Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 1/20 | 0.32 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.32 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL49787 | 0.91 | CYP1A2 (0.31) | CYP1A2CYP3A4MAPTKMT2A | |
| SCHEMBL50100 | 0.80 | CYP1A2 (0.43) | CYP1A2CYP3A4MAPTKMT2A | |
| Ammonia Solution, Strong SCHEMBL8665916 | 0.78 | CYP1A2 (0.42) | CYP1A2CYP3A4MAPTKMT2A | |
| SCHEMBL7572908 | 0.78 | HTR1B (0.36) | CYP1A2 | |
| SCHEMBL4457503 | 0.78 | GAA (0.33) | KMT2A | |
| Trimethylammonium SCHEMBL5191404 | 0.77 | CYP1A2 (0.39) | CYP1A2MAPTKMT2A | |
| Iodide SCHEMBL21834093 | 0.72 | THRA (0.35) | — | |
| SCHEMBL16990771 | 0.71 | CYP1A2 (0.36) | CYP1A2CYP3A4 | |
| Iodide SCHEMBL21808443 | 0.71 | ERBB2 (0.33) | CYP1A2 | |
| SCHEMBL5183901 | 0.70 | GAA (0.33) | KMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 98 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5183592-A | Excellent in reliability in moisture and hydrolytic resistance ; useful for semiconductor devices | HITACHI CHEMICAL COMPANY LTD. (JP) | 1993-02-02 | — | — | US | claimed |
| CN-114402049-B | Support tape for transporting substrate and method for manufacturing electronic device | 株式会社力森诺科 | 2023-08-08 | — | — | CN | disclosed |
| US-20220010072-A1 | FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2022-01-13 | — | — | US | disclosed |
| US-20210070683-A1 | COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD AND CIRCUIT PATTERN FORMATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-03-11 | — | — | US | disclosed |
| US-20210070685-A1 | COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD AND CIRCUIT PATTERN FORMATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-03-11 | — | — | US | disclosed |
| US-20210047457-A1 | COMPOUND, RESIN, COMPOSITION AND PATTERN FORMATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-02-18 | — | — | US | disclosed |
| US-20210003921-A1 | COMPOUND, RESIN, COMPOSITION, AND FILM FORMING MATERIAL FOR LITHOGRAPHY USING THE SAME | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-01-07 | — | — | US | disclosed |
| EP-3760611-A1 | COMPOUND, RESIN, COMPOSITION AND FILM-FORMING MATERIAL FOR LITHOGRAPHY USING SAME | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-01-06 | — | — | EP | disclosed |
| EP-3744710-A1 | COMPOUND, RESIN, COMPOSITION, AND PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-12-02 | — | — | EP | disclosed |
| US-20200354501-A1 | COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, FILM FOR LITHOGRAPHY, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING CIRCUIT PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-11-12 | — | — | US | disclosed |
| CN-101218539-A | Photosensitive adhesive composition, and adhesive film, adhesive sheet, adhesive layer-attached semiconductor wafer, semiconductor device, and electronic component obtained using same | HITACHI CHEMICAL CO LTD (JP) | 2008-07-09 | — | — | CN | disclosed |
| CN-1950475-A | Resin paste for die bonding | HITACHI CHEMICAL CO LTD (JP) | 2007-04-18 | — | — | CN | disclosed |
| CN-1950935-A | Resin adhesive for die bonding | HITACHI CHEMICAL CO LTD (JP) | 2007-04-18 | — | — | CN | disclosed |
| US-6905768-B2 | Crosslinked, encapsulated mixture for electronics; heat resistance, waterproofing, impact strength | OTSUKA CHEMICAL CO., LTD. (JP) | 2005-06-14 | — | — | US | disclosed |
| US-20040247907-A1 | Polyimide-metal layered products and polyamideimide-metal layered product | ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) | 2004-12-09 | — | — | US | disclosed |
| EP-1270668-B1 | EPOXY RESIN COMPOSITION AND ELECTRONIC PART | OTSUKA CHEMICAL CO LTD (JP) | 2004-04-21 | — | — | EP | disclosed |
| US-20030153650-A1 | Epoxy resin, a phenolic hydroxyl group-containng compound, a urea resin and a melamine resin, a crosslinked phenoxy phosphazene compound, and an inorganic filler | OTSUKA CHEMICAL CO., LTD. (JP) | 2003-08-14 | — | — | US | disclosed |
| EP-1270668-A1 | EPOXY RESIN COMPOSITION AND ELECTRONIC PART | Otsuka Chemical Co., Ltd. (JP) | 2003-01-02 | — | — | EP | disclosed |
| US-6441106-B1 | CURING AGENT FOR EPOXY RESIN COMPRISING A SILOXANE-MODIFIED PHENOLIC RESIN OBTAINED BY DEALCOHOLIZATION CONDENSATION BETWEEN A PHENOLIC RESIN AND A HYDROLYZABLE ALKOXYSILANE SUCH AS A POLYSILICATE | ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) | 2002-08-27 | — | — | US | disclosed |
| US-5183592-A | Excellent in reliability in moisture and hydrolytic resistance ; useful for semiconductor devices | HITACHI CHEMICAL COMPANY LTD. (JP) | 1993-02-02 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20210070683-A1 | COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD AND CIRCUIT PATTERN FORMATION METHOD | RER1, RTN4, FEM1B | CYP1A2 2853/4885CYP3A4 2950/4885MAPT 3497/4885 |
| US-20210003921-A1 | COMPOUND, RESIN, COMPOSITION, AND FILM FORMING MATERIAL FOR LITHOGRAPHY USING THE SAME | COL1A1, MLLT3, F12 | CYP1A2 857/4885CYP3A4 2620/4885MAPT 2695/4885 |
| US-20210070685-A1 | COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD AND CIRCUIT PATTERN FORMATION METHOD | RER1, RTN4, FEM1B | CYP1A2 2853/4885CYP3A4 2950/4885MAPT 3497/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.