⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1218496 | 0.82 | HSD11B1 (0.32) | — | |
| SCHEMBL677901 | 0.81 | GLA (0.32) | — | |
| SCHEMBL6742826 | 0.81 | HSD11B1 (0.31) | — | |
| SCHEMBL1143590 | 0.76 | HSD11B1 (0.33) | — | |
| SCHEMBL41045 | 0.74 | PKM (0.37) | — | |
| SCHEMBL13383446 | 0.74 | PKM (0.37) | — | |
| SCHEMBL15281467 | 0.74 | PKM (0.37) | — | |
| SCHEMBL5856204 | 0.74 | CYP17A1 (0.32) | — | |
| SCHEMBL1218438 | 0.73 | ALDH1A1 (0.33) | — | |
| SCHEMBL1219048 | 0.73 | ALDH1A1 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20110040056-A1 | PROCESS FOR PRODUCTION OF POLYMER | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2011-02-17 | — | — | US | disclosed |
| EP-1676869-B1 | PHOTORESIST RESIN AND PHOTORESIST RESIN COMPOSITION | DAICEL CHEM (JP) | 2009-10-14 | — | — | EP | disclosed |
| US-7407733-B2 | Polymeric compound containing a repeated unit having a 2-oxatricyclo [4.2.1.04,8] nonan-3-one ring and photoresist resin composition | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2008-08-05 | — | — | US | disclosed |
| US-20060281022-A1 | Polymeric compound containing a repeated unit having a 2-oxatricyclo [4.2.1.0 4.8] nonan-3-one ring and photoresist resin composition | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2006-12-14 | — | — | US | disclosed |
| US-7105268-B2 | Polymer for photoresist and resin compositions therefor | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2006-09-12 | — | — | US | disclosed |
| EP-1681307-A1 | POLYMERIC COMPOUND CONTAINING REPEATING UNIT HAVING 2-OXATRICYCLO[4.2.1.04,8]NONAN-3-ONE RING, AND PHOTORESIST RESIN COMPOSITION | Daicel Chemical Industries, Ltd. (JP) | 2006-07-19 | — | — | EP | disclosed |
| EP-1676869-A1 | PHOTORESIST RESIN AND PHOTORESIST RESIN COMPOSITION | Daicel Chemical Industries, Ltd. (JP) | 2006-07-05 | — | — | EP | disclosed |
| US-7033726-B2 | Photoresist polymeric compound and photoresist resin composition | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2006-04-25 | — | — | US | disclosed |
| US-20050238990-A1 | Photoresist resin and photoresist resin composition | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2005-10-27 | — | — | US | disclosed |
| EP-1584634-A1 | POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST | Daicel Chemical Industries, Ltd. (JP) | 2005-10-12 | — | — | EP | disclosed |
| US-6806335-B2 | FOR USE IN FINE PATTERNING OF SEMICONDUCTORS | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2004-10-19 | — | — | US | disclosed |
| US-6692889-B1 | COPOLYMERS CONTAINING DERIVATIZED ADAMANTANYL ACRYLATE FUNCTIONALITY; ETCHING RESISTANCE | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2004-02-17 | — | — | US | disclosed |
| US-20040006189-A1 | Polymeric compound and resin composition for photoresist | DAICEL CHEMICAL INDUSTRIES, LTD. | 2004-01-08 | — | — | US | disclosed |
| EP-1354897-A1 | POLYMER FOR PHOTORESIST AND RESIN COMPOSITIONS THEREFOR | Daicel Chemical Industries, Ltd. (JP) | 2003-10-22 | — | — | EP | disclosed |
| US-20030148210-A1 | Polymer for photoresist and resin compositions therefor | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2003-08-07 | — | — | US | disclosed |
| US-6552143-B2 | Addition polymer including units of 1-oxo-perhydro-5,6-didehydro-4,7-methanoisobenzofuran; making a semiconductor using the photoresist; high adhesion, fine patterns | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2003-04-22 | — | — | US | disclosed |
| US-20020169266-A1 | Polymeric compound and resin composition for photoresist | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2002-11-14 | — | — | US | disclosed |
| US-6440636-B1 | HIGH ETCHING RESISTANCE, TRANSPARENCY, ALKALI SOLUBILITY, AND ADHESION; ACRYLIC ESTERS HAVING ADAMANTANE GROUP | KABUSHIKI KAISHA TOSHIBA (JP) | 2002-08-27 | — | — | US | disclosed |
| EP-1172384-A1 | POLYMER FOR PHOTORESISTS AND RESIN COMPOSITIONS FOR PHOTORESISTS | Daicel Chemical Industries, Ltd. (JP) | 2002-01-16 | — | — | EP | disclosed |
| EP-1172694-A1 | POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST | Daicel Chemical Industries, Ltd. (JP) | 2002-01-16 | — | — | EP | disclosed |