3A4SMN1; SMN2
SCHEMBL1853657 0.76 ALDH1A1 (0.41) L3MBTL1ALDH1A1CYP3A4CXCL8LTB4R
SCHEMBL1978808 0.74 ALDH1A1 (0.47) L3MBTL1ALDH1A1CYP3A4SMN1; SMN2
SCHEMBL28332904 0.74 ALDH1A1 (0.49) ALDH1A1CYP3A4SMN1; SMN2
SCHEMBL18301818 0.73 L3MBTL1 (0.55) L3MBTL1CXCL8PPARGLTB4RCFD
SCHEMBL156451 0.72 ALDH1A1 (0.65) L3MBTL1ALDH1A1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8632952-B2 Photosensitive resin composition, photosensitive resin cured matter, photosensitive resin film, photosensitive resin film cured matter and optical waveguide obtained by using the same HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-01-21 US claimed
US-8604096-B2 Photosensitive resin composition, photosensitive resin varnish, photosensitive resin film, and photosensitive resin cured product HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-12-10 US claimed
US-20120270963-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN VARNISH, PHOTOSENSITIVE RESIN FILM, AND PHOTOSENSITIVE RESIN CURED PRODUCT HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-10-25 US claimed
EP-2182410-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PHOTOSENSITIVE RESIN PRODUCT, PHOTOSENSITIVE RESIN FILM, CURED PHOTOSENSITIVE RESIN FILM PRODUCT, AND OPTICAL WAVEGUIDE PRODUCED BY USING THOSE PRODUCTS Hitachi Chemical Company, Ltd. (JP) 2010-05-05 EP claimed
US-20100027950-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN CURED MATTER, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE RESIN FILM CURED MATTER AND OPTICAL WAVEGUIDE OBTAINED BY USING THE SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-02-04 US claimed
US-20240092806-A1 BORON-CONTAINING COMPOUND AND ELECTROLYTE ADDITIVE FOR SECONDARY BATTERY CONTAINING THE SAME SK ON CO LTD (KR) 2024-03-21 US disclosed
US-11851448-B2 Boron-containing compound and electrolyte additive for secondary battery containing the same SK ON CO., LTD. (KR) 2023-12-26 US disclosed
US-20230314664-A1 LAMINATION FILM FOR LIQUID CRYSTAL POLARIZING MEMBRANE, SURFACE PROTECTION FILM FOR LIQUID CRYSTAL POLARIZING MEMBRANE, LAMINATE PROVIDED WITH LIQUID CRYSTAL POLARIZING MEMBRANE, AND IMAGE DISPLAY APPARATUS INCLUDING LIQUID CRYSTAL POLARIZING MEMBRANE MITSUBISHI CHEMICAL CORPORATION (JP) 2023-10-05 US disclosed
US-20230210728-A1 ENERGY RAY-CURABLE COATING MATERIAL FOR THREE-DIMENSIONAL SHAPED ARTICLES, ENERGY RAY-CURABLE MATERIAL KIT FOR THREE-DIMENSIONAL SHAPING INCLUDING SAME, THREE-DIMENSIONAL SHAPED ARTICLE USING SAME, AND METHOD OF PRODUCTION THEREOF KURARAY NORITAKE DENTAL INC. (JP) 2023-07-06 US disclosed
US-20230197630-A1 METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, RESIN COMPOSITION FOR TEMPORARY PROTECTION, AND RESIN FILM FOR TEMPORARY PROTECTION RESONAC CORPORATION (JP) 2023-06-22 US disclosed
US-20230174557-A1 BORON-CONTAINING COMPOUND AND ELECTROLYTE ADDITIVE FOR SECONDARY BATTERY CONTAINING THE SAME SK ON CO., LTD. (KR) 2023-06-08 US disclosed
EP-4190792-A1 BORON-CONTAINING COMPOUND AND ELECTROLYTE ADDITIVE FOR SECONDARY BATTERY CONTAINING THE SAME SK On Co., Ltd. (KR) 2023-06-07 EP disclosed
EP-2239603-A1 RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM Hitachi Chemical Company, Ltd. (JP) 2010-10-13 EP disclosed
US-20100252184-A1 METHOD FOR PRODUCING CARBON NANOTUBE-CONTAINING CONDUCTOR MEIJYO NANO CARBON CO., LTD. (JP) 2010-10-07 US disclosed
US-20100209042-A1 METHOD FOR MANUFACTURING OPTICAL WAVEGUIDE AND OPTICAL WAVEGUIDE MANUFACTURED BY THE METHOD HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-08-19 US disclosed
EP-2189826-A1 METHOD FOR MANUFACTURING OPTICAL WAVEGUIDE AND OPTICAL WAVEGUIDE MANUFACTURED BY THE METHOD Hitachi Chemical Company, Ltd. (JP) 2010-05-26 EP disclosed
EP-2182410-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PHOTOSENSITIVE RESIN PRODUCT, PHOTOSENSITIVE RESIN FILM, CURED PHOTOSENSITIVE RESIN FILM PRODUCT, AND OPTICAL WAVEGUIDE PRODUCED BY USING THOSE PRODUCTS Hitachi Chemical Company, Ltd. (JP) 2010-05-05 EP disclosed
EP-2182410-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PHOTOSENSITIVE RESIN PRODUCT, PHOTOSENSITIVE RESIN FILM, CURED PHOTOSENSITIVE RESIN FILM PRODUCT, AND OPTICAL WAVEGUIDE PRODUCED BY USING THOSE PRODUCTS Hitachi Chemical Company, Ltd. (JP) 2010-05-05 EP disclosed
US-20100027950-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN CURED MATTER, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE RESIN FILM CURED MATTER AND OPTICAL WAVEGUIDE OBTAINED BY USING THE SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-02-04 US disclosed
US-20100027950-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN CURED MATTER, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE RESIN FILM CURED MATTER AND OPTICAL WAVEGUIDE OBTAINED BY USING THE SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-02-04 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20230210728-A1 ENERGY RAY-CURABLE COATING MATERIAL FOR THREE-DIMENSIONAL SHAPED ARTICLES, ENERGY RAY-CURABLE MATERIAL KIT FOR THREE-DIMENSIONAL SHAPING INCLUDING SAME, THREE-DIMENSIONAL SHAPED ARTICLE USING SAME, AND METHOD OF PRODUCTION THEREOF KIT, SETD7, SETDB1 L3MBTL1 4390/4885ALDH1A1 3498/4885CYP3A4 4304/4885
US-20230174557-A1 BORON-CONTAINING COMPOUND AND ELECTROLYTE ADDITIVE FOR SECONDARY BATTERY CONTAINING THE SAME BROX, BLM, TERT L3MBTL1 295/4885ALDH1A1 2061/4885CYP3A4 4576/4885
US-11851448-B2 Boron-containing compound and electrolyte additive for secondary battery containing the same BROX, BLM, TERT L3MBTL1 295/4885ALDH1A1 2061/4885CYP3A4 4576/4885
US-20240092806-A1 BORON-CONTAINING COMPOUND AND ELECTROLYTE ADDITIVE FOR SECONDARY BATTERY CONTAINING THE SAME BROX, BLM, TERT L3MBTL1 295/4885ALDH1A1 2061/4885CYP3A4 4576/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.