SCHEMBL1218438

SCHEMBL1218438

C=C(C)C(=O)OC1(C)C2CC3(O)CC1CC(O)(C2)C3

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3305006 0.84 ALDH1A1 (0.34) ALDH1A1
SCHEMBL1143590 0.82 HSD11B1 (0.33) ALDH1A1
SCHEMBL1216629 0.80 THRB (0.35) ALDH1A1
SCHEMBL13900363 0.80 ALDH1A1 (0.39) ALDH1A1
SCHEMBL5856204 0.77 CYP17A1 (0.32)
SCHEMBL44331 0.75 CYP17A1 (0.40) ALDH1A1
SCHEMBL686026 0.75 ALDH1A1 (0.32) ALDH1A1
SCHEMBL20280742 0.73 ALDH1A1 (0.31) ALDH1A1
SCHEMBL1216334 0.73
SCHEMBL681673 0.72 ALDH1A1 (0.33) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20110040056-A1 PROCESS FOR PRODUCTION OF POLYMER DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2011-02-17 US disclosed
EP-1676869-B1 PHOTORESIST RESIN AND PHOTORESIST RESIN COMPOSITION DAICEL CHEM (JP) 2009-10-14 EP disclosed
US-7407733-B2 Polymeric compound containing a repeated unit having a 2-oxatricyclo [4.2.1.04,8] nonan-3-one ring and photoresist resin composition DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2008-08-05 US disclosed
US-20060281022-A1 Polymeric compound containing a repeated unit having a 2-oxatricyclo [4.2.1.0 4.8] nonan-3-one ring and photoresist resin composition DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2006-12-14 US disclosed
US-7105268-B2 Polymer for photoresist and resin compositions therefor DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2006-09-12 US disclosed
EP-1681307-A1 POLYMERIC COMPOUND CONTAINING REPEATING UNIT HAVING 2-OXATRICYCLO[4.2.1.04,8]NONAN-3-ONE RING, AND PHOTORESIST RESIN COMPOSITION Daicel Chemical Industries, Ltd. (JP) 2006-07-19 EP disclosed
EP-1676869-A1 PHOTORESIST RESIN AND PHOTORESIST RESIN COMPOSITION Daicel Chemical Industries, Ltd. (JP) 2006-07-05 EP disclosed
US-7033726-B2 Photoresist polymeric compound and photoresist resin composition DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2006-04-25 US disclosed
US-20050238990-A1 Photoresist resin and photoresist resin composition DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-10-27 US disclosed
EP-1584634-A1 POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST Daicel Chemical Industries, Ltd. (JP) 2005-10-12 EP disclosed
US-6806335-B2 FOR USE IN FINE PATTERNING OF SEMICONDUCTORS DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2004-10-19 US disclosed
US-6692889-B1 COPOLYMERS CONTAINING DERIVATIZED ADAMANTANYL ACRYLATE FUNCTIONALITY; ETCHING RESISTANCE DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2004-02-17 US disclosed
US-20040006189-A1 Polymeric compound and resin composition for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. 2004-01-08 US disclosed
EP-1354897-A1 POLYMER FOR PHOTORESIST AND RESIN COMPOSITIONS THEREFOR Daicel Chemical Industries, Ltd. (JP) 2003-10-22 EP disclosed
US-20030148210-A1 Polymer for photoresist and resin compositions therefor DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-08-07 US disclosed
US-6552143-B2 Addition polymer including units of 1-oxo-perhydro-5,6-didehydro-4,7-methanoisobenzofuran; making a semiconductor using the photoresist; high adhesion, fine patterns DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-04-22 US disclosed
US-20020169266-A1 Polymeric compound and resin composition for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2002-11-14 US disclosed
US-6440636-B1 HIGH ETCHING RESISTANCE, TRANSPARENCY, ALKALI SOLUBILITY, AND ADHESION; ACRYLIC ESTERS HAVING ADAMANTANE GROUP KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-27 US disclosed
EP-1172694-A1 POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST Daicel Chemical Industries, Ltd. (JP) 2002-01-16 EP disclosed
EP-1172384-A1 POLYMER FOR PHOTORESISTS AND RESIN COMPOSITIONS FOR PHOTORESISTS Daicel Chemical Industries, Ltd. (JP) 2002-01-16 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20030148210-A1 Polymer for photoresist and resin compositions therefor LCP1, DOT1L, PRMT1 ALDH1A1 1006/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.